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MC500 & MC600 Series

MC510-40

This page also applies to the TM800 ThinManager Ready platform.

Technical Resources

Specification Sheet

OnLogic-MC510-40-Spec-Sheet-V1.pdf
PDF · 248KB
Open

Motherboard

ASRock IMB-V1000M Motherboard

Motherboard Manual

http://download.asrock.com/IPC/Manual/IMB-V1000.pdf

Drivers

https://www.asrockind.com/IMB-V1000

Auto Power On

  1. Power on the unit and press the F2 key to access the BIOS

  2. Navigate to the Advanced tab

  3. Open the Chipset Configuration menu

  4. Change “Restore on AC/Power Loss” to [Power On]

  5. Press F10 to save changes and exit

  6. Auto power on is now enabled

  1. Unplug the system completely from power and all peripherals

  2. Locate the clear CMOS jumper

  1. Move the jumper over by 1 pin

  2. Wait 30 seconds

  3. Restore the jumper to its original position

  4. The CMOS is now clear

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.

MC510-50

Access the official from ASRock. This external link provides access to the complete motherboard manual, along with the latest BIOS updates and specific drivers for your system's motherboard

Warning: Never interrupt a BIOS update. If the update is interrupted, the system may become irreparable. Damage caused as a result of BIOS updates may not be covered by the system's warranty.

You can follow this for installation instructions.

The MC510 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

The following steps will walk you through opening your MC510 case, as well as auto-powering on and clearing CMOS.

Clear CMOS

Security Advisory

Access Security Advisories
The MC510 series chasses can be opened by removing the two screws from the back (indicated in the picture below). Slide the lid off towards the rear of the chassis.

IMB-1212 motherboards manufactured before June 2020 use a different jumper for auto power on. This jumper is not present on the newer boards.

  1. Locate the PWR_JP1 jumper indicated by the orange circle

  2. Move PWR_JP1 over by 1 pin

  3. The unit is now configured for auto power on

  1. Unplug the system completely from power and all peripherals

  2. Locate the clear CMOS jumper

  3. Move the jumper over by 1 pin

  4. Wait 30 seconds

  5. Restore the jumper to its original position

  6. The CMOS is now clear

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories

Technical Resources

Motherboard Manual

Motherboard Layout

BIOS Update

Internal Access

Motherboard manual & OEM Resources
how-to guide

Auto Power On

Auto Power On (older boards)

Clear CMOS

Regulatory

Security Advisory

MC510-50 CE Declaration.pdf
PDF · 60KB
Open
MC510-50 FCC & ISED Declaration.pdf
PDF · 53KB
Open
MC510-50 MTBF Summary.pdf
PDF · 41KB
Open

MC500G-51 / MC600-10 / MC600-11 / MC600-50 / MC600-51 / MC600-52

Technical Resources

Internal Access

The MC600 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

The following steps will walk you through opening your MC600 case, as well as auto-powering on and clearing CMOS.

The case is very simple to open. To do so, remove the two screws from the back and slide the lid off towards the rear.


MC600-10

Motherboard

MC600-10 Manual (1).pdf
PDF · 2MB
Open

Drivers

Click here for Drivers

Auto Power On

  1. Power on the unit and press the Del key to access the BIOS

  2. Navigate to the Chipset tab

  3. Change “Restore AC Power Loss” to [Power On]

  4. Save changes and exit

  5. Auto power on is now enabled

  1. Locate the clear CMOS jumper

  2. Move the jumper over by 1 pin

  3. Wait 30 seconds

  4. Restore the jumper to its original position


Access the official from ASRock. This external link provides access to the complete motherboard manual, along with the latest BIOS updates and specific drivers for your system's motherboard (IMB-156).

Warning: Never interrupt a BIOS update. If the update is interrupted, the system may become irreparable. Damage caused as a result of BIOS updates may not be covered by the system's warranty.

You can follow this for installation instructions.

  1. Locate the PWR_JP1 jumper indicated by the orange circle

  2. Move PWR_JP1 over by 1 pin

  3. The unit is now configured for auto power on

  1. Locate the clear CMOS jumper

  2. Move the jumper over by 1 pin

  3. Wait 30 seconds

  4. Restore the jumper to its original position


  1. Locate the AT/ATX jumper

  2. Move it over by 1 pin

  3. Auto power on is now enabled

  1. Locate the CLRMOS1 jumper

  2. Move the jumper over by 1 pin

  3. Wait 30 seconds

  4. Restore the jumper to its original position


Access the official from ASRock. This external link provides access to the complete motherboard manual, along with the latest BIOS updates and specific drivers for your system's motherboard (E3C226D21).

  1. Power on the unit and press the F2 key to access the BIOS

  2. Navigate to the Advanced tab

  3. Open the South Bridge Configuration menu

  4. Change “Restore on AC/Power Loss” to [Power on]

  1. Locate the CMOS battery

  2. Carefully remove it from the holder

  3. Wait 5 minutes

  4. Reinsert the battery


Access the official from ASRock. This external link provides access to the complete motherboard manual, along with the latest BIOS updates and specific drivers for your system's motherboard (IMB-195).

  1. Locate the AT/ATX jumper

  2. Move it over by 1 pin

  3. Auto power on is now enabled

  1. Locate the CLRMOS1 jumper

  2. Move the jumper over by 1 pin

  3. Wait 30 seconds

  4. Restore the jumper to its original position

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.

