The OnLogic Karbon 400 Series Industrial PC (ADPM) packs the power and advanced IoT capabilities of the latest Intel® Atom® x6000E processors (formerly Elkhart Lake) into low profile, rugged and fanless systems built for the challenges of the IoT Edge.
The OnLogic Karbon 400 Series Industrial PC (ADPM) was designed to be installed anywhere you need ultra-reliable computing power. Sensitive internal components are protected from dust, debris, chemicals, and moisture with OnLogic's integrated Hardshell™ Fanless Technology. Its rugged design, -40° to 70°C operating temperature range, 9~48 V power input, and the absence of any moving parts dramatically improve the lifespan and reliability of the system.
Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.
Modification of the device may void certifications, warranty and/or cause possible injury to the user.
Safe use and installation instructions
Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.
La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures à l'utilisateur.
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Terminal block kit (Power, CAN bus)
Rubber Feet (4)
If you purchased additional items such as mounting brackets, power supplies, or cables, they will be located in the system box or within the outer shipping carton.
For more information on accessories and additional features, you can visit the product pages here:
Karbon 400 Series Page:
Karbon 410 Page:
Karbon 430 Page:
Radio Specifications when equipped with INT-9260 Wifi/BT (device for indoor use)
The front power button can be used to turn on and off the Karbon system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset of the system. The system can be woken by a single press of the power button from any state.
The LED backlight will indicate the system status. A solid blue light indicates that the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.
A 3FF Micro-SIM card slot is present on the front panel of the Karbon 400 platform allowing native support for OnLogic cellular modules. The SIM signals can be connected to either the mPCIe or M.2 B-Key internal expansion slots. This selection is controlled in BIOS with the default BIOS setting being mPCIe. Please refer to the BIOS user manual for more information.
The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card from the front panel of the Karbon platform, please use a small implement to push the card into the slot until it clicks. To remove the card, push with a small implement until the card clicks, then pull on the free end of the card to remove it.
There are two USB 2.0 Type-A ports on the front panel of the K400 platform. These ports are capable of linking at 480Mbps transfer rates.
There are two USB 3.2 Gen 2 Type A ports on the front panel of the K400 platform. These ports are capable of linking at 10Gbps transfer rates.
The K400 platform supports an optional COM DB9 add-in card (OnLogic MOD109). The serial port mode and voltage between Off/5V/12V on Pin 9 on K400 can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the for configuration instructions.
The K410/K430 platform supports an optional Isolated Digital I/O add-in card ().
This option allows for integration of the Karbon 400 Series with existing PLC integrations or other digital logic applications. A complete explanation of features, operating voltages, and safety information, is available in the DIO expansion information in the Add-in Modules section (2.4) of this page.
Mainboard power is applied to the Karbon 400 platform by Dinkle 2EHDRM-03P (Mating part: Dinkle: 2ESDVM-03P or equivalent 5.08mm pitch terminal plug). The system is operational from 9V~48V. The maximum rated current of the connector is 15A per pin. Use a wire gauge that is rated for the operational current. The ignition pin may be used to turn the system on when configured. The timing
is configurable through the OS, similar to K700/K300 configurations. Please see the on this page for Ignition and timing configuration. See below for on-board connector pinout.
Supports CAN 2.0 A/B at 100-1000 kbaud via the Programmable Services Engine. Messages may be sent/received through the HECI (Host Embedded Controller Interface). A command line interface utility for interfacing with the CAN device over HECI is provided, and applications can also interact with the HECI driver directly. For more information, please refer to the of this page.
The internal CAN signals are unterminated; the CAN device should be externally terminated.
3-pin CAN Bus
Dinkle EC350V-03P terminal block
There are two LAN Ports on the K400 platform that support up to 1 Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by the two LEDs embedded within the port. The description is included below.
The PoE add-on card option enables Power over Ethernet for both LAN ports. Both ports are configured for 802.3atcapabilities. A total power budget of 36W is provided for both ports, such that two 802.3af devices may be used, with a single port connected to a 802.3at device as an additional supported configuration.
The Karbon 400 platform utilizes Intel’s Integrated processor graphics that power the onboard
DisplayPort with support for resolutions up to 4096x2304 at 60Hz. The port also supports Multi-Stream Transport (MST) which allows for triple independent display output using a certified MST hub.
The Karbon 410 and 430 both have four SMA ports for antennas on the top of the system. The Karbon 430 includes two additional SMA ports on the front of the system.
The motherboard is the same for K410 and K430.
An M.2 B-Key slot on the Karbon 400 motherboard provides support for B-Key form-factor expansion cards. Supported cards include 3042, 2242, 2260, 2280 form-factors. The B-Key connector supports PCIe Gen 3 x2, USB 3.2 5Gbps, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.
The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Please refer to the BIOS user manual (Appendix B) for more information.
A full pinout table for this expansion slot is provided in Appendix D.
An M.2 E-Key slot on the Karbon 400 motherboard provides support for E-Key form-factor expansion cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is provided in Appendix D.
A mPCIe slot is present on the Karbon 400 motherboard to allow support for mini-PCIe form-factor expansion cards. Full length cards and half-length cards (with an adapter) are supported. The mPCIe connector supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is provided in Appendix D.
The 3FF Micro-SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Please refer to the BIOS user manual (Appendix B) for more information.
Karbon 400 has two onboard DDR4 SO-DIMM slots:
Maximum Capacity: 32GB DDR4-3200 total using two 16GB SO-DIMM modules
Channel configuration: 1 DIMM Per Channel (DPC) - 2 Channels
In Band ECC Support (IBECC)
The snap dome tact switch behind the power button on the Karbon 400 motherboard may be used to clear the CMOS settings in the BIOS. Remove external power to the system before clearing the CMOS. Removing the RTC battery is not an accepted method for clearing BIOS settings.
If the BIOS needs to be updated, please refer to Appendix B for reflashing instructions.
The on-board power switch header can be used to control the power state of the Karbon 400 platform in parallel with the front panel power button. Mating power switch cables should be a twisted-pair wire with floating shield to assure proper immunity to EMI/RFI. The mating connector is a standard 2.54mm female header. It is recommended to keep wires at less than 3 meters in length. Switches must be momentary contact type only.
The RTC battery on the Karbon 400 platform is used to retain BIOS CMOS settings and maintain the real-time clock for the system. If the RTC battery is low, CMOS settings will not be retained and you may receive an alert in the operating system. Replacement batteries should be a UL listed type CR2032 3V cell.
