1- Product Overview

1.1- Introduction

The Helix and Karbon 520 Series computers harness the advanced power and integrated edge AI capabilities of Intel® Core™ Ultra processors, delivering highly scalable performance in a fanless, robust design. Engineered for the evolved edge, these systems offer versatile connectivity, including ModBay™ expansion, and robust reliability within their 0°C to 50°C and -40º to 70ºC operating temperature ranges, to meet the demands of diverse industrial applications. Comprehensive features like cable retention and remote management capabilities (including Intel vPro®) ensure streamlined deployment and long-term operational efficiency.

For more information on accessories and additional features, visit the following product pages:

• https://www.onlogic.com/store/computers/industrial/fanless/helix-500/

警告:為避免電磁干擾，本產品不應安裝或使用於住宅環境

Warning: To avoid electromagnetic interference, this product should not be installed or used in a residential environment

Any included or additional accessories, such as mounting brackets, power supplies, or antennas, are located in the accessory box at the bottom of the system box. All drivers and product guides can be found on the product's dedicated webpage.

Note: Pin 6 and 12 are motherboard GND pins.

Note: Pin 2 or the "-" label is the motherboard GND pin.

*Note: Pin 1 and pin 20 are isolated DIO ground pins, which are different from the motherboard GND. It is not recommended to connect them directly to the motherboard GND unless your application requires it.

Notes:

1. The CAN H pins are labeled "+" on the system.

2. The CAN L pins are labeled "-" on the system.

3. The ISO GND pins are labeled with the GND symbol on the system, however both are independent isolated grounds. It is not recommended to connect them together if both CAN bus channels are not on the same network.

The CBDT122 serial breakout cable converts an HX520/K520 serial connector to two DB9 connectors.

This image shows the difference between the 2x DB9 Breakout Cable and the standard COM Mating Connector:

Power LED Definition

• Off: Power off.

• Slow Blink (1/3Hz): Low/Standby Power State.

• On: Power On/Normal Power State.

Drive Activity LED

• Blinking: Read/Write activity on m.2 storage device.

Error LED Definition

• Slow Blinking (0.5Hz): Boot Issue (no boot device found).

• Fast Blinking (4Hz): Voltage fault.

• Solid: Memory Fault or no DIMMs installed.

The Helix and Karbon 520 Series have six USB 3.2 Gen 2 Type A ports (10 Gbps, 5V @ 900mA). Optional ModBay cards can add up to eight more USB 3.2 Gen2 Ports.

The Helix 520 Series has two Thunderbolt Gen 4 compliant ports (40 Gbps). Maximum 5V@3A/port or 5V@4.5A total for 2 ports. Single port maximum power is 15W and 2 ports maximum power is 22.5W.

The Karbon 520 Series has two USB 4 ports (40 Gbps). Maximum 5V@3A/port or 5V@4.5A total for 2 ports. Single port maximum power is 15W and 2 ports maximum power is 22.5W.

The Helix and Karbon 520 Series have two full-size DisplayPorts, both supporting DP 2.1 up to UHBR20. Please refer to Intel documentation for additional Core Ultra Series 1 and Core Ultra Series 2 display output specifications: .

The Helix and Karbon 520 Series have one 3FF Micro-SIM card slot on the top panel that works with 4G LTE and 5G cellular modems. The SIM card is mapped to the M.2 B-key slot. The SIM slot is push-push; push to insert and push to remove.

The Helix and Karbon 520 Series allow the enablement of a factory reset switch accessible through the front I/O face of the system that, when depressed, resets system BIOS settings back to factory defaults or custom set values.

The Intel i226 LAN Port on the Helix 520 (i226-LM) and Karbon 520 (i226-IT) Series support up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. This port also features Intel’s vPro® technology enabling remote out-of-band management and security features (supported on motherboards with Intel Core Ultra 5 135H and Intel Core Ultra 7 165h/265H Processors). The LAN link state is shown by the two LEDs on the port. The description of LED activity is shown in section 6.4.3 above.

For instructions on enabling vPro/AMT on the Helix 520 and Karbon 520 Series of systems, refer to the .

Motherboard Features

Please Note: There is a difference in labeling of front USB C ports between the HX520 series and K520 series. The HX520 series carries a Thunderbolt 4 logo while the K520 Series carries a USB 4 logo.

This slot supports PCIe Gen 4 x4 and is designed for NVMe or storage drives. A full pinout table for this expansion slot is provided in the .

This expansion slot is capable of supporting PCIe Gen 4 x2, SATA III, USB 3.2 Gen 2, USB 2.0, and one SIM card input from the external I/O. This slot is designed to support various expansion cards such as SATA storage drives and 4G LTE or 5G cellular cards. A full pinout table for this expansion slot is provided in the .

This slot supports PCIe Gen 4 x1 and USB 2.0 signals and is designed for M.2 2230 Wi-Fi expansion cards.

The systems have one PCIe x16 connector on the motherboard. It is used with OnLogic risers for various PCIe configurations in models HX/K522/3/4/5.

This riser supports a dual slot, full height, half length PCIe Gen 5 (x16 Physical/ x8 Electrical) expansion card in the HX524. There are two fan headers on the riser as well to support the fan in the chassis.

The Helix 520 series supports up to two DDR5 SO-DIMM slots rated up to 5600MTUs (MTL) and 6400MTUs (ARL).

In-Band Error Correction Code (IBECC) is optionally supported for symmetrical RAM configurations. IBECC is a specialized memory protection technology designed to enhance system reliability without requiring the additional physical memory chips traditionally associated with ECC (Error Correction Code). See BIOS Manual for more information.