The CMOS is now clear

The CMOS is now clear

The CMOS is now clear

  • Save changes and exit from the Exit menu

  • Auto power on is now enabled

  • The CMOS is now clear

    The CMOS is now clear

    Clear CMOS

    MC600-11

    Motherboard

    BIOS

    Auto Power On

    Clear CMOS

    MC600-50

    Motherboard

    Drivers

    Auto Power On

    Clear CMOS

    MC600-51

    Motherboard

    Auto Power On

    Clear CMOS

    MC500G-51 / MC600-52

    Motherboard

    Drivers

    Auto Power On

    Clear CMOS

    Security Advisory

    Motherboard manual & OEM Resources
    how-to guide
    Link to Drivers
    Motherboard manual & OEM Resources
    Link to Drivers
    Motherboard manual & OEM Resources
    Link to Drivers
    Access Security Advisories
    MC600-50 Manual.pdf
    PDF · 712KB
    Open
    MC600-51 Manual.pdf
    PDF · 1MB
    Open
    MC600-52 Manual.pdf
    PDF · 2MB
    Open

    MC601

    Assembling the MC601 4x HotSwap Bay Case

    • Remove the existing front plate from the case and install the new front plate in its place.

    • Remove the hard drive tray and PCIe riser bracket

    • Remove these 5MM standoffs and lift the case so the screws fall out from the bottom. Set screws aside for later.

    • Bend tray at marked line until parts separate

    • Install hotswap bays to bracket using the included screws

    • Install tray in system

    • Install the 2nd half of the bracket as shown

    • Using the screws from the standoffs removed previously (or spares from the accessory box), install screws up through the bottom of the case to hold the bracket in place

    • Connect SATA cables

    MC510-10 / MC610-10 / MC610-50

    This page also applies to the TM610 ThinManager Ready platform.

    Technical Resources

    Internal Access

    The MC610 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

    The following steps will walk you through opening your MC610 case, as well as auto-powering on and clearing CMOS.

    The case is very simple to open. To do so, remove the two screws from the back and slide the lid off towards the rear.

    MC510-10 / MC610-10

    Motherboard

    Access the official Motherboard manual & OEM Resources from ASRock. This external link provides access to the complete motherboard manual, along with the latest BIOS updates and specific drivers for your system's motherboard (IMB-156).

    BIOS

    Warning: Never interrupt a BIOS update. If the update is interrupted, the system may become irreparable. Damage caused as a result of BIOS updates may not be covered by the system's warranty.

    You can follow this for installation instructions.

    1. Locate the PWR_JP1 jumper indicated by the orange circle

    2. Move PWR_JP1 over by 1 pin

    3. The unit is now configured for auto power on

    1. Locate the clear CMOS jumper

    2. Move the jumper over by 1 pin

    3. Wait 30 seconds

    4. Restore the jumper to its original position


    Access the official from ASRock. This external link provides access to the complete motherboard manual, along with the latest BIOS updates and specific drivers for your system's motherboard (IMB-1212).

    By default, only the Mini DP ports in the expansion bay are enabled. The motherboard’s onboard HDMI and VGA ports can be enabled in the BIOS to support additional displays.

    Warning: Never interrupt a BIOS update. If the update is interrupted, the system may become irreparable. Damage caused as a result of BIOS updates may not be covered by the system's warranty.

    You can follow this for installation instructions.

    1. Locate the PWR_JP1 jumper indicated by the orange circle

    2. Move PWR_JP1 over by 1 pin

    3. The unit is now configured for auto power on

    1. Locate the clear CMOS jumper

    2. Move the jumper over by 1 pin

    3. Wait 30 seconds

    4. Restore the jumper to its original position

    • Begin by removing the top 2 screws from the back of the unit.

    • Slide the lid off towards the back

    • Use a screwdriver to push out the two knockouts shown

    • Grab the knockouts with pliers and twist to remove

    • final result shown

    • Connect the 4 pin plug to the motherboard. It only fits 1 way. Push down gently until it clicks in.

    • Remove the nut and washer from the DC jack.

    • Push the DC jack through the larger of the 2 holes.

    • Install the washer and then the nut onto the DC jack from the outside of the case.

    • Hand tighten.

    • Slide the lid back on and reinstall the two screws

    • Grab the retaining zip tie kit

    • Push the zip tie into the hole

    • Face the ribbed side upward

    • Attach the clip to the power supply’s cable

    • Thread the zip tie through the clip’s hole and snug into place.

    • Use only the newly installed DC barrel jack to power the unit.

    • NEVER connect both power connectors at once.

    Access the official from ASRock. This external link provides access to the complete motherboard manual, along with the latest BIOS updates and specific drivers for your system's motherboard (IMB-1012J-WV).

    Warning: Never interrupt a BIOS update. If the update is interrupted, the system may become irreparable. Damage caused as a result of BIOS updates may not be covered by the system's warranty.

    You can follow this for installation instructions.

    1. Locate the SIO_AT1 (#17) jumper indicated by the orange circle

    2. Move SIO_AT1 over by 1 pin

    3. The unit is now configured for auto power on

    1. Locate the CLRMOS1 (#16) jumper

    2. Move the jumper over by 1 pin

    3. Wait 30 seconds

    4. Restore the jumper to its original position

    For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.

    MC510-55 / MC610-55

    The MC510-55 and MC610-55 deliver reliable industrial computing using Intel® 12th Generation, or 13th Generation performance hybrid processing.