Karbon 400 features an onboard TPM (Trusted Platform Module) header. It supports OnLogic’s wide-temperature TPM 2.0 module (OnLogic TPM01). This gives the option to have a dedicated secure module to secure the system through cryptographic keys.
An onboard connector is provided for power to internal expansion cards. The connector is a JST 2.0mm PH series connector (pn: B4B-PH-K-S). A suitable mating connector from the same series should be used. The Pinout is provided below. The maximum operating current per pin is 2A. The header is only powered while the system is in the S0 operating state.
The Karbon 430 system supports an additional daughter board for additional high speed storage and connectivity options. The daughter board is pictured below.
The upper B-Key slot is provided to allow support for B-Key form-factor PCIe and USB expansion cards. Supported cards include 3042, 3052, 2260, 2280 form-factors. The B-Key connector on the Karbon expansion card supports PCIe Gen 3 x1, USB 3.2 5Gbps, USB 2.0 devices. B-Key SATA drives are not electrically compatible with this slot.
There are two 3FF SIM slots on the daughter board to support networking capabilities. One SIM slot is externally accessible, with the other accessed on the bottom of the HSIO card.
The lower B-Key slot is provided to allow support for B-Key form-factor PCIe and USB expansion cards. Supported cards include 2042, 2260, and 2280 form-factors. The B-Key connector on the Karbon 400 expansion card supports PCIe Gen 3 x1, USB 3.2 5Gbps, USB 2.0 devices. B-Key SATA drives are not electrically compatible with this port.
The externally accessible 3FF SIM 1 slot is provided for networking capabilities on the B-Key 1 slot.
The internally accessible 3FF SIM 2 slot is provided for networking capabilities on the B-Key 1 slot. This slot is on the bottom side of the Expansion card and is only accessible by removing the daughterboard from the chassis.
The RTC battery on the Karbon 400 expansion card is provided for redundancy with the main CMOS battery to retain BIOS CMOS settings and maintain the real-time clock for the system. If the RTC battery is low, CMOS settings will not be retained and you may receive an alert in the operating system. Replacement batteries should be a UL listed type CR2032 3V cell.
The power consumption of the K410 and K430 was measured for various system configurations, workloads, and power states at both 9V and 48V system input voltages. Tests were performed using Burnintest v9.0 build 1012 to stress system components with and without graphics enabled. The build configurations and power consumption are listed in the tables below.
The configurations below are using representative samples of internal devices, the specific components mentioned below may vary from the devices provided by OnLogic. The power consumption for each system configuration is recorded below.
The specified DC levels are the absolute maximum values for function and safety of the system. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.
The Karbon 400 platform enables a unique low power state for use in automotive or battery powered applications. When enabled, the total power draw for the system is less than 10mA, making this solution ideal for systems requiring ultra-low quiescent power draw. This setting must be enabled from the OS similar to ignition settings. The system may be woken by either the power button or the ignition pin.
The Karbon 400 platform supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters.
The system can be configured to turn on automatically when DC power is connected. This is useful for power outage recovery or if the unit is mounted in a hard to reach location. You can enable Auto Power On by following the steps listed below.
Power on the system and immediately press the Del key a few times until you see the “Front Page” menu
Arrow down and choose “Setup Utility” by pressing enter
Under the advanced tab, open the “RC Advanced Menu”
Open the “PCH-IO Configuration” menu
The auto power on setting is called “State After G3”.
Set it to S0 State to enable auto power on
Set it to S5 State to disable auto power on
Press F10 to save and exit. Then you are all set.
The thermal performance of the Karbon 400 platform was validated by loading the system to simulate workloads in excess of expected workloads. That is to say, the system was loaded to run at its full rated TDP (12W) while also simultaneously stressing memory and storage at different set points across the system's rated operating temperature range for hours on end. System performance was reviewed to look for any indication of performance issues or for components operating outside of their rated temperature range. Samples of data collected during one of these thermal evaluations for this platform are shown below. The sample data was collected during a test of the K410 chassis with the x6425E processor, 64 GB of DDR4 RAM and an NVMe storage drive. Of note in these results is the fact that no significant drops (10% or more) were observed in core frequency or package power.
There were no indications of any throttling in the system throughout the entirety of the test.
All dimensions are shown in millimeters.
Step 1: Attach wall mounting brackets to the chassis using the provided screws. To assemble, locate the four holes in the chassis that line up to the two countersunk holes in each wall mount bracket.
Screw type: M3x0.5 FH 120 Degree
Length: 4 mm
Step 2: Take care to ensure that the brackets are oriented correctly and that the part of the brackets in contact with the mounting surface is positioned away from the system to ensure a small air gap is maintained between the mounting surface and the system. Install the four supplied screws.
Step 3: Fasten system to the mounting surface (hardware not provided). The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.
Step 1: Attach DIN Clip to the back of the chassis using the provided screws. To assemble, locate the two holes in the back of the chassis that line up to the two countersunk holes on the DIN clip.
Screw type: M3x0.5 FH 120 Degree
Length: 6 mm
Step 2: The orientation of the DIN clip is interchangeable between the two options. Determine the preferred orientation of the system and install the screws to the DIN clip accordingly.
Step 3: Install the system onto a DIN rail in the desired location.
Step 1: Attach wall mounting brackets to the chassis using the provided screws. To assemble, locate the four holes in the chassis that line up to the two countersunk holes in each wall mount bracket.
Screw type: M3x0.5 FH 120 Degree
Length: 4 mm
Step 2: Take care to ensure that the brackets are oriented correctly and that the part of the brackets in contact with the mounting surface is positioned away from the system to ensure a small air gap is maintained between the mounting surface and the system. Install the four supplied screws.
Step 3: Take the two plastic DIN clips and align the two outer holes with the two outer holes in the middle of each of the wall mount brackets.
Screw type: M3x0.5 PH
Length: 6 mm
Step 4: The orientation of the DIN clips is interchangeable between the two options. Determine the preferred orientation of the system and install the screws to the DIN clips accordingly.
Step 1: Attach VESA mounting plate to the chassis using the provided screws. Align the four holes on the VESA mounting plate with the corresponding holes on the chassis bottom.
Screw type: M3x0.5 FH 120 Degree
Length: 4 mm
Step 2: Attach system to a corresponding VESA MIS-D 75 or MIS-D 100 mounting pattern using the supplied M4x0.7 slotted standoffs
Opening the system does not void the warranty, however, some precautions are necessary to avoid damaging the unit. Any damaged caused will not be covered by warranty.