The power consumption of the Helix 520 Series was measured for various system configurations, workloads, and power states at a 24V system input voltage. Tests were conducted using Furmark and Burnintest v9.0 to stress system components. These tests were performed with Intel Turbo Boost Enabled. The build configurations and power consumption are listed in the tables below. The power consumption listed below is the average power draw over a 5 minute window from the test start. This includes a brief period of PL2 power levels (Intel turbo Boost) where the power consumption is elevated. The highest power consumption seen during the period of turbo PL2 is shown at the bottom of each table. The data collected is similarly representative of systems in the Karbon 520 series.

The power consumption for each system configuration is recorded below.

The Helix and Karbon 520 Series support multiple power states. The wake-up events can be configured in the MCU and BIOS. This section describes the power management functions you can perform and gives information on protection circuitry for power adapters.

*Only supports legacy S3

The DC voltage levels specified are the absolute maximum allowable values for the system to function safely. The protection circuitry allows for brief transient voltages above these levels.

When an external GPU card is installed, the MCU will start monitoring the input voltage. The GPU power brake will be asserted when the input voltage is less than 15.6V to avoid excessive current draw from the power source in order to protect the power cable and input connector from damage. This GPU power brake will be de-asserted when the input voltage is higher than 17.1V.

Assertion of the GPU Power Brake is necessary at low voltages where high power draw from CPU, GPU, and platform devices would result in high input currents that may exceed ratings of the power connectors. The GPU brake will limit GPU power power at these voltages until input voltage is returned to safe levels.

When the power brake is activated, the power LED blinks at 25 Hz.

The 4x LAN Expansion (MODBAY-4LAN02) adds additional RJ45 GbE LAN ports to the HX523 and K523. This ModBay uses dedicated Intel I210-IT network controllers for each port which support speeds up to 1 Gbps.

Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC

The 4x PoE Expansion (MODBAY-4POE01) adds RJ45 GbE PoE LAN ports to the HX523 and K523. Each port supports up to 1 Gbps and PoE output. PoE power budget depends on system power input.

Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC

The 3x M12 LAN Expansion (MODBAY-M12LAN01) adds additional M12 X-coded GbE LAN ports to the HX523 and K523. This ModBay uses dedicated Intel I210-IT network controllers for each port which support speeds up to 1 Gbps.

Supported cables:

• CABLE-M12-RJ45-5M (5 Meter X-coded M12 to RJ45)

• CABLE-M12-RJ45-10M (10 Meter X-coded M12 to RJ45)

Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC

The 3x M12 PoE Expansion (MODBAY-M12POE01) adds additional M12 X-coded GbE PoE LAN ports to the HX523. This ModBay uses dedicated Intel I210-IT network controllers for each port which support speeds up to 1 Gbps. Additionally, each port supports PoE output. The power budget for PoE is dependent on the voltage of the system power input. Refer to Appendix C for PoE power budgets.

Supported cables:

• CABLE-M12-RJ45-5M (5 Meter X-Coded RJ45 to M12)

• CABLE-M12-RJ45-10M (10 Meter X-Coded RJ45 to M12)

Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC

The 2x 10Gb LAN Expansion (MODBAY-10GLAN01) adds RJ45 10 GbE LAN ports to the HX523. This ModBay uses a single X550 network controller which supports individual port speeds up to 10 Gbps and a maximum combined speed up to 15 Gbps across both ports.

Operating Temperature: HX523 0ºC to 40°C Operating Temperature: K523 -40ºC to 40ºC

The 4x USB3 Expansion (MODBAY-04USB-02) adds additional USB 3.2 Gen 2 Type-A ports to the HX523. This ModBay uses two USB controllers which support individual port speeds up to 10 Gbps and a maximum combined speed up to ~26 Gbps across all ports. The controllers are the PCI11400 (PCIe Gen 3 x2 to 2x USB 3.2 Gen 2) and the USB7206i (1x USB 3.2 Gen 2 to 2x USB 3.2 Gen 2). Each port is rated to 5V @ 900mA of power delivery per USB-IF specification. These ports can only wake in sleep and are not active in Hibernate system states.

Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC

The nominal power budget for all PoE ports on the Helix 520 and Karbon 520 Series is provided below. These values are provided for room temperature operating conditions. Please contact OnLogic for specific derating information for your installation.

Testing Conditions

• Temperature Range: 0ºC to 50ºC

• Step size: 5ºC / 10ºC

• Stress Levels

Results Summary

• Temperature Range: -40ºC to 70ºC

• Step size: 5ºC / 10ºC / 20ºC

• Stress Levels

Step 1: Remove the two screws in the rear of the system.

Step 2: Align the two screw holes on the back of the system with the holes in the DIN clip.

Step 3: Fasten the din clip with the screws removed in step 1 (M3X0.5 Flathead Screw, 6mm Long) WARNING: Using a screw longer than 6mm may damage the system.

Step 4: Hook the spring side of the DIN clip onto the DIN rail, then press firmly until the clip snaps over the other side of the rail.

Step 1: Remove the four screws in the rear of the system.

Step 2: Align the four screw holes on the back of the system with the holes in the DIN clip.

Step 3: Fasten the DIN clip with the screws removed in step 1 (M3X0.5 Flathead Screw, 6mm Long) WARNING: Using a screw longer than 6mm may damage the system.

Step 4: Hook the spring side of the DIN clip onto the DIN rail, then press firmly until the clip snaps over the other side of the rail.

Step 1: Remove the four screws in the rear of the system.

Step 2: Align the first 2 screw holes on the back of the system with the holes in the DIN clip.

Step 3: Fasten the DIN clip with the screws removed in step 1 (M3X0.5 Flathead Screw, 6mm Long) WARNING: Using a screw longer than 6mm may damage the system.

Step 4: Repeat steps 2-3 for the second DIN clip. Ensure the second DIN clip is oriented in the same direction as the first DIN clip

Step 5: Hook the spring side of the DIN clip onto the DIN rail, then press firmly until the clip snaps over the other side of the rail.

Step 1: Align the four screw holes on the bottom of the system with the respective holes on the mounting brackets.