    The system is ideal for real-time decision making in automation applications, with support for up to four simultaneous serial connections.

    For more information on accessories and additional features, visit the MC510-55 or MC610-55 product page:

    The CMOS is now clear

    The CMOS is now clear

    The CMOS is now clear

    Auto Power On

    Clear CMOS

    MC610-50

    Motherboard

    Using multiple displays

    BIOS

    Auto Power On

    Clear CMOS

    DC Jack Installation (TM610)

    IMB-1012J-WV

    Motherboard

    BIOS

    Auto Power On

    Clear CMOS

    Regulatory

    Security Advisory

    how-to guide
    Motherboard manual & OEM Resources
    how-to guide
    Motherboard manual & OEM Resources
    how-to guide
    Access Security Advisories
    MC610-50 OnLogic FCC ISED Declaration.pdf
    PDF · 92KB
    Open
    MC610-50 OnLogic RoHS Declaration - signed.pdf
    PDF · 62KB
    Open
    MC610-50 OnLogic CE Declaration.pdf
    PDF · 73KB
    Open
    Press the Del and F2 keys at startup to access the BIOS.
    
    Navigate to Advanced > Chipset Configuration. Set the following options: 
    
    Primary Graphics Adapter   [Onboard]
    IGPU Multi-Monitor   [Enabled]
    Active LVDS  [Disabled]
    
    Press F10 to Save & Exit. 
    The onboard HDMI/VGA are now used as the primary display ports and all ports are enabled. 
    https://www.onlogic.com/store/mc610-55/
    • 4x Rubber Feet

    • Power cable retention - MC510-55 only

    • Power Supply

    • Extra Screws

    If you purchased additional items such as mounting brackets, power supplies or terminal block connectors, they will be located in the system box or within the outer shipping carton.

    Feature
    MC510-55
    MC610-55

    System Dimensions

    192.6mm x 59.3mm x 199.6mm

    333.7mm x 63.5mm x 199.6mm

    System Weight

    6.2 lbs

    9.8 lbs

    Category
    Certification / Standard

    FCC 47 CFR Part 15 Subpart B (Class A)

    EN 63268-1, CISPR 32/EN 55032, CISPR 35/EN 55035, Radio Equipment Directive (2014/53/EU)

    WEEE Directive (2012/19/EU)

    Radio Specifications when equipped with INT-9260 Wifi/BT (device for indoor use)

    Frequency Bands

    2.4 GHz and 5 GHz bands

    Operating Frequency

    2400 - 2485 MHz

    5150 - 5250 MHz, 5250 - 5350 MHz

    5470 - 5725 MHz, 5725 - 5878 MHz

    Channel Spacing / Bandwidth

    2.4 GHz: 802.11b/g/n; 5 MHz / BT: 1 MHz

    Bandwidth: 20 MHz / 40 MHz

    5 GHz: 802.11a/n/ac: 20, 40, 80, 160 MHz

    RF Output Power

    20 dBm (2400-2485 MHz) IEEE 802.11b/g/n & BT

    10 dBm (2400-2485 MHz) BLE

    23 dBm (5150-5725 MHz) IEEE 802.11a/n/ac

    13.98 dBm (5725-5875 MHz) IEEE 802.11a/n/ac

    Radio Specifications when equipped with Amit MDG100 (EU)

    GPS Receiver

    Operating frequency range: 1559 - 1610 MHz

    GLONASS Receiver

    Operating frequency range: 1559 - 1610 MHz

    BDS Receiver

    Operating frequency range: 1559 - 1610 MHz

    Galileo Receiver

    Operating frequency range: 1559 - 1610 MHz

    The front power button can be used to turn on and off the system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset of the system. The system can be woken by a single press of the power button from any state.

    The LED backlight will indicate the system status. A solid blue light indicates that the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.

    There are two USB 2.0 ports on the front panel of the system. These ports are capable of linking at 0.48Gb/s transfer rates.

    DisplayPort 1 & 2

    The MC510-55/MC610-55 utilizes Intel® Integrated processor graphics that power the onboard DisplayPorts. This means resolutions up to 4096x2304 @ 60Hz are supported on both outputs simultaneously. All ports support Multi-Stream Transport (MST).

    There is one HDMI 2.0b located on the system that can support resolutions up to 4096x2304 @ 60Hz.

    The Intel I225-LM /1226V LAN Port supports up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The H610 chipset in this system does not support AMT/VPro regardless of the SKU of the onboard NIC. The LAN link state is shown by the two LEDs enclosed in the port. The description is included below. **Disclaimer: NICs will come with mixed stock as of 12/2025 with I225s / I226s until stock of I225 motherboards are gone**

    LAN activity light description

    The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2 ports, capable of linking at 10Gb/s transfer rates.

    There are two USB 2.0 ports on the rear panel of the system. These ports are capable of linking at 0.48Gb/s transfer rates.

    Using Realtek ALC897 the system can provide high-performance multi-channel High Definition Audio Codec with Realtek proprietary lossless content protection technology that protects pre-recorded content while still allowing full-rate audio enjoyment.

    The serial ports support RS-232, RS-422, and RS-485 configurations depending on the COM port used. Refer to the BIOS manual in Appendix C for configuration instructions.

    COM DB9 pinout

    The MC510-55 offers a screw-in style lockable DC jack. The DC jack has an outer diameter of 5.5mm, and an inner diameter of 2.5mm. It is center positive.