Perform this disassembly in an area free of static discharge
Before beginning, touch a grounded metal surface to discharge your body of static electricity
Remove the 4 Torx T8 screws from the bottom of the chassis
Use a small flathead screwdriver to pry the bottom plate off using the notch.
If the unit has one of the K430 expansion modules, remove the 4 screws from the midplate and lift it straight out.
If the system has the optional x2 LAN expansion board, remove the x2 additional screws as well.
The internals of the system are now accessible.
See the full here.
*Note that these drivers require BIOS version A070 or newer. It is recommended to update to the latest BIOS version listed above.
To make the PSE on the K400 system work, we will need to install the PSE driver on the system. The PSE driver is included in the K400 driver package, you can download the package from our Drivers & Downloads section above.
If the PSE driver is not installed, you will find a “Base SystemDevice” with exclamation mark in Device Manager
Click the “Update Driver” button in Driver tab,
Then follow the instructions on screen to install the driver.
Select “Browse my computer for drivers”
After clicking on the “OK” button, the driver will be installed.
Then the PSE driver is installed now.
We will need to install the VS2022 build tools to compile the PSE sample code. You can install the build tool from
After downloading the installer, install the “Desktop development with C++” option. Then you can build the PSE sample project using cmake from the Visual Studio developer command prompt.
We are ready to compile the PSE sample code. The PSE sample code is available below. Please download it and unzip to the local driver, then run “x86 Native Tools Command Prompt for VS 2022” as Administrator from the start menu.
In the command prompt, navigate to the PSE source code folder and run the following command to build,
After build finished, you can find the executable file in <work directory>\build\src\Debug\
The PSE sample code provides examples to use the DIO, CAN, and Automotive features on the system.
This PSE sample code demonstrates how to manipulate the DIO interface from C language in Windows 10 environment. You can download the sample C code from here:
To integrate the PSE function in your own application, you will need to add pse.c (located under /pse_examples/src/win) in your project. Then include pse.h in your source code.
pse.c provides APIs to connect and help to communicate to the PSE engine. The basic work flow is very simple as following diagram,
See our How-To
The ignition sense feature can be used to turn the Karbon unit on and off with a vehicle’s ignition. It can also be used in non-automotive applications using a switch instead.
An example configuration is shown below for Windows. The switch connects positive DC power to the IGN pin. The unit will turn on when power is applied to the IGN pin, and turn off when power is removed. These events have configurable delays.
Download the control application from the
Run Command Prompt as administrator
Navigate to the directory where you put the control application.
Example: In this picture, the HWC file is saved to the Desktop. Navigating there allows access to the file.
Once you have navigated to the directory that the HWC file is located, execute the following commands in order:
Change Windows Settings
Ignition sensing simulates a power button press. In Windows, the default behavior of the power button press is to put the system into Sleep mode. You will want to change that to “Shut Down” instead.
Windows “fast startup” will interfere with ignition sensing, so this should be disabled.
Power down the system and you can turn it back on by connecting positive power to the IGN pin. This will give you a basic ignition timings setup with 10 second delays. Reference the table below for customizations.
hwc ign set command -v value
hwc ign get command
The Karbon K410 and K430 series systems offer CAN bus and (optionally) isolated DIO (Digital Input/Output) support. This functionality is through the processor’s supporting ARM microcontroller, known as the Programmable Services Engine (PSE).
The PSE is isolated from the core processor, runs its own OS (), but can be sent messages over the system’s Host Embedded Controller Interface (or HECI). The Zephyr OS is transparent to the user. This interface may be used to send and receive CAN messages alongside setting and reading the Digital IO. Note: Packages such as SocketCAN are not supported.
Requirements: A K410 or K430 with Windows and the latest HECI driver. The HECI Windows driver is provided and supported by Intel, and will be preinstalled on K410 units purchased with Windows. If Windows is installed by the user, the driver is included with our driver package linked at the top of this page.
Note: We recommend you update to the latest BIOS version for the best compatibility with this application.
Download the K410’s hardware control
Open a command window, and navigate to the location of the downloaded file.
Press the Windows Key + R
The (optional) digital input/output (DIO) expansion adds up to eight digital inputs and outputs to the system, and an additional CAN port. It also optionally provides support for pulse width modulation (PWM) on three of the eight digital output pins, and support for using a quadrature encoder peripheral (QEP) in place of the first and/or second group of three digital inputs.
See for information about C sample code and a reference on command packing and communication.
The HECI interface uses packed structures to send data between the host and PSE. Specific type structures are provided in the sample code, but an outline of the message format is available below:
If the system fails to power on or output video, clearing the CMOS can often help. To clear the CMOS, the system needs to be opened and an internal switch needs to be pressed.
Opening the system does not void the warranty, however, some precautions are necessary to avoid damaging the unit. Any damaged caused will not be covered by warranty.
Perform this disassembly in an area free of static discharge
Before beginning, touch a grounded metal surface to discharge your body of static electricity
Power off and unplug the system. Disconnect all ports.
Use a small flathead screwdriver to pry the bottom plate off using the notch.
Locate the golden clear CMOS button
Hold down the clear button for 30 seconds.
Re-assemble the system. Do not over tighten the screws.
Re-connect the system and power it on.
Do not touch it for 2 minutes. Wait and see if it outputs video.
After updating to BIOS version A074 or later, Windows may display a Bluescreen error with message “SYSTEM_THREAD_EXCEPTION_NOT_HANDLED”. You will need to adjust the BIOS settings to make it work. Go into the BIOS and change the following x2 options
Advanced -> Expert mode -> Enabled
Advanced -> RC advanced menu -> PCH-IO Configuration -> PinCntrl Driver GPIO Scheme -> Disabled
Press F10 to save the BIOS settings and reboot. If the OS is able to recover, it should boot up. If not, you may need to .
If you are having issues with Ubuntu randomly crashing, taking several minutes to boot up, or an issue with not fully turning off, try Enabling the PinCntrl Driver GPIO Scheme:
Access the BIOS by pressing DEL while the system is booting up
Enable Expert Mode under Advanced
Enable Pin Control Driver GPIO Scheme: Advanced/ RC AdvancedMenu/ PCH-IO Configuration/ PinCntrl Driver GPIO Scheme -> Enable
For all PCB revisions (5R1-5R5), the SIM slot connects the digital and chassis ground planes, removing isolation between the two. Under normal operating conditions, the function of the motherboard should not be affected.