Step 2: Attach wall mounting brackets (MTW101) or DIN mount Bracket (MTD102-K), to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).

Step 3 (Wall Mount only): Install system to surface using keyhole slots on wall mount brackets and appropriate hardware for the surface (not provided).

Step 4 (DIN Bracket only): Align the mounting holes of the din clip bracket to the three mounting holes on the wall mount bracket. Install the 6x M4 screws (M4x0.7 Self Tapping, Philips Head, 6mm Long) to secure the DIN clip.

Step 5 (DIN Bracket only): Hook the solid side of the DIN clip onto the DIN rail, then press firmly until the clip snaps over the other side of the rail.

Step 1: Peel feet from adhesive.

Step 2: Align feet with markings on Secondary Heatsink as shown.

Step 1: Align the four screw holes on the bottom of the system with the respective holes on the VESA bracket.

Step 2: Attach VESA Bracket to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long) Use a torque of at least 200 N-cm (18 in-lbs) to attach the bracket.

Step 3: Install the system to VESA 75 or VESA 100 mounting pattern using provided VESA Mount screws.

Step 1: Separate the two bracket segments by first removing the M4 screw on either side of the bracket (M4X0.7 Phillips head, 6 mm long). With the screws removed, the bracket segments can be separated by removing the smaller bracket from the hooked tabs on the top edge of the larger bracket.

Step 2: Align the screw holes indicated with “1” marking with the bottom holes of the system. Secure the system using the 4x supplied M3 screws (M3X0.5 Flathead Screw, 6mm Long). Use a torque of at least 200 N-cm (18 in-lbs) to attach the bracket.

Step 3: Install the large bracket/system assembly to a VESA 75 or VESA 100 mounting pattern on a monitor stand/arm using the provided M4x0.7 8mm length screws. Note the arrow marking on the bracket indicating which side of the bracket should be facing UP.

Step 4: Install the remaining smaller bracket to a monitor VESA 75 or VESA 100 mounting pattern using the provided M4x0.7 8mm long screws. Note the arrow marking on the bracket indicating which side of the bracket should be facing UP.

Step 5: Install the small bracket/monitor assembly to the large bracket/system assembly on the mounting arm by aligning the hooks/tabs and slot the pieces together. Secure the bracket segments together using the 2x M4 screws removed in Step 1.

Properly opening OnLogic systems does not void the warranty in most cases, however, some precautions are necessary to avoid damaging the system.

• Perform this disassembly in an area free of static discharge.

• Disconnect power, video, and any other connections to the system. It should be fully unplugged.

• Ideally, wear a grounding strap. If that is not available, regularly touch a grounded metal surface to discharge your body of static electricity.

All of the different system models in this series begin their disassembly by removing the bottom plate:

After removing the bottom plate, you will have access to the motherboard. The motherboard used is the same for all variants in the series. Here is the layout:

Reference the full here.

Windows Drivers

Please follow this link for a guide on updating your system's drivers:

LPMCU Tool

Reference here.

MCU Updates

DIO Python Package

Download Instructions

1. Download .zip File - For a simple copy of the files, use this direct download link:

2. Clone with Git - Use a terminal to clone the repository.

Python Package Documentation:

Drivers

Drivers are available in INF formats, which can be installed via a Windows deployment server, or through the Device Manager. Follow our guide for .

Windows 11 -

Please follow this link for a guide on updating your system's drivers:

Reference the full .

If the system fails to power on or is unresponsive, clearing the CMOS may help. It will also restore the BIOS to factory defaults.

• The CMOS reset button on all HX52X systems can be found next to the power button, as indicated here

• To perform the reset, begin by powering off the system

• While holding the reset button, press power button to power the system on

Description

Some Windows installation methods may result in serial port number collisions.

The Helix 520 Series systems implement three serial port types - PCH UART, SIO COM, and USB VCOM. Depending on the order of driver installation, Windows may assign duplicate serial port numbers (in the format COM[n]).

Resolution

Serial port numbers can be changed from the Windows Device Manager after driver installation, or drivers can be injected via enterprise deployment methods prior to first boot to mitigate this issue.

Windows installations performed by OnLogic are shipped with unique serial interface numbers. DIO Labeling

Description

The Helix 520 Series top plate DIO labeling has “-” and “GND” labels for pins that both connect to the DIO expansion isolated ground (ISO_GND). The other ground pins indicated by the system labeling are tied to the non-isolated DC GND. There is no functional impact to system performance, but some users may find this labelling confusing.

Resolution

GND label on the DIO connector will be changed to ISO_GND on a future revision.

Description

Ethernet port assignments in Windows may not be issued consistently between configurations due to Windows port enumeration rules, meaning that the indicated port numbers on the front of the system may not match the numbers assigned by Windows.

Resolution

Users/installers may associate external Ethernet port numbers with the Windows-assigned scheme using the Powershell command Get-NetAdapterHardwareInfo.

In the results generated by the command, adapter names and PCIe Bus numbers are displayed. The external port numbers from the plate label are equivalent to the PCIe Bus numbers (Port 1 = Bus 1, etc.). The Powershell command Rename-NetAdapter can then be used to rename Ethernet ports to user preference.

Description

Intel VMD is a technology allowing for internal storage to be added to RAID configurations without a discrete RAID controller. While OnLogic is not currently offering configurations that are VMD-compatible, the BIOS options for VMD are available for future use.

When VMD is enabled via the BIOS configuration menu, and drives are added to the VMD controller by enabling either VMD Global Mapping or adding individual drives to the VMD controller from the same menu page, systems may fail to boot after the configuration is applied.

Resolution

Users are advised to keep VMD and VMD Global Mapping disabled. There is no workaround.

RAID support is offered via a discrete controller in the Helix 522 model and is not affected by this issue.

Description

The Windows driver for the GPIO subsystem of the Microchip PCI11000 family IO controllers used on the Helix 523 model and MODBAY-04USB-02 expansion card is not signed, so Windows will not load it. A yellow bang ( ! ) warning indicator and error message is displayed in the Windows Device Manager.