    To utilize the locking feature of the DC jack, you will need to use a power supply with the appropriate locking connector. The motherboard DC connector uses M8 x 0.75 pitch threads, and is 8mm in length.

    For the MC610, a terminal block is used in place of the barrel-jack to provide 24V capability up to 330W (Mating part: Dinkle 2ESDAM-04P or equivalent).

    The system is operational from 12V~24V. The maximum rated current of the connector is 15A. Use a wire gauge that is rated for the operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal block with tinned wire ends or solid core wire. See below for connector pinout.

    Terminal block power pinout

    1

    DDR4 SO-DIMM Sockets

    19

    Clear CMOS Header (CLRMOS1)

    2

    ESPI Header (ESPI1)

    20

    Chassis Intrusion Header (CI1_2)

    An M.2 B-Key port is present on the motherboard to allow support for B-Key form-factor expansion cards. Supported cards include 3042 and 3052 form-factors. The B-Key connector supports PCIe x1, USB 3.2 10Gb/s, and USB 2.0 devices.

    The 3FF Micro SIM card slot is connected to the M.2 B-Key.

    An M.2 E-Key port is present on the motherboard to allow support for E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe x1, CNVi for wireless, and USB 2.0.

    An M.2 M-Key port is present on the motherboard to allow support for M-Key form-factor expansion cards. 2242, 2260, and 2280 form-factor cards are supported. The M-Key connector includes support for PCIe Gen 3 x4 devices.

    The motherboard has two onboard DDR4 SO-DIMM slots with the following specifications:

    • Maximum Capacity: DDR4-2300 64GB with two 32GB SO-DIMM Modules

    • Channel configuration: 1 DIMM Per Channel (DPC) - 2 Channels

    • No ECC Support

    If the BIOS needs to be updated, please refer to BIOS Manual & Updates for reflashing instructions.

    The LGA1700 CPU socket on the motherboard supports all 12th and 13th Gen Intel series processors up to 35W base TDP.

    Access the official Motherboard manual & OEM Resources from ASRock. This external link provides access to the complete motherboard manual, along with the latest BIOS updates and specific drivers for your system's motherboard.

    The MC610-55 is sold with a 330W power supply

    This recommendation takes into account the maximum peak power usage of each component, along with an additional overhead for safety. The optimal approach for determining the appropriate power supply size involves precise measurements using the actual hardware and specific applications.

    The power consumption of the MC510-55 & MC610-55 was measured for various system configurations, workloads, and power states at both 12V and 24V system input voltages. Tests were performed using Prime 95, Furmark, and Burnintest v10 to stress system components. These tests were performed with Intel Turbo Boost Enabled. The build configurations and power consumption are listed in the tables below. The power consumption listed below is the average power draw over a 5 minute window from the test starting. The non-idle tests include a brief period of PL2 power consumption (previously Intel turbo Boost) where the power consumption is up to 71W more than the listed average.

    *The configurations below are using representative samples of internal devices, the specific components mentioned below may vary from the devices provided by OnLogic.

    The average power consumption for each system configuration is recorded below. See section “5.1.2 - Recommended Power Supply” for recommended power supplies

    This platform supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters.

    These DC levels specified are the absolute max values for the pins for function and safety of the system. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.

    Auto power allows the computer to automatically power on when power is applied/turned on. This is useful when the system needs to stay running all the time, and will come back up after a power outage. Systems can have this enabled on new orders, but you can follow the below steps to enable this setting for any units in the field.

    BIOS: Navigate to the BIOS section Advanced -> Chipset -> Restore on AC/Power Loss -> Set to Enabled

    Motherboard Jumper: Note: you will need a 2-pin jumper to enable this setting. If you need a 2-pin jumper, you can contact our sales team to order the [HWP134] Board Jumper, 2×1. They can be contacted at info@onlogic.com, or by calling 802 481 3324 ext. 3.

    ● Temperature Range: 0ºC to 50°C

    ● Step size: 10°C

    ● i9-13900TE Processor loaded with Intel XTU

    ● SSD, DDR4 RAM, and A4000 SFF GPU loaded @ 80% with BurnInTest 10.1

    Thermal testing of the MC510-55 and MC610-55 was completed using a thermal chamber to control ambient environmental temperature across the rated temperature range of the system. Throughout testing, the system and its components were being stressed by various softwares to simulate a rigorous constant workload. Stress testing occurred for two hours in each temperature range. Components were monitored during testing via their internal sensors. Some components, and ambient air were monitored externally via thermocouples.

    The MC510-55 with the i9-13900TE sustained significant processor, memory, and storage loads through a temperature range of 0°C-50°C without any significant performance drop in either performance or efficiency core clock speed. Neither the efficiency nor performance clocks dip below their rated base clock. Note the system is certified for use between 0°C-40°C ambient temperature but does function properly up to 50°C.

    The MC610-55 with the i9-13900TE sustained significant processor, memory, and storage loads through a temperature range of 0-50°C. The performance of the performance cores of the processor lowered from their boost clock as temperatures reached 50°C. GPU clock speed decreased as temperatures reached 50°C but stayed well above the base clock speed. The installation of a second chassis fan increases performance of the system and lowers system temperatures.

    PCIe Envelope

    The max dimensions of a PCIe expansion card for the MC610-55 is: 112mm x 183mm x dual slot.