Customers who rely on chassis ground isolation are recommended to isolate the chassis from earth ground externally.
Steps to mitigate the issue will be taken in PCB B01-00005R6 by eliminating the short. The changes are present in F01-x0005R6.
The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing included: EN 55032, EN 55035, EN 60601-1, EN 62368-1, EN 50121-3-2, and UN Regulation No. 10 ISO 17650-2.
This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. CAN ICES-003(A) / NMB-003(A)
The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.
This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI). If this equipment is used in a domestic environment, radio interference may occur, in which case the user may be required to take corrective actions.
For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.
IR-1: M.2 Radio Modules with WDISABLE pins will be forced into Airplane Mode.
Resolution: A Windows-specific software workaround is available to customers upon request. Please reach out to Tech Support to inquire about options.
Memory
2 SO-DIMM DDR4 3200 up to 32GB total with IBECC support
2 SO-DIMM DDR4 3200 up to 32GB total with IBECC support
LAN Controller
2 Intel I210-IT
2 Intel I210-IT
Motherboard Expansion
M.2 3042/2260/80 B-key (PCIe x2, USB 2.0, SATA, SIM)
M.2 2230 E-key (Wi-Fi) (PCIe x1, USB 2.0)
mPCIe (PCIe x1, USB 2.0, SATA, SIM)
M.2 3042/2260/80 B-key (PCIe x2, USB 2.0, SATA, SIM)
M.2 2230 E-key (Wi-Fi) (PCIe x1, USB 2.0)
mPCIe (PCIe x1, USB 2.0, SATA, SIM)
Motherboard I/O
2 GbE LAN (optional 2 PoE using module)
2 USB 3.2 Gen 2 Type-A
2 USB 2.0 Type-A
1 DisplayPort (DP 1.4 & HDMI 2.0b)
3-pin CAN bus
3-pin Power input
1 Power button
1 3FF Micro-SIM (mapped to motherboard mPCIe and M.2)
8 LED array (Power, Storage, Ignition, Watchdog, 4 User Configurable)
2 GbE LAN (optional 2 PoE using module)
2 USB 3.2 Gen 2 Type-A
2 USB 2.0 Type-A
1 DisplayPort (DP 1.4 & HDMI 2.0b)
3-pin CAN bus
3-pin Power input
1 Power button
1 3FF Micro-SIM (mapped to motherboard mPCIe and M.2)
8 LED array (Power, Storage, Ignition, Watchdog, 4 User Configurable)
Motherboard Headers
TPM 2.0 module header
PoE module header
DC power header
RTC battery holder
TPM 2.0 module header
PoE module header
DC power header
RTC battery holder
Daughterboard Expansion
N/A
M.2 3042/52/2260/80 B-key (PCIe x1, USB 3.0, USB 2.0, SIM)
M.2 2242/60/80 B-key (PCIe x1, USB 3.0, USB 2.0)
Daughterboard I/O
N/A
3FF Micro-SIM (mapped to M.2 3042/52)
Daughterboard Headers
N/A
3FF Micro-SIM (mapped to M.2 3042/52)
Voltage Input
9~48 VDC (3-pin Terminal Block with IGN pin)
9~48 VDC (3-pin Terminal Block with IGN pin)
Power Protections
Reverse Power Input Protection
Over Voltage Protection (52.8V)
ESD Protection (15kV Air, 8kV Contact)
Chassis Grounding Nut
Reverse Power Input Protection
Over Voltage Protection (52.8V)
ESD Protection (15kV Air, 8kV Contact)
Chassis Grounding Nut
OS Support
Windows IoT Enterprise
Windows IoT Enterprise
Special Features
Automotive Power with Ignition Sensing
Watchdog Timer
PTT and Secure Boot in BIOS
Automotive Power with Ignition Sensing
Watchdog Timer
PTT and Secure Boot in BIOS
Mounting
Wall, DIN rail, VESA
Wall, DIN rail, VESA
Temperature
-40~70°C, Operating
-40~85°C, Storage
-40~70°C, Operating
-40~85°C, Storage
Humidity
10~95% non-condensing, Operating
0~95% non-condensing, Storage
10~95% non-condensing, Operating
0~95% non-condensing, Storage
Shock
Tested according to IEC 60068-2-27 and MIL-STD-810H Method 516.6
Tested according to IEC 60068-2-27 and MIL-STD-810H Method 516.6
Vibration
Tested according to IEC 60068-2-64 and MIL-STD-810H Method 514.6
Tested according to IEC 60068-2-64 and MIL-STD-810H Method 514.6
Regulatory Certifications
FCC part 15b (Class A), CE, VCCI, RCM
Meets requirements of CE Directives for I.T.E. (EMC 2014/30/EU, ErP 2009/125/EC, Low Voltage 2014/35/EU, Radio Equipment 2014/53/EU, RoHS 3 EU 2015/863, WEEE 2002/96/EC)
Meets requirements of IEC 60601-1-2:2014 Medical Electrical Equipment
Meets requirements of E-Mark (UNECE Reg. 10, latest revision)
Meets requirements of EN 50155 (via testing to EN 50121-3-2)
Meets requirements of IEC 60945 Ed. 4 Maritime Navigation and Radiocommunication Equipment and Systems
Meets requirements of IEC 62368-1 Audio/Video, Information And Communication Technology Equipment - Part 1: Safety Requirements
FCC part 15b (Class A), CE, VCCI, RCM
Meets requirements of CE Directives for I.T.E. (EMC 2014/30/EU, ErP 2009/125/EC, Low Voltage 2014/35/EU, Radio Equipment 2014/53/EU, RoHS 3 EU 2015/863, WEEE 2002/96/EC)
Meets requirements of IEC 60601-1-2:2014 Medical Electrical Equipment
Meets requirements of E-Mark (UNECE Reg. 10, latest revision)
Meets requirements of EN 50155 (via testing to EN 50121-3-2)
Meets requirements of IEC 60945 Ed. 4 Maritime Navigation and Radiocommunication Equipment and Systems
Meets requirements of IEC 62368-1 Audio/Video, Information And Communication Technology Equipment - Part 1: Safety Requirements
Type of Modulation
2.4GHz: DSSS/OFDM/FHSS 5 GHz: OFDM
Type of Antenna
Reference antenna is PIFA type (2dBi/2dBi gain)
Modes of operation
Duplex (Tx/Rx)
Duty cycle (access protocol)
As In: IEEE 802.11 a/b/g/n/ac
Version of firmware/software
Software Intel PROSet/Wireless WiFi Softwar 20..x and following versions for WIFI/BT
Antenna Specifications
PIF (2dBi / 2dBi Gain for 2.4 and 5GHz) RP-SMA connector
A074
12/01/2023
A063
11/12/2021
Manufacturability update
Includes updated PSE drivers.