This error message has no effect on system performance and may be ignored. The GPIO subsystem is required to be enabled on-chip for full function, but no direct driver/OS interaction is required.

Resolution

A signed driver release is in progress, and will be made available when it is complete.

Description

When attempting to use Wake-on-LAN (WoL) from S4 (hibernate) and S5 (soft off) power states, the system may hang, preventing proper system startup. This issue is specific to the Modbay-M12LAN01 card.

Resolution

For WoL from S4 or S5 power states, the Modbay-M12PoE or Modbay-4LAN cards should be used. The Modbay-M12LAN01 card is only recommended for Wake-on-LAN from S3 (sleep) power state.

Description

When Wake On PME is enabled in the BIOS but WoL is disabled in the operating system for LAN port 1 in Ubuntu 24.04 Desktop/Server, the disagreement in settings causes unintended wake events to occur from S4/S5.

Resolution

Ensure agreement between the wake on PME setting in the BIOS and WoL setting in the OS. If WoL functionality is desired, ensure both settings are enabled. If WoL functionality is not desired, ensure both settings are disabled.

This device has been tested to the relevant EMC and Safety standards. Modifications by the user may invalidate certifications. Testing included EN 55032, EN 55035, EN 60601-1-2, IEC 62368-1, IEC 60945 Ed. 4, and many others, please see specifications for details.

This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

CAN ICES-003(A) / NMB-003(A)

The computer system was evaluated for medical and IT equipment EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.

This product must be used with an in-line EMI filter when connected directly to a DC mains supply in maritime and DNV applications. The recommended EMI filter is a Delta 30DKCS5. Any filter used must be appropriately rated to handle the voltage and current draw of the system and must have a minimum insertion loss of 30dB at 1MHz.

Datasheet for the 30DKCS5 including electrical specifications, wiring diagram, and dimensions.

This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI). If this equipment is used in a domestic environment, radio interference may occur, in which case the user may be required to take corrective actions.

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.

1- Revision History

Helix 520 and Karbon 520 Series computers feature an embedded power sequencing controller and support isolated Digital Input/Output (DIO) and Controller Area Network (CAN) add-in cards. OnLogic may provide updates for the embedded sequencing controller over the product’s lifetime for feature enablement or product improvement.

The DIO module has 8 input and 8 output pins, an intrusion detection pin, two contact modes, and supports firmware updates. OnLogic provides a Low-Power Microcontroller Unit (LPMCU) command line utility to interact with the DIO microcontroller. Additionally, a custom Python package is provided in to natively embed the LPMCU tool functionality in scripting environments.

The CAN add-in card provides a two-channel CAN 2.0 A/B interface with configurable bitrates from 100 kbit/s to 1 Mbit/s. The CAN bus can be controlled programmatically on Linux using the interface or on Windows via a custom C++ API. More information on the CAN module can be found in .

Helix 520 and Karbon 520 Series computers support In-System Firmware Updates to both the DIO and power sequence microcontroller using the LPMCU tool from the download link provided in . To update the embedded sequence controller, the communications port must be enabled in the BIOS (see 3.1.1) before running either the Windows or Linux tool (3.1.2 / 3.1.3). The DIO controller VCOM port is always enabled when the add-in card is installed.

1. Power on the system and repeatedly press the “Delete” key to access the “Front Page” menu

2. Choose “Setup Utility”

3. Navigate to Advanced > PCH-IO Configuration > Serial IO Configuration

After completing the firmware update, the system must be shut down (reaching S5 state) in order to allow the new firmware to be loaded and executed properly.

The optional digital input/output (DIO) add-in-card (USB-16DIO-01) adds 8 digital inputs, 8 digital outputs, and an additional intrusion (INT) pin to the system.

*GND is provided as a return path for the intrusion detection switch. It is shared with the DIO - pin (ISO_GND).

The digital outputs (DO) are open-drain, and the digital inputs (DI) are high-impedance. Both DI and DO support two operating modes: wet contact and dry contact. The table below defines the logic levels for each mode based on the voltage state at the DIO terminal.

Pin V+ of the module should be connected to external power and ground. The high side of the load should be connected to the external power source, and the low side to the module DO pin. Additionally, the load current should not exceed 150 mA, while operating voltage ranges should be between 5 V to 30 V.

Setup required for Output:

Voltage is provided by the system. Each DO will output 11 V - 12.6 V when active.

Setup required for Output:

There is no internal pull up to the DI[0:7] pins when set to WET mode. Externally supplied 5 - 30V is recognized as logic 0 and 0 - 3V as logic 1 when DI[0:7] pins are set to wet contact mode.

Setup required for Input:

When the contact type is set to DRY mode, DI[0:7] are pulled up to the internal isolated ~12V supply. An open/floating connection is recognized as logic 0 and a short to GND as logic 1 when DI[0:7] pins are set to dry contact mode.

Setup required for Input:

The DIO card uses the USB-CDC communication protocol. On Windows, it will show up as “USB Serial Device (COMx)” in the device manager. On Linux, it will show up as “/dev/ttyACMx” in the serial device list.

The pin states and contact types of the DIO add-in-card can be controlled and read from using the LPMCU tool and Python API.

Command Summary of LPMCU

*See section 4.2 for mode definitions.

From Windows Command Prompt:

Using Ubuntu Terminal:

Python API Link:

Example code, setup instructions, and API specific documentation for the Python DIO utility are available below:

Full Link:

The Helix 520 / Karbon 520 Series provide an intrusion detection feature which is disabled by default. The DIO INT signal is assigned for intrusion detection. The intrusion detection feature must be enabled from the BIOS setup menu.