    The MC510-55 and MC610-55 have optional Wall Mount brackets (SKU : MTW101 for the MC510-55, and MTW102 for the MC610-55) and DIN Rail mounting brackets (SKU : MTW101-K) available for purchase.

    For Wall Mounting, follow steps below :

    Step 1: Align the four screw holes on the bottom of the system with the respective holes on the mounting brackets.

    Step 2: Attach wall mounting brackets (MTW101) to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long). Use a torque of at least 200 N-cm (18 in-lbs) to attach brackets.

    Step 3 : Install system to surface using keyhole slots on wall mount brackets and appropriate hardware for the surface (not provided).

    For DIN Rail Mounting, follow the below steps:

    Step 1: Follow steps 1-2 from the Wall Mounting section.

    Step 2: Align the mounting holes of the din clip bracket to the three mounting holes on the wall mount bracket.

    Step 3: Install the din clips to the wall mount brackets using supplied screws and a Phillips head screwdriver.

    Step 6: Mount system onto the DIN rail.

    Note: The mounting brackets are required to support 3x the hanging weight of the system (14.82lbs / 6.72 kgs). The mating surface and hardware must be capable of supporting the same load.

    The MC510-55 and MC610-55 have optional VESA mounting brackets (SKU : VMP-1041 or MTW113 for MC510-55 and VMPL-1041 for the MC610-55) available for purchase. Follow the steps below for mounting these brackets.

    Step 1: Align the four screw holes on the bottom of the system with the respective holes on the VESA bracket.

    Step 2: Attach VESA Bracket to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long) Use a torque of at least 200 N-cm (18 in-lbs) to attach brackets.

    Step 3: Install the system to VESA 75 or VESA 100 mounting pattern using provided VESA Mount screws.

    The mounting bracket systems are required to secure 3x the hanging weight of the computer system (14.82lbs / 6.72 kgs). The mating substrate must be capable of maintaining the same rating.

    For VESA through mounting using MTW113, follow the steps below.

    Step 1: Separate the two bracket segments by first removing the M4 screw on either side of the bracket (M4X0.7 Phillips head, 6 mm long). With the screws removed, the bracket segments can be separated by removing the perforated hex piece from the hooked tabs on the top edge of the bracket.

    Step 2: Align the screw holes indicated with a single dot marking with the bottom holes of the MC510-55. (Holes marked with two dots are for the OnLogic HX300 series). Secure the system using the 4x supplied M3 screws (M3X0.5 Flathead Screw, 6mm Long). Use a torque of at least 200 N-cm (18 in-lbs) to attach the bracket.

    Step 3: Install the bracket/MC510-55 assembly to a VESA 75 or VESA 100 mounting pattern on a monitor stand/arm using the provided M4x0.7 8mm length screws. Note the arrow marking on the bracket indicating which side of the bracket should be facing UP.

    Step 4: Install the remaining bracket segment to a monitor VESA 75 or VESA 100 mounting pattern using the provided M4x0.7 8mm length screws Note the arrow marking on the bracket indicating which side of the bracket should be facing UP.

    Step 5: Install the bracket/monitor assembly to the bracket/MC510-55 assembly on the mounting arm by aligning the hooks/tabs and slot the pieces together. Secure the bracket segments together using the 2x M4 screws removed in Step 1.

    The MC500 and MC510 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

    The MC500 and MC510 series chasses can be opened by removing the two screws from the back (indicated in the picture below). Slide the lid off towards the rear of the chassis.

    Here you can find the release history and download links for the MC510/MC610-55 system:

    Version
    Release Date
    Download

    P1.90F

    4/1/2025

    P1.60B

    8/16/2024

    BIOS Update

    Warning: Never interrupt a BIOS update. If the update is interrupted, the system may become irreparable. Damage caused as a result of BIOS updates may not be covered by the system's warranty.

    You can follow this how-to guide for installation instructions.

    Access the official Motherboard manual & OEM Resources from ASRock. This external link provides access to the complete motherboard manual, along with specific drivers for your system's motherboard.

    The computer system was evaluated for medical, IT equipment. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing includes: EN 55032, EN 55035, IEC 60601-1 and EN 62368-1. Product safety was evaluated to IEC 62368-1.

    This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

    This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

    Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

    CAN ICES-003(A) / NMB-003(A)

    The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.

    This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI). If this equipment is used in a domestic environment, radio interference may occur, in which case the user may be required to take corrective actions.

    For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories

    The MC610-55 only supports a standard 900mA regulated 5V output to power USB3 devices via each port on the PCIe-USB381F Neousys 8-Port USB 3.1 Gen1 Frame Grabber.

    1- Product Overview

    1.1- Introduction

    https://www.onlogic.com/store/mc510-55/

    1.2- Safety

    Safety Precautions, Safeguards & Information

    Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.

    Modification of the device may void certifications, warranty and/or cause possible injury to the user.

    Safe use and installation instructions

    Précautions et guide d’installation

    Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.

    La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures à l'utilisateur.

    .