Select the top level folder
startup-timer
The delay between IGN power being applied and the unit turning on
1-2147483647 (seconds)
shutdown-timer
The delay before Windows is shut down when IGN power is cut
1-2147483647 (seconds)
hard-off-timer
After the shutdown timer has completed, power will be fully cut after X number of seconds. This is useful in case the system freezes at shutdown.
1-2147483647 (seconds)
low-voltage-timer
The low voltage shutdown can be delayed by X number of seconds. A value of at least 10 is recommended to avoid voltage drop related shutdowns – i.e. when the engine is started.
30-2147483647 (seconds)
shutdown-voltage
The unit can shut itself down when a certain low voltage threshold is reached. This helps prevent over discharging a battery. (1150 => 11.5V)
600-4700 (centi-volts)
system-voltage
This command reports the current voltage value that the system is running on. The output will read in this format: “cvl 1202”, which means the Current Voltage Level is 1202 cV (centivolts), or 12.02 volts.
0-4700 (centivolts)
cmd.exe and hit EnterIn the window that opens navigate to the download location:
e.g. cd C:\User\Username\Downloads
Display the built-in help text:
hwc.exe --help
10 – 25
Packed ‘argument’ for a given command. Format depends on the command identifier.
26 – 31
Status of last command
32 – 39
Data format of body: 0: Raw data 1: Version information 2: CAN message 4: DIO message 7: ASCII String
40 – 168
Body of message data, usually in the form of another packed structure.
Severity:
Low
DIN Rail Mounting Update
05/24/2022
Sim Card Update > cellular modules
02/09/2023
Removed CEC Support
06/23/2023
Added ‘Wi-fi’ following ‘E-key’ & corrected series link
07/21/2023
Read the entire manual before using the product.
Install the device securely per users manual instructions.
To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.
Wall or ceiling mounting device requires use of OnLogic mounting plate or bracket.
Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.
Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or enclosure during operation and 30 minutes after shutdown allowing the unit to cool down.
Ambient operating temperature must be between -40 °C to 70 °C with a non-condensing relative humidity of 10-95%.
The device can be stored at temperatures between -10 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, minimum 3HR.
Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.
Do not clean the device with liquids. The chassis can be cleaned with a dry cloth or duster only. To prevent injury to self and/or damage to the device the unit must be powered down and all connecting power and other peripherals shall be disconnected prior to cleaning.
Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then recommended device orientation is such that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.
This device is intended for indoor operation only.
Caution, Risk of Electric Shock! Unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!
To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC, see specs for details.
Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.
Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.
Install the device only with shielded network cables.
The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.
Radio device is not intended for emergency service use.
Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.
Proper disposal of CMOS battery must comply with local governance.
Product must only be connected to a certified router, switch or similar network equipment
Product is intended for indoor use only.
Product cannot be connected to the public network.
This equipment is not suitable for use in locations where children are likely to be present.\
WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion
Lisez l'intégralité du manuel avant d'utiliser le produit.
Installez l'appareil en toute sécurité selon les instructions du manuel de l'utilisateur.
Pour vous protéger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes double bande fournies avec un gain de 2 dBi/2 dBi.
Le dispositif de montage mural ou au plafond nécessite l'utilisation d'une plaque ou d'un support de montage. La plaque ou le support doit être en métal et avoir une épaisseur minimale de 1 mm.
Utilisez des vis à tête plate M4x0,5 mm pour fixer la plaque de montage ou les supports de montage aux trous filetés au bas ou à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support au-delà de 1,5 mm.
Attention surface chaude! Il est normal que l'appareil chauffe et soit chaud au toucher. Ne touchez pas la zone du dissipateur thermique ou le boîtier pendant le fonctionnement et 30 minutes après l'arrêt pour permettre à l'unité de refroidir.
La température ambiante de fonctionnement doit être comprise entre 0 °C et 40 °C avec une humidité relative sans condensation de 10 à 85 %.
L'appareil peut être stocké à des températures comprises entre -10 °C et 85 °C. Remarque : L'unité doit être stabilisée à la température de fonctionnement avant utilisation, minimum 3 heures.
Gardez l'appareil à l'écart des liquides et des matériaux inflammables. Ne pas installer dans un environnement dangereux.
Ne nettoyez pas l'appareil avec des liquides. Le châssis peut être nettoyé uniquement avec un chiffon sec ou un plumeau. Pour éviter de se blesser et/ou d'endommager l'appareil, l'appareil doit être éteint et toutes les alimentations et autres périphériques doivent être déconnectés avant le nettoyage.
Prévoyez un espace suffisant autour de tous les côtés de l'appareil pour un refroidissement correct et pour ne pas dépasser sa limite de température de fonctionnement maximale. Si l'appareil est monté sur une surface verticale, l'orientation recommandée de l'appareil est telle que les ailettes du dissipateur thermique permettent à l'air de monter sans obstruction. Des orientations alternatives peuvent entraîner une plage de températures de fonctionnement réduite.
Cet appareil est destiné à une utilisation en intérieur uniquement.
Attention, risque de choc électrique ! L'unité est alimentée uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) à l'appareil !
Pour alimenter l'appareil, utilisez uniquement des alimentations externes répertoriées UL ITE avec une sortie CC de 12-24 VCC, voir les spécifications pour plus de détails.
Les méthodes de câblage utilisées pour le raccordement de l'équipement à l'alimentation secteur doivent être conformes au Code national de l'électricité, NFPA 70, et au Code canadien de l'électricité, Partie I, CSA C22.1.
Prévoyez suffisamment d'espace pour les connexions de câblage du bornier afin que les fils ne se plient pas et soient protégés contre les dommages accidentels.
Installez l'appareil uniquement avec des câbles réseau blindés.
L'installateur doit avoir de l'expérience dans l'installation de pièces de rechange et être familiarisé avec les pratiques générales d'installation de composants électroniques.
L'appareil radio n'est pas destiné aux services d'urgence.