1. Navigate to the BIOS Setup Utility Menu.

2. Select Advanced.

3. Choose OnLogic Feature Configuration.

Power Button Emulation (SCI#)

When an intrusion event is detected in the Operating System environment by shorting the INT pin to ground, a power button press is triggered. The resulting action can be a shutdown, hibernation, sleep or nothing, depending on the OS configuration for power button events.

Perform Power Cycle (SMI#)

As soon as an intrusion event is detected, the system will shut down immediately.

The Helix 520 / Karbon 520 Series support In-System Firmware Updates for the DIO add-in-card using the lpmcu-tool which can be accessed within the link provided in Section 2. The commands are shown below with example outputs:

After updating the firmware, an AC power cycle is required to allow the new firmware to be loaded and executed properly.

The optional Helix 520 / Karbon 520 Series CAN add-in card (USB-02CAN-01) provides a two-channel CAN 2.0 A/B interface. The CAN bus consists of two signal lines: CAN High and CAN Low. In the dominant state, CAN High is driven to a high voltage potential of ~3.5 Volts and CAN Low is driven to a low voltage potential of ~1.5 Volts. A nominal voltage of ~2.5 Volts measured on each signal line relative to ground while the bus is idle serves as a reliable indicator of the Helix 520 / Karbon 520 Series CAN bus operational status. Additionally, the CAN bus operates in two states: dominant and recessive. The dominant state is represented by logic level 0, while the recessive state is represented by logic level 1. The CAN interface supports configurable bitrates from 10 kbit/s to 1 Mbit/s.

Diagram of a simplified CAN bus network.

The figure above shows: 1) One termination resistor at each end of the bus, 2) required endpoints of the bus acting as either transmitters or receivers, 3) High and Low CAN bus lines, and 4) additional (optional) network members connected on the same signal lines.

GitHub Repository Location: Driver installation instructions, program environment setup instructions, and example source code are found in .

Full Link:

Linux: The driver for the CAN add-in-card is included in the Linux kernel and should automatically be present on Linux Kernel 2.6.2+. If not, refer to the GitHub README in the link above for instructions on installation and usage.

Windows: Helix 520 / Karbon 520 Series systems purchased with Windows pre-installed ship with the drivers pre-installed as well. To install the CAN add-in-card driver on non-OEM provided Windows images, please refer to the README in the link above.

The ignition sense feature can be used to turn Karbon 520 Series units on and off with a battery, or vehicle’s ignition. It can also be used in non-automotive applications using a switch instead.

An example configuration is shown below. The switch connects positive DC power to the IGN pin. The unit will turn on when power is applied to the IGN pin, and turn off when power is removed. These events have configurable delays.

The Karbon 520 Series has three options for controlling automotive settings. The simplest method is to set them through the dedicated BIOS page. The LPMCU command-line tool can also configure automotive settings, provided that the access port in Windows is correctly enabled as described in . Additionally, the custom Python package provided in Section 2 can programmatically embed ignition sensing feature control within scripting environments.

Accessing Automotive Settings in the BIOS

• Power on the system and repeatedly press the Del to access the BIOS

• Arrow down and choose “Setup Utility” by pressing enter

• Navigate to the Advanced tab and open the Automotive Ignition menu.

• Set Automotive Mode Enabled

• The menu reveals the configurable options that can be set by the user

• Press F10 to save and exit.

Change Windows Power Button Settings

• Ignition sensing simulates a power button press. In Windows, the default behavior of the power button press is to put the system into Sleep mode. Change the power button press behavior to “Shut Down” instead.

• Windows “fast startup” will interfere with ignition sensing, so this should be disabled.

The following shows an example configuration for automotive timings by the LPMCU command line utility. Enter each command consecutively.

The set and get commands featured within the LPMCU tool are used to configure and retrieve settings:

• lpmcu set`` ``[command] [value]. This command is used to set or configure parameters related to the LPMCU.

• lpmcu get`` ``[command]. This command is used to retrieve the current value of a specific LPMCU command.

For further help text, type lpmcu set help or lpmcu get help

From Windows Command Prompt:

1- Product Overview

1.1- Introduction

The OnLogic Helix series integrates Intel® 10th generation Comet Lake processors, offering flexible installation, reliable solid-state performance, and unique expandability for various innovations. Helix systems utilize desktop processing within a compact form factor, previously limited to lower-wattage mobile CPUs. With OnLogic's Hardshell™ Fanless Technology, you can benefit from enhanced performance and thermal management of Intel 10th gen processing, alongside triple independent display support, an extended operating temperature range, and a wide input power range.

1.2- Safety

1.3- Box Contents & Accessories

• 4x Rubber Feet

Additional items such as mounting brackets, power supplies, or terminal block connectors, if purchased, will be found in the system box or outer shipping carton. For more details on accessories and features, visit the Helix series page.

Helix 500 Product Page Helix 600 Product Page

Note: The HX500 is pictured, the HX600 has the same I/O configuration. The location of the DIO option is different for the HX600.

Note: The rear I/O of the HX500 is shown below. The HX600 has the same connector orientations and locations on the motherboard. The location of the Terminal block power option is different for the HX600.

Power button / Power LED

The front power button can be used to turn the Helix system on and off. It is a momentary contact button with a blue LED backlight that indicates the system's status. A single press while the system is on will initiate a graceful shutdown from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset. The system can be woken from any state by a single press of the power button. A solid blue light on the LED backlight indicates the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.

SIM card

A 3FF Subscriber Identity Module (SIM) card slot is located on the front panel of the Helix platform, providing native support for OnLogic Cellular modules. The SIM signals can be connected to either the mPCIe or M.2 B-Key internal expansion slots, with the default BIOS setting being mPCIe. Refer to the BIOS user manual for more information. The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card, use a small implement to push the card into the slot until it clicks. To remove the card, push it with a small implement until it clicks, then pull the free end of the card to remove it.

COM DB9 option

The serial port mode and voltage between Off/5V on Pin 9 on Helix can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS manual in Appendix C for configuration instructions.