    1.3- Box Contents & Accessories

    1.4- Product Specifications

    2- Technical Specifications

    2.1- External Features

    Front I/O - MC510-55

    Back I/O - MC510-55

    Front I/O - MC610-55

    Back I/O - MC610-55

    2.2- I/O Definitions

    Front I/O Definition

    Power Button / Power LED

    USB 2.0

    Rear I/O Definition

    HDMI Port

    LAN1/LAN2 - Intel I225-LM / Intel I226V

    USB 3.2

    USB 2.0

    Audio (Line out / Microphone)

    COM DB9 option

    Lockable DC Jack

    Terminal block power option

    2.3- Motherboard Connectors

    M.2 B-Key

    M.2 E-Key

    M.2 M-Key

    SO-DIMM1 & SO-DIMM2

    BIOS EEPROM

    CPU socket

    2.4- Motherboard Manual

    2.4- Power Management

    Recommended Power Supply

    MC610-55

    MC510-55

    Average Power Consumption

    Protection Circuitry

    Wake-Up Events

    Auto Power On

    The MC510-55 and MC610-55 offer two options to enable Auto Power On. When manually configuring the BIOS setting, this can be reset via a CMOS Clear or the CMOS battery failing. The Motherboard Jumper requires the additional steps of opening the system, and installing the physical jumper, but does not get reset via either CMOS event. When the Motherboard Jumper is installed, the BIOS setting is hidden.

    2.5- Thermal Results

    Test Conditions

    Test Methodology

    Test Results

    Test Result Summary

    2.6- Block Diagram

    3- Installation & Mechanial

    3.1- Dimensions

    MC510-55 Dimensions

    MC610-55 Dimensions

    3.2- Mounting Instructions

    Wall Mount & DIN Rail Mounting

    VESA Mounting

    VESA Through-Mounting

    3.3- Internal Access

    3.4- CAD Files

    4- Software & Firmware

    4.1- BIOS Manual & Updates

    4.2- Drivers & Downloads

    5- Support & Compliance

    5.1- Troubleshooting & FAQ

    Clear CMOS

    5.2- Regulatory

    Download Documents

    CE

    FCC Statement

    ISED

    UKCA

    VCCI

    5.3- Security Advisory

    5.4- Appendices

    A: Errata

    MC510-55.STEP
    82MB
    Open
    MC610-55.STEP
    81MB
    Open
    MCY10-55 MTBF Summary.pdf
    PDF · 46KB
    Open
    MCY10_VCCI_RPC.pdf
    PDF · 346KB
    Open
    MCY10 UL 62368-1 CoC.pdf
    PDF · 286KB
    Open
    MC510-55 RoHS & REACH SVHC Declaration.pdf
    PDF · 175KB
    Open
    MC510-55 MC610-55 CE Declaration.pdf
    PDF · 64KB
    Open
    Care must be taken handling the device to prevent injury to self or possibility of damaging the unit.
  • Read the entire manual before using the product.

  • Install the device securely per users manual instructions.

  • To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.

  • Wall or ceiling mounting device requires use of OnLogic mounting plate or bracket.

  • Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.

  • Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or enclosure during operation and 30 minutes after shutdown allowing the unit to cool down.

  • Ambient operating temperature must be between 0 °C to 40 °C with a non-condensing relative humidity of 10-85%.

  • The device can be stored at temperatures between -10 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, minimum 3HR.

  • Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.

  • Do not clean the device with liquids. The chassis can be cleaned with a dry cloth or duster only. To prevent injury to self and/or damage to the device the unit must be powered down and all connecting power and other peripherals shall be disconnected prior to cleaning.

  • Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then recommended device orientation is such that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.

  • This device is intended for indoor operation only.

  • Caution, Risk of Electric Shock! Unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!

  • To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC, see specs for details.

  • Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.

  • Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.

  • Install the device only with shielded network cables.

  • The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.

  • Radio device is not intended for emergency service use.

  • Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.

  • Proper disposal of CMOS battery must comply with local governance.

  • Product must only be connected to a certified router, switch or similar network equipment

  • Product is intended for indoor use only.

  • Product cannot be connected to the public network.

  • This equipment is not suitable for use in locations where children are likely to be present.\

  • WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion

    Des précautions doivent être prises lors de la manipulation de l'appareil pour éviter de se blesser ou d'endommager l'appareil.
  • Lisez l'intégralité du manuel avant d'utiliser le produit.

  • Installez l'appareil en toute sécurité selon les instructions du manuel de l'utilisateur.

  • Pour vous protéger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes double bande fournies avec un gain de 2 dBi/2 dBi.

  • Le dispositif de montage mural ou au plafond nécessite l'utilisation d'une plaque ou d'un support de montage. La plaque ou le support doit être en métal et avoir une épaisseur minimale de 1 mm.

  • Utilisez des vis à tête plate M4x0,5 mm pour fixer la plaque de montage ou les supports de montage aux trous filetés au bas ou à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support au-delà de 1,5 mm.

  • Attention surface chaude! Il est normal que l'appareil chauffe et soit chaud au toucher. Ne touchez pas la zone du dissipateur thermique ou le boîtier pendant le fonctionnement et 30 minutes après l'arrêt pour permettre à l'unité de refroidir.

  • La température ambiante de fonctionnement doit être comprise entre 0 °C et 40 °C avec une humidité relative sans condensation de 10 à 85 %.

  • L'appareil peut être stocké à des températures comprises entre -10 °C et 85 °C. Remarque : L'unité doit être stabilisée à la température de fonctionnement avant utilisation, minimum 3 heures.

  • Gardez l'appareil à l'écart des liquides et des matériaux inflammables. Ne pas installer dans un environnement dangereux.

  • Ne nettoyez pas l'appareil avec des liquides. Le châssis peut être nettoyé uniquement avec un chiffon sec ou un plumeau. Pour éviter de se blesser et/ou d'endommager l'appareil, l'appareil doit être éteint et toutes les alimentations et autres périphériques doivent être déconnectés avant le nettoyage.