L'entretien et la réparation de l'appareil doivent être effectués par un personnel qualifié. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être du même type que celle d'origine.
L'élimination appropriée de la batterie CMOS doit être conforme à la gouvernance locale.
Le produit doit uniquement être connecté à un routeur, un commutateur ou un équipement réseau similaire certifié
Le produit est destiné à une utilisation en intérieur uniquement.
Le produit ne peut pas être connecté au réseau public.
Cet équipement n'est pas adapté à une utilisation dans des endroits où des enfants sont susceptibles d'être présents.
ATTENTION: Il existe un risque d'explosion si la pile CMOS n'est pas remplacée correctement. L'élimination de la batterie dans le feu ou dans un four chaud, ou l'écrasement ou le découpage mécanique d'une batterie peut entraîner une explosion.
Dimensions
180 x 123 x 50 mm
180 x 123 x 60 mm
CPU
Intel Atom x6211E (2 core, 2 thread, 1.3~3.0 GHz, 6W)
Intel Atom x6425E (4 core, 4 thread, 2.0~3.0 GHz, 12W)
Intel Atom x6211E (2 core, 2 thread, 1.3~3.0 GHz, 6W)
Intel Atom x6425E (4 core, 4 thread, 2.0~3.0 GHz, 12W)
Frequency Bands
2.4GHz and 5GHz bands
Operating Frequency
2400 - 2485 MHz 5150 - 5250 MHz, 5250 - 5350 MHz 5470 - 5725 MHz, 5725 - 5878 MHz
Channel spacing / Bandwidth
2.4GHz: 802.11b/g/n; 5 MHz / BT: 1MHz Bandwidth: 20 MHz / 40 MHz 5 GHz: 802.11a/n/ac: 20, 40, 80, 160 MHz
RF output power
20dBm (2400-2485 MHz) IEEE 802.11b/g/n& BT 10dBm (2400-2485 MHz) BLE 23dBm (5150-5725 MHz) IEEE 802.11a/n/ac 13.98 dBm (5725-5875MHz) IEEE 802.11a/n/ac
A077
03/07/2024
Fixes PSE feature troubles from 1.76 and enables 2x COM capability. Includes regular stability improvements.
A076
Windows 10
10/11/2023
Includes updated PSE drivers.
Windows 11
v1.2.1
10/11/2023
Fixes issue with Version-Check warning. * Note that the CAN baudrate is fixed at 1M. Please see our C-Based PSE-Examples for setting the baudrate programmatically.
mkdir build && cd build
cmake -A Win32 ..
cmake --build .hwc ign set ignition-sense -v 1
hwc ign set low-power-mode -v 1
hwc ign set shutdown-timer -v 10
hwc ign set startup-timer -v 10
hwc ign set hard-off-timer -v 3000Command
Description
Possible Values
ignition-sense
Enables or disables ignition sense
0=off, 1=on
low-power-mode
Reduces idle power consumption (recommended on when ignition sense is used)
Bits
Description
0 – 7
HECI Command Identifier: 0x01: System Information: 0x02: Digital IO 0x04: Can Bus
8
Set as ‘1’ if this message is a response from the PSE
9
Set as ‘1’ if this message contains a valid data body
SKU(s) Affected:
K410, K430
Revision(s) Affected:
B01-00005R(1-5)
Revision Resolved:
B01-00005R6
Revision
Date
First release of K400 manual
09/16/2021
Update including radio transmitter info, VCCI, RF, and Safety info
1/25/2022
Updated DIO Link
05/04/2022
05/16/2024
06/18/2025
0=off, 1=on
NOTE: To enter the BIOS on Karbon systems, hold the ‘Delete’ key on your keyboard during boot.
Boot Manager
Type
Device Management
Boot From File
Administer Secure Boot
Setup Utility
InsydeH2O Version
Build Date
Processor Type
Total Memory
Channel A
Channel B
System Memory Speed
Language
System Time
System Date
Platform Information
Expert Mode
Numlock
Rotate Screen
USB BIOS Support
Platform Trust Technology
FACP - RTC S4 Wakeup
Wake on USB from S5
Wake on USB Wait Time
Enable ACPI Auto Configuration
Enable Hibernation
PTID Support
PECI Access Method
ACPI S3 Support
Native PCIE Enabled
Native ASPM
BDAT ACPI Table Support
Low Power S0 Idle Capability
SSDT Table From File
PCI Delay Optimization
MSI Enabled
CPU Flex Ratio Settings
Hardware Prefetcher
Adjacent Cache Line Prefetch
PECI
Boot Performance Mode
Intel SpeedStep
Platform PL1 Enable
Platform PL2 Enable
Energy Performance Gain
Energy Efficient Turbo
Maximum GT Frequency
Disable Turbo GT Frequency
Intel TCC Mode
IO Fabric Low Latency
GT CLOS
Max TOLUD
VT-d
DMA Control Guarantee
IGD VTD Enable
IOP VTD Enable
Cpu CrashLog
GNA Device
CRID Support
Above 4G MMIO BIOS Assignment
Skip Scanning of External Gfx Card
Internal Graphics
GTT Size
Aperture Size
PSMI Support
DVMT Pre-Allocated
DVMT Total Gfx Mem
DiSM Size
VDD Enable
PM Support
PAVP Enable
Cdynmax Clamping Enable
Skip Full CD Clock Init
EFI Network
WWAN Device Wake GPIO
Wake on WLAN and BT Enable
PXE ROM
State After G3
Enable TCO Timer
Enable Timed GPIO0
DMI Link ASPM Control
Port8xh Decode
PCI Express Root Port
ASPM
PCIE Speed
Detect Timeout
SATA Controller(s)
SATA Mode Selection
SATA Ports Multiplier
SATA Speed
Aggressive LPM Support
Port X
Hot Plug
xDCI Support
USB2 PHY Sus Well Power Gating
USB3 Link Speed Selection
USB Overcurrent
USB Overcurrent Lock
USB Port Disable Override
USB Device/Host Mode Override
USB UCSI ACPI Device
RTC Memory Lock
BIOS Lock
Force Unlock on All GPIO Pads
Device Controller
UARTX Hardware Flow Control
UARTX DMA Enable
UARTX Power Gating
PSE Controller
Log Output Channel
Shell
Eclite
OOB
ME Firmware Version
ME Firmware Mode
ME Firmware SKU
ME Firmware Status 1
ME Firmware Status 2
ME State
Comms Hub Support
JHI Support
Core BIOS Done Message
HECI Timeouts
ME Firmware Re-Flash
FW Update
3.6.16 - PTT Configuration
PTT Capability / State
FIPS Mode Select
Current FIPS Mode
Crypto Driver FIPS Version
3.6.18 - Anti-Rollback SVN Configuration
Automatic HW-Enforced Anti-Rollback SVN
Set HW-Enforced Anti-Rollback for Current SVN