Audio

Audio input and output are provided via a 3.5mm CTIA audio jack on the front panel of the Helix platform. The audio codec used is a Realtek ALC233. Proper drivers must be installed for both the Q470 chipset and Realtek ALC233 codec. These downloads can be found within section 4 of this documentation page.

USB 3.2

There are four USB 3.2 Gen 2 ports on the front panel of the Helix platform, capable of 10Gb/s transfer rates.

4-Pin DIN power connector

Mainboard power is applied to the Helix platform via a locking 4-pin female DIN connector (Mating part: Kycon # KPPX-4P or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications.

The maximum rated current of the connector is 7A per pin. Use a wire gauge rated for the operational current. See below for the on-board connector pinout.

DisplayPort 1, 2, & 3

Helix utilizes Intel’s Integrated processor graphics, powering the onboard DisplayPorts. This supports resolutions up to 4096x2304 @ 60Hz simultaneously on all three outputs. All ports support Multi-Stream Transport (MST).

An optional CEC module can be included to add CEC (Consumer Electronics Control) functionality on DisplayPort 1 & 2. This feature is not supported on the DisplayPort 3 connector.

LAN1 - Intel I219-LM

The Intel I219 LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is an industry-standard RJ45. This port also features Intel’s vPro(R) technology, enabling remote out-of-band management and security features (requires Intel Core i5 or higher). The LAN link state is indicated by the two LEDs enclosed in the port, as described below.

LAN2 - Intel I210-IT

The second LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is an industry-standard RJ45. The LAN link state is indicated by the two LEDs enclosed in the port, as described below.

USB 3.2

The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2 ports, capable of 10Gb/s transfer rates. The two USB ports above the RJ45 LAN connectors are USB 3.2 Gen 1 ports, capable of 5 Gb/s.

Terminal block power option

If the terminal block power option is selected, mainboard power is applied to the Helix platform through a 4-pin terminal block connector (Mating part: Dinkle #2ESDAM-04P or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications. The maximum rated current of the connector is 15A per pin. Use a wire gauge rated for the operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal block with tinned wire ends or solid core wire. See below for connector pinout. When using the remote switch connections with the terminal block option, mating power switch cables should be twisted-pair wire with a floating shield to ensure proper immunity to EMI/RFI. It is recommended to keep wires less than 3 meters in length. Switches should be momentary contact type only.

The motherboard is the same for HX500 and HX600.

An M.2 B-Key port is present on the Helix motherboard to support B-Key form-factor expansion cards. Supported form-factors include 3042, 2242, 2260, and 2280. The B-Key connector supports PCIe Gen 3 x2, USB 3.2 5Gb/s, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices. The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slots. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Refer to the BIOS user manual for more information. The M.2 B-Key slot can be used in tandem with the M.2 M-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs; NVMe RAID is not supported by the chipset. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Refer to the BIOS user manual for information on using Rapid Storage Technology. A full pinout table for this expansion slot is provided in The Expansion port pintout.

An M.2 E-Key port is present on the Helix motherboard to support E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector on the Helix platform supports PCIe Gen 3 x1, USB 2.0, and Intel CNVi devices. A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3).

An M.2 M-Key port is present on the Helix motherboard to support M-Key form-factor expansion cards. Only 2280 form-factor cards are supported. The M-Key connector on the Helix platform includes support for PCIe Gen 3 x4, PCIe Gen 3 x2, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices. The M.2 M-Key slot can be used in tandem with the M.2 B-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs; NVMe RAID is not supported by the chipset. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Refer to the BIOS user manual for information on using Rapid Storage Technology. A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3).

An mPCIe port is present on the Helix motherboard to support mini-PCIe form-factor expansion cards. Full-length cards and half-length cards (with adapter) are supported. The mPCIe connector on the Helix platform supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is provided in A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3). The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slots. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Refer to the BIOS user manual (Appendix C) for more information.

The Helix platform has two onboard DDR4 SO-DIMM Slots. Specifications are as follows:

• Maximum Capacity: DDR4-2666 64GB with two 32GB SO-DIMM Modules

• Channel configuration: 1DIMM Per Channel (DPC) - 2 Channels

• No ECC Support

The two on-board COM headers utilize standard 9-pin 2.00mm pitch male pin headers with the pin configuration provided in the table below. These serial ports support RS-232, RS-422 Full-Duplex, and RS-485 half-Duplex configurations. The serial port communication mode can be selected in the BIOS configuration. Additionally, 5V power can be enabled on pin 9 in the same BIOS menu, rated to provide 250mA of current. Refer to the BIOS manual for configuration instructions.

For BIOS update instructions, refer to the BIOS Manual in section 4 for reflashing instructions.

The on-board power switch header can control the power state of the Helix platform in parallel with the front panel power button. Mating power switch cables should be twisted-pair wire with a floating shield to ensure proper immunity to EMI/RFI. The mating connector is a standard 2.54mm female header. It is recommended to keep wires less than 3 meters in length. Switches must be momentary contact type only.

A 2mm pin header and jumpers are used to clear the CMOS settings and select the hardware auto power-on behavior of the Helix platform. ATX mode can be selected by moving the pin jumper to connect pins 3 and 5. In ATX mode, the system power-on is controlled by the system power button or other supported wake events. When the pin jumper connects pins 1 and 3, the system operates in AT mode, powering on when system power is first applied. The default selection is ATX mode. The system CMOS settings can be cleared with the second pin jumper by following these steps:

1. Disconnect system power.

2. Place jumper in the “clear” position.

3. Wait 10 seconds.

4. Remove jumper from the “clear” position and return to default position.

The RTC battery on the Helix platform retains BIOS CMOS settings and maintains the system's real-time clock. If the RTC battery is low, CMOS settings will not be retained, and an alert may be received in the operating system. The cabled RTC battery should be replaced with a Maxell CR2032-WK11 (or UL listed equivalent). An equivalent battery must use a Hirose DF13-2S-1.25c connector to mate with the on-board connector.