  • Prévoyez un espace suffisant autour de tous les côtés de l'appareil pour un refroidissement correct et pour ne pas dépasser sa limite de température de fonctionnement maximale. Si l'appareil est monté sur une surface verticale, l'orientation recommandée de l'appareil est telle que les ailettes du dissipateur thermique permettent à l'air de monter sans obstruction. Des orientations alternatives peuvent entraîner une plage de températures de fonctionnement réduite.

  • Cet appareil est destiné à une utilisation en intérieur uniquement.

  • Attention, risque de choc électrique ! L'unité est alimentée uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) à l'appareil !

  • Pour alimenter l'appareil, utilisez uniquement des alimentations externes répertoriées UL ITE avec une sortie CC de 12-24 VCC, voir les spécifications pour plus de détails.

  • Les méthodes de câblage utilisées pour le raccordement de l'équipement à l'alimentation secteur doivent être conformes au Code national de l'électricité, NFPA 70, et au Code canadien de l'électricité, Partie I, CSA C22.1.

  • Prévoyez suffisamment d'espace pour les connexions de câblage du bornier afin que les fils ne se plient pas et soient protégés contre les dommages accidentels.

  • Installez l'appareil uniquement avec des câbles réseau blindés.

  • L'installateur doit avoir de l'expérience dans l'installation de pièces de rechange et être familiarisé avec les pratiques générales d'installation de composants électroniques.

  • L'appareil radio n'est pas destiné aux services d'urgence.

  • L'entretien et la réparation de l'appareil doivent être effectués par un personnel qualifié. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être du même type que celle d'origine.

  • L'élimination appropriée de la batterie CMOS doit être conforme à la gouvernance locale.

  • Le produit doit uniquement être connecté à un routeur, un commutateur ou un équipement réseau similaire certifié

  • Le produit est destiné à une utilisation en intérieur uniquement.

  • Le produit ne peut pas être connecté au réseau public.

  • Cet équipement n'est pas adapté à une utilisation dans des endroits où des enfants sont susceptibles d'être présents.

  • ATTENTION: Il existe un risque d'explosion si la pile CMOS n'est pas remplacée correctement. L'élimination de la batterie dans le feu ou dans un four chaud, ou l'écrasement ou le découpage mécanique d'une batterie peut entraîner une explosion.

    Board Dimensions

    6.7" x 6.7"

    170 mm x 170 mm

    6.7" x 6.7" 170 mm x 170 mm

    CPU

    Socket LGA 1700 - Raptor/Alder Lake S

    Socket LGA 1700 - Raptor/Alder Lake S

    PCH

    Intel H610

    Intel H610

    Memory

    2 x SO-DIMM DDR4 (2 x 32GB max Dual Channel) 64 GB Total

    2 x SO-DIMM DDR4 (2 x 32GB max Dual Channel) 64 GB Total

    LAN Controller

    2x Intel i225-LM/i225V (vPro not supported)

    2x Intel i225-LM/i225V (vPro not supported)

    Expansion

    1 x M.2 (Key M, 2242/2260/2280) PCIe Gen3 x4 for SSD

    1 x M.2 (Key E, 2230) PCIe x1, USB 2.0 and CNVi for Wireless

    1 x M.2 (Key B, 3042/3052) PCIe x1, USB 3.2 Gen1, USB 2.0 and SIM for 4G/5G

    1 x M.2 (Key M, 2242/2260/2280) PCIe Gen3 x4 for SSD

    1 x M.2 (Key E, 2230) PCIe x1, USB 2.0 and CNVi for Wireless

    1 x M.2 (Key B, 3042/3052) PCIe x1, USB 3.2 Gen1, USB 2.0 and SIM for 4G/5G

    1 x PCIe x16 (Gen4)

    Back I/O

    2x Full size DisplayPort 1.4a++

    1x HDMI 2.0b

    2x 2.5Gb LAN (2 x Intel)

    2x USB 3.2 (Gen2)

    2x USB 2.0

    2x Audio (Mic-in, Line-out)

    Optional 4x COM (2x RS-232/422/485, 2x RS-232)

    DC-In

    2x Full size DisplayPort 1.4a++

    1x HDMI 2.0b

    2x 2.5Gb LAN (2 x Intel)

    2x USB 3.2 (Gen2)

    2x USB 2.0

    2x Audio (Mic-in, Line-out)

    Optional 3x COM (2x RS-232/422/485, 1x RS-232)

    DC-In

    Front I/O

    1x Power button with LED indicator

    2x USB 2.0

    1x Power button with LED indicator

    2x USB 2.0

    Onboard Headers

    1x Battery on a cable

    1x LVDS Panel Connector - eDP Connector (on the Backside of PCB)

    1x Battery on a cable

    1x LVDS Panel Connector - eDP Connector (on the Backside of PCB)

    Voltage Input

    12~28V

    12~28V

    Power Input

    DC Jack (Screw type)

    4-pin terminal block

    BIOS

    AMI SPI 256 Mbit

    AMI SPI 256 Mbit

    Operating Systems

    Windows 10 IOT 2021 LTSC, Windows 10 IOT 2019 LTSC, Ubuntu 22.04 LTS, Window 11

    Windows 10 IOT 2021 LTSC, Windows 10 IOT 2019 LTSC, Ubuntu 22.04 LTS, Window 11

    Special Features

    Watchdog Timer PTT in BIOS On-board TPM 2.0 Support for 4G LTE and GPS expansion cards