Minimal Allowed Anti-Rollback SVN
Executing Anti-Rollback SVN
Automatic OEM Key Revocation
Invoke OEM Key Revocation
3.6.20 - Thermal Configuration
Enable All Thermal Functions
DTS SMM
TCC Activation Offset
TCC Offset Time Window
TCC Offset Clamp Enable
TCC Offset Lock Enable
Bi-directional PROCHOT#
Disable PROCHOT# Output
Disable VR Thermal Alert
PROCHOT Response
PROCHOT Lock
ACPI T-States
3.6.22 - Platform Thermal Configuration
Critical Trip Point
Active Trip Point 0
Active Trip Point 0 Fan Speed
Active Trip Point 1
Active Trip Point 1 Fan Speed
Passive Trip Point
Passive TC1 Value
Passive TC2 Value
Passive TSP Value
Active Trip Points
Passive Trip Points
Critical Trip Points
Active Trip Points
PCH Temp Read
CPU Energy Read
CPU Temp Read
Alert Enable Lock
CPU Temp
CPU Fan Speed
3.6.23 - ACPI D3Cold Settings
ACPI D3Cold Support
H2OUVE Support
Low Power Enable
3.7.1 - 2x COM Daughter Card
COMx Mode Selection
COMx Slew Rate
3.7.2 - Lan Dev Off
LAN x Dev Off
3.7.3 - CAN/DIO Daughter Card
PWMx
QEPx
Current TPM Device
TPM State
TPM Active PCR Hash Algorithm
TPM Hardware Supported Hash Algorithm
BIOS Supported Hash Algorithm
TrEE Protocol Version
TPM Availability
TPM Operation
Clear TPM
Set Supervisor Password
Wake on PME
Auto Wake on S5
S5 Long Run Test
Boot Type
Network Stack
PXE Boot Capability
Add Boot Options
USB Boot
UEFI OS Fast Boot
EFI
Note: The EFI boot order configuration in this menu can only be changed if the Add Boot Options option above is set to First or Last.
In this menu, you set which devices the system can boot to, as well as change the order in which it attempts to boot. Highlight a boot device and press Enter to enable or disable booting to it. Use the F5 and F6 keys to move the boot device up and down the list.
Exit Saving Changes
Save Change Without Exit
Exit Discarding Changes
Load Optimal Defaults
Load Custom Defaults
Save Custom Defaults
Discard Changes
The latest BIOS updates are available on the page.
Default Value
Auto
Default Value
Auto
Default Value
Enabled
Default Value
119 C (POR)
Default Value
71 C
Default Value
100
Default Value
55 C
Default Value
75
Default Value
95 C
Default Value
1
Default Value
5
Default Value
10
Default Value
65%
Default Value
1.1
Default Value
Available
Default Value
No Operation
Default Value
UEFI Boot Type
Default Value
Disabled
Default Value
Auto
Menu
BIOS Page
Front Page
Description
Opens the list of detected bootable devices, allowing you to manually select a device to boot, such as an OS or PXE
Type
Menu
BIOS Page
Front Page
Description
Opens the Device Manager menu which includes a configuration menu for Intel Rapid Storage Technology and a Network Device List (if RST and Network Stack are enabled)
Type
Menu
BIOS Page
Front Page
Description
Allows you to boot from a UEFI bootable file
Type
Menu
BIOS Page
Front Page
Description
Opens the Secure Boot configuration menu
Type
Menu
BIOS Page
Front Page
Description
Opens the primary BIOS configuration menu referenced in sections 2 through 6 of this manual
Type
Information
BIOS Page
Main Page
Description
Displays current system BIOS version
Type
Information
BIOS Page
Main Page
Description
Displays the BIOS build date in MM/DD/YYYY
Type
Information
BIOS Page
Main Page
Description
Displays model number of installed CPU
Type
Information
BIOS Page
Main Page
Description
Displays total capacity of all memory installed in system
Type
Information
BIOS Page
Main Page
Description
Displays capacity of memory installed in Channel A
Type
Information
BIOS Page
Main Page
Description
Displays capacity of memory installed in Channel B
Type
Information
BIOS Page
Main Page
Description
Displays base frequency of installed memory
Type
Information
BIOS Page
Main Page
Description
Selects the current default language used by the BIOS
Type
Information
BIOS Page
Main Page
Description
Displays the time in HH:MM:SS. Valid range is from 0 to 23, 0 to 59, 0 to 59. Use +/- to increase/decrease
Type
Information
BIOS Page
Main Page
Description
Displays the date in MM:DD:YYYY. Valid range is from 1 to 12, 1 to 31, 2000 to 2099. Use +/- to increase/decrease
Type
Subsection
BIOS Page
Main Page
Description
Contains detailed information about the system processor, pch, and firmware component versions.
Type
Configurable Setting
BIOS Page
Advanced
Description
Expose additional BIOS configuration options.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > Boot Configuration
Description
Sets state of Num Lock key when system is booted
Default Value
Off
Type
Configurable Setting
BIOS Page
Advanced > Boot Configuration
Description
Rotate the screen 90 or 270 degrees clockwise
Default Value
Off
Type
Configurable Setting
BIOS Page
Advanced > USB Configuration
Description
Set USB BIOS Support as disabled, enabled, or UEFI only
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Chipset Configuration
Description
Enables or Disables Intel Platform Trust Technology
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > ACPI Table/Features Control
Description
Enables or disables the ability to use the RTC to wake from S4
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > SFB Chipset Feature
Description
Enable/Disable Wake on USB from S5 state
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > SFB Chipset Feature
Description
Wait Time for USB re-enumeration during S5 state. Select from 5 - 60 seconds.