Helix features an onboard TPM (Trusted Platform Module) header. Helix supports OnLogic’s module (OnLogic part TPM01) featuring TPM 2.0. This provides the option for a dedicated secure module to secure Helix through cryptographic keys.

The two on-board SATA Data connectors utilize the standard 7-pin SATA Data latching connector with the standard pin configuration. These connectors support SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps). Additionally, they support firmware-level RAID arrays using Intel Rapid Storage Technology. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Characteristics of the SATA ports, such as RAID arrays, can be configured in the BIOS; refer to the BIOS manual for further details.

The on-board SATA Power connector provides 5V and 12V power to multiple SATA devices with the pin configuration shown in the table below. It uses a 4-pin 2.50mm pitch male pin connector with an opening for a small retention tab. The connector is rated to 2A per contact. Any mating connector with the correct form factor, such as TE Connectivity part number 171822-4, can be used to connect a cable to the header. The connector can only be used to power internal devices.

The on-board fan header can power and control any three or four-wire fan (including variable-speed PWM fans) using the standard pin configuration shown in the table below. Three-wire fans will only connect to pins 1-3. This header utilizes a standard 4-pin 2.54mm pitch fan connector with a small retention tab. Any mating connector with the standard form factor, such as Molex part number 0470541000, can be used to connect a fan. Most CPU and case fans utilize this connector and pinout. The 12V pin on this connector can provide up to 1A of current.

The on-board USB 2.0 header provides a pair of USB 2.0 signals. It utilizes a standard 9-pin 2.54mm pitch male pin connector with the pin configuration shown in the table below. The 5V power pins (1 & 2) can provide up to 1A of current.

HDMI-CEC (Consumer Electronics Control) is a communication protocol that supports the control of displays over an HDMI interface. The Helix platform supports CEC via the optional add-on module ADP107. For a full description of supported features, refer to the ADP107 product manual here:

Mainboard power can be applied to the Helix platform via the locking 4-pin Molex Micro-Fit connector (Mating part: Molex # 0430250400 or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications. The maximum rated current of the connector is 8A per pin. Use a wire gauge rated for the operational current. See below for connector pinout.

The LGA1200 CPU socket on the Helix platform supports all 10th Gen Intel S-series processors up to 35W TDP.

The Helix platform features a standard PCI Express x16 slot on the bottom side that supports PCIe Gen 1 (2.5 GT/s), Gen 2 (5 GT/s), and Gen 3 (8 GT/s). Any PCIe x1, x4, x8, or x16 card using PCIe Gen 1 through Gen 3 will function in this slot. In the HX600, a riser card is included to add a PCIe expansion card to the expanded chassis.

Reference the full .

Intel® 10th Gen Comet Lake Core 35W Celeron/i3/i5/i7/i9

The power consumption of the H500 and H600 systems was measured for various system configurations, workloads, and power states at both 12V and 24V system input voltages. Tests were performed using Burnintest v9.0 build 1012 to stress system components with and without graphics enabled. These tests were performed with Intel Turbo Boost disabled; enabling Turbo will draw additional power. The build configurations and power consumption are listed in the tables below. (Note: system configurations using discrete GPUs are limited to 19V-24V input. Only 24V is tested for Configuration 3).

*The configurations below are using representative samples of internal devices; the specific components mentioned below may vary from the devices provided by OnLogic.

The power consumption for each system configuration is recorded below:

Config 1 Low Power Consumption

Config 2 Mid Power Consumption

Config 3 High Power Consumption

These specified DC levels are the absolute maximum values for the pins for system function and safety. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.

The base HX500 system can operate with an input voltage ranging from 8V - 24V DC; however, different configurations will impact total system draw and may limit input voltage flexibility in the final application. The minimum system voltage will be limited by total system power draw and the 14A current limit of the power connectors on the motherboard. The total system power draw should be divided by the input voltage to remain within the power connector's current limit and checked against supply capability. HX600 systems with GPU configurations should use no less than 19V at the input, with 24V recommended. Please contact OnLogic for assistance calculating the total max power draw of your desired configuration. Most HX500 systems operating at 8V with turbo enabled will exceed the input current limit. Systems with Intel Turbo Boost enabled can draw up to 70W at the CPU with stock settings. Additional internal system peripherals and USB loads may cause system instability due to protection mechanisms. Systems requiring an input voltage under 12V will achieve best stability by disabling CPU turbo, or by limiting peak CPU turbo draw under 50W with a custom BIOS. Please contact OnLogic sales for additional information on custom BIOS configurations.

The Helix platform supports multiple power states. Wake-up events can be configured in the BIOS. This section describes the supported power management functions and provides information on protection circuitry for power adapters.

The auto power on feature will turn the Helix system back on after a power loss. This can be useful for automatic recovery after a power outage, or applications where the system’s power button is not easily accessible.

• Power on the Helix unit and immediately press Del to access the Front Page config menu

• Using the arrow keys, navigate down to “Setup Utility” and press enter

• From the “Advanced” tab, select “PCH-IO Configuration”

• Change “Auto Power-On” to “Enabled”

• Press F10 to save and exit

• Press Enter to confirm

• Auto power on is now enabled

DIO option

The Helix platform supports an optional Isolated Digital I/O add-in card (OnLogic ADP120). This option enables integration of the Helix platform with existing PLC integrations or other digital logic applications. For a complete explanation of features, operating voltages, and safety information, refer to the DIO expansion information here:

The thermal performance of the Helix platform was validated by fully loading system components while the test system was exposed to high ambient temperatures in a thermal chamber environment. CPU and GPU clock speeds were measured for the duration of the test. Results were analyzed by comparing the average clock speed over the test duration to the rated base clock speed. A passing result was defined by an average clock speed no less than 10% of the rated base clock. No CPU or GPU throttling was observed during testing of both the HX500 and HX600 at the maximum rated temperature, with some configurations running above the base clock frequency.

The image below shows the thermal test results from an HX500 in a thermal chamber with an I9 10900T (10C @1.90GHz) processor installed over 10 hours at a 100% workload.

The table below shows the key takeaway values from the above test.

The image below shows the thermal test results from an HX600 in a thermal chamber over 4 hours. During the last hour of the test, after the system saturates at the required temperature, FurMark is started, running the GPU at 100% workload to find the system's limits.

The table below shows the key takeaway values from the above test.

Step 1: Attach wall mounting brackets to the chassis using the supplied screws. Specifications are as follows:

Screw type: M3X0.5 FH 120 Degree Screw

Length: 4 mm

Step 2: Locate the 4 holes that line up accordingly to the bracket as shown below.

Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.

Step 4 (for DIN Bracket): Using the outer 2 holes of the 3-hole set on the wall mount bracket, line up the DIN bracket.

Step 5 (for DIN Bracket): Using the supplied screws and a Phillips head screwdriver, mount the DIN bracket to the bracket.

Step 6 (for DIN Bracket): Mount system onto the DIN rail.

Step 1: Attach the VESA mounting plate to the chassis using:

Screw type: M3X0.5 FH 120 Degree Screw

Length: 4 mm

Step 2: Locate the 4 holes that line up accordingly to the bracket as shown.

Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.

Properly opening OnLogic systems does not void the warranty in most cases, however, some precautions are necessary to avoid damaging the system.

• Perform this disassembly in an area free of static discharge and with the system fully unplugged.

• Ideally, wear a grounding strap. If that is not available, regularly touch a grounded metal surface to discharge your body of static electricity.

• Begin by removing the 4x Phillips P2 screws circled in red.

• Next, use a small tool or your fingernail to pry the bottom place loose. It should come loose with minimal force.

• The bottom plate will fall away from the system and is completely disconnected.

• Set the plate aside. The disassembly process is complete.

• You now have access to the internals.

• This picture shows an example configuration.

Ram, WiFi, Primary Storage, Additional Storage

• Begin by removing the 5x Phillips P2 screws circled in red.

• Next, use a small tool or your fingernail to pry the bottom place loose. It should come loose with minimal force.

• The bottom plate will fall away from the system and is completely disconnected.

• Set the plate aside. The disassembly process is complete.

• You now have access to the internals.

• This picture shows an example configuration.

Ram, WiFi, Primary Storage, Additional Storage, PCI-E Expansion

• Begin by removing the two Phillips P1 retaining screws from the card bracket. Set the bracket aside.

• Determine the number of slots your PCI-E card takes up.

• For a single slot card, punch out the top cover. For a dual slot card, punch out both.

• Use pliers to bend the knockout a few times and it will fall off.

• Set PCI-E Card in the case and slide it into the slot.

• Reinstall the bracket removed in the first step. It will hold the card in place.

• If needed, push the card into position before fully tightening the screws.

• The card should appear level in the slot. If it is crooked, loosen the retaining screw and reposition it.

• The installation is complete.

For a detailed overview of the BIOS screens and individual settings, refer to the BIOS Manual:

Update the BIOS with the file(s) above. You can follow this guide for installation instructions.

Drivers

Drivers are available in INF formats, which can be installed via a Windows deployment server, or through the Device Manager.

The Helix platform complies with the EN 55032:2015 standards for radiated and conducted emissions limits. The unit is compliant with EN 55035:2016 and tailored by EN 60601-1-2 for ESD, radiated immunity, magnetic immunity, electrical fast transient (EFT) AC power line, dips/interrupts and EFT signal line immunity based on performance criteria in Tables 4, 5, 6, 7, 8, and 9.

ESD immunity tests were performed following EN 55035 in accordance with EN 61000-4-2 and EN 60601-1-2 in accordance with EN 61000-4-2. The unit does not exhibit susceptibility to 4-kV and 6-kV contact/8-kV air and 8kV contact/15kV air discharges applied singly or repetitively and directly or indirectly. The relative humidity during unit testing was measured to be between 30% and 60%. The Helix platform was unaffected during testing.

Radiated immunity tests were performed following EN 55035 in accordance with EN 61000-4-3 and EN 60601-1-2 in accordance with EN 61000-4-3. The system does not exhibit susceptibility to 10 V/m radiated electric fields, amplitude modulated at 1000 Hz, 80%, from 80 MHz to 6 GHz. Frequencies listed are samples and spots. The Helix platform was unaffected during testing. The system does not exhibit susceptibility to radiated electric fields, in accordance with EN 61000-4-3 Table 9. The Helix platform was unaffected during testing.

Magnetic immunity tests were performed following EN 60601-1-2 in accordance with EN 61000-4-8. The system does not exhibit susceptibility to radiated magnetic fields of 30 A/m at 50/60Hz. The Helix platform was unaffected during testing.

Electrical fast transient immunity tests were performed following EN 55035 in accordance with EN 61000-4-4 and EN 60601-1-2 in accordance with EN 61000-4-4. The system does not exhibit susceptibility to 1-kV/2-kV electrical fast transients, delivered in 5-kHz bursts to power lines. “A” result = No effect on EUT. The system does not exhibit susceptibility to 0.5-kV/1-kV electrical fast transients, delivered in 5-kHz bursts to signal lines. The Helix platform was unaffected during testing.

Dips/interrupts immunity tests were performed following EN 55035 and EN 60601-1-2 in accordance with EN 61000-4-11. The system does not exhibit susceptibility. The Helix platform was unaffected during testing.

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories:

JP-1: Failure to Boot Without RTC Battery

Overview

Description

The EXM501 does not initiate the power-up sequence if an RTC battery is not installed or the battery voltage is low (dead). Battery discharge primarily occurs