    Watchdog timer PTT in BIOS On-board TPM 2.0 Support for 4G LTE and GPS expansion cards

    Thermal Standards

    Operating Temperature: 0-40°C Storage Temperature: -10°C - 85°C Operating Humidity: 10% - 85% (non-condensing)

    Operating Temperature: 0-40°C Storage Temperature: -10°C - 85°C Operating Humidity: 10% - 85% (non-condensing) Second chassis fan recommended in ambient temperatures above 40°C

    Chassis Features

    6 Antenna holes Wall Mount DIN Rail Moun VESA Mount

    8 Antenna holes Wall Mount DIN Rail Mount VESA Mount

    RoHS 3 (2015/863/EU)

    IEC 60601-1-2, 4th ed. - EMC Ready

    IEC/UL/EN 62368-1

    Type of Modulation

    2.4 GHz: DSSS / OFDM / FHSS

    5 GHz: OFDM

    Type of Antenna

    Reference antenna is PIFA type (2 dBi / 2 dBi gain)

    Modes of Operation

    Duplex (Tx/Rx)

    Duty Cycle (Access Protocol)

    As In: IEEE 802.11a/b/g/n/ac

    QZSS Receiver

    Operating frequency range: 1559 - 1610 MHz

    GSM 900

    Operating frequency range: 880 - 915 MHz, 925 - 960 MHz

    Maximum output power: 33dBm rated

    GSM 1800

    Operating frequency range: 1710 - 1785 MHz, 1805 - 1880 MHz

    Maximum output power: 30dBm rated

    WCDMA Band 1

    Operating frequency range: 1920 - 1980 MHz, 2110 - 2170 MHz

    Maximum output power: 24dBm rated

    WCDMA Band 8

    Operating frequency range: 880 - 915 MHz, 925 - 960 MHz

    Maximum output power: 24dBm rated

    LTE FDD Band 1

    Operating frequency range: 1920 - 1980 MHz, 2110 - 2170 MHz

    Maximum output power: 23dBm rated

    LTE FDD Band 3

    Operating frequency range: 1710 - 1785 MHz, 1805 - 1880 MHz

    Maximum output power: 23dBm rated

    LTE FDD Band 7

    Operating frequency range: 2500 - 2570 MHz, 2620 - 2690 MHz

    Maximum output power: 23dBm rated

    LTE FDD Band 8

    Operating frequency range: 880 - 915 MHz, 925 - 960 MHz

    Maximum output power: 23dBm rated

    LTE FDD Band 20

    Operating frequency range: 832 - 862 MHz, 791 - 821 MHz

    Maximum output power: 23dBm rated

    LTE FDD Band 28A

    Operating frequency range: 703 - 733 MHz, 758 - 788 MHz

    Maximum output power: 23dBm rated

    LTE FDD Band 38

    Operating frequency range: 2570 - 2620 MHz

    Maximum output power: 23dBm rated

    LTE FDD Band 40

    Operating frequency range: 2300 - 2400 MHz

    Maximum output power: 23dBm rated

    E-GSM

    Operating frequency range: 880 - 915 MHz

    Maximum output power: 33dBm rated

    DCS

    Operating frequency range: 1710 - 1785 MHz

    Maximum output power: 30dBm rated

    3

    M.2 Key-B Socket (M2_B1)

    21

    PWR_BAT1_SIO_AT1

    4

    Battery Connector

    22

    AT_TEST1_PCIE_PWR1

    5

    SATA Power Output Connector

    23

    System Panel Header

    6

    SATA3 Connectors (SATA3_1, SATA3_2)

    24

    SMBUS_TEST1

    7

    DACC1

    25

    CPU FAN Connector (+12V)

    8

    Digital Input / Output Default Value Setting (JGPIO_SET1)

    26

    Chassis FAN Connector (+12V)

    9

    Digital Input / Output Power Select (JGPIO_PWR1)

    27

    Power Adapter

    10

    Digital Input/Output Pin Header (JGPIO1)

    28

    M.2 Key-M Socket (M2_KEYM1)

    11

    COM Port Headers

    (COM1, 2, 3, 4)

    29

    M.2 Key-E Socket (M2_KEYE1)

    12

    Backlight Power Select (LCD_BLT_VCC) (BKT_PWR1)

    30

    4-pin ATX PWR Connector

    13

    COM Port PWR Setting Jumpers PWR_COM3 (For COM Port3) PWR_COM1 (For COM Port1)

    31

    2-pin UPS Module Power Input Connector

    14

    Inverter Power Control Wafer (BLT_PWR1)

    32

    SPDIF Header

    15

    LVDS Panel Connector - eDP Connector (on the Backside of PCB)

    33

    Front Panel Audio Header

    16

    Backlight Volume Control (BLT_VOL1)

    34

    3W Audio AMP Output Wafer

    17

    Panel Power Select (LCD_VCC) (PNL_PWR1)

    36

    USB2.0 Header (USB2_5_6)

    18

    Inverter Power Control Wafer (BLT_PWR2)

    36

    USB3.2 Gen1 Header (USB3_4_9)

    Back :

    SIM Card Socket (SIM1)eDP Connector (EDP1, refer to No. 15)

    1.50G

    6/4/2024

    Link
    Link
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