Default Value
5
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Enables or Disables BIOS ACPI Auto Configuration.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Enables or Disables System ability to Hibernate (OS/S4 Sleep State). This option may not be effective with some OSs.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
PTID Support will be loaded if enabled.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Set PECI access method as either Direct I/O or ACPI
Default Value
Direct I/O
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Enables or Disables ACPI S3 support
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Configure support for native PCIE
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Auto: Automatically select between enabling/disabling Native ASPM
Enabled: OS Controlled ASPM
Disabled: BIOS Controlled ASPM
Default Value
Auto
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Enables support for the BDAT ACPI table
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Enable ACPI Lower Power S0 Idle Capability (Mutually exclusive with Smart connect). While this is enabled, it also disables the 8254 timer for SLP_S0 support.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Generate SSDT table from its file
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
Experimental ACPI additions for FW latency optimization
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > ACPI Settings
Description
When disabled, MSU support is disabled in FADT
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > CPU Configuration
Description
CPU flex ratio value. It must fall between the Max Efficiency Ratio (LFM) and the Maximum non-turbo ratio set by hardware (HFM).
Default Value
20
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > CPU Configuration
Description
Turn on/off the MLC streamer prefetcher.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > CPU Configuration
Description
Turn on/off prefetching of adjacent cache lines.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > CPU Configuration
Description
Turn on/off PECI.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Power & Performance > CPU - Power Management Control
Description
Select the performance state that the BIOS will set starting from the reset vector.
Default Value
Max Non-Turbo Performance
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Power & Performance > CPU - Power Management Control
Description
Allows more than two frequency ranges to be supported.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Power & Performance > CPU - Power Management Control
Description
Enable/Disable Platform Power Limit 1 programming. If this option is enabled, it activates the PL1 value to be used by the processor to limit the average power of a given time window.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Power & Performance > CPU - Power Management Control
Description
Enable/Disable Platform Power Limit 2 programming. If this option is disabled, BIOS will program the default values for Platform Power Limit 2.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Power & Performance > CPU - Power Management Control
Description
Enable/Disable energy performance gain
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Power & Performance > CPU - Power Management Control
Description
Enable/Disable Energy Efficient Turbo Feature. This feature will opportunistically lower the turbo frequency to increase efficiency. Recommended only to disable in overclocking situations where turbo frequency must remain constant. Otherwise, leave enabled.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Power & Performance > GT - Power Management Control
Description
Automatically updated GT max frequency
Default Value
Default Max Frequency
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Power & Performance > GT - Power Management Control
Description
Set as ‘Disabled’ to prevent limiting GT frequency
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Intel(R) Time Coordinated Computing
Description
Enable or Disable Intel(R) TCC mode. When enabled, this will modify system settings to improve real-time performance. The full list of settings and their current state are displayed below when Intel(R) TCC mode is enabled.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Intel(R) Time Coordinated Computing
Description
Enable or Disable IO Fabric Low Latency. This will turn off some power management in the PCH IO fabrics. This option provides the most aggressive IO Fabric performance setting. S3 state is NOT supported.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Intel(R) Time Coordinated Computing
Description
Enable or Disable Graphics Technology(GT) Class of Service. Enable will reduce Gfx LLC allocation to minimize impact of Gfx workload on LLC
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > Memory Configuration
Description
Maximum Value of TOLUD. Dynamic assignment would adjust TOLUD automatically based on largest MMIO length of installed graphic controller
Default Value
Dynamic
Type
Info
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration
Description
If the system supports VT-d capabilities
Type
Configurable Setting (Locked)
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration
Description
Program the state of the DMA_CONTROL_GUARANTEE bit
Default Value
Disabled
Type
Configurable Setting (Locked)
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration
Description
Enable/Disable IGD VTD
Default Value
Enabled
Type
Configurable Setting (Locked)
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration
Description
Enable/Disable IOP VTD
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration
Description
Enable or disabled the CPU CrashLog on Device 10
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration
Description
Enable/Disable the SA GNA device
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration
Description
Enable/Disable SA CRID and TCSS CRID control for Intel SIPP
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration
Description
Enable/Disable above 4GB MemoryMappedIO BIOS assignment. This is enabled automatically when Aperture Size is set to 2048MB.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
If Enabled, the BIOS will not scan for External Gfx Card on PEG and PCH PCIE Ports
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Force the Internal Graphics enable state. Setting this to disabled without an external graphics card will prevent display output.
Default Value
Auto
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Set the GTT size to 2, 4, or 8 MB
Default Value
8MB
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Select the Aperture Size. Above 4GB MMIO BIOS assignment is automatically enabled when selecting 2048MB aperture. To use this feature, please disable CSM Support.
Default Value
256MB
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Enable/Disable PSMI Support.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Select DVMT 5.0 Pre-Allocated (Fixed) Graphics Memory size used by the Internal Graphics Device.
Default Value
60M
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Select DVMT5.0 Total Graphic Memory size used by the Internal Graphics Device.
Default Value
256M
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
DiSM Size for 2LM Sku.
Default Value
0GB
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Enable/Disable forcing of VDD in the BIOS
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Enable/Disable PM support
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Enable/Disable PAVP
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Enable/Disable Cdynmax Clamping
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > System Agent (SA) Configuration > Graphics Configuration
Description
Enabled: Skip Full CD clock initialization.
Disabled: Initialize the full CD clock if not initialized by Gfx PEIM
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration
Description
Enable/Disable networking functionality for the onboard network interfaces in the UEFI environment.
Default Value
Onboard NIC
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration
Description
Enable/Disable using the WWAN device wake gpio pins as potential wake sources.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration
Description
Enable/Disable PCI Express Wireless LAN and Bluetooth to wake the system.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration
Description
Enable/Disable PXE Option ROM execution.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration
Description
Specify what state to go to when power is reapplied after a power failure (G3 state).
Default Value
S5 State (Off)
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration
Description
Enable/Disable TCO timer. When disabled, it disables PCH ACPI timer, stops TCO timer, and ACPI WDAT table will not be published.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration
Description
Enable/Disable Timed GPIO0. When disabled, it disables cross time stamp time-synchronization as extension of Hammock Harbor time synchronization.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration > PCI Express Configuration
Description
The control of Active State Power Management of the DMI Link.
Default Value
Auto
Type
Configurable Setting
BIOS Page
Advanced > RC Advanced Menu > PCH-IO Configuration > PCI Express Configuration
Description
PCI Express Port8xh Decode Enable/Disable.
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > PCI Express Configuration > PCI Express Root Port Settings
Description
Enables or disables the selected PCI Express Root Port
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > PCI Express Configuration > PCI Express Root Port Settings
Description
Sets the PCI Express Active State Power Management mode
Possible Values
Auto, Disabled, L0s, L1, L0sL1
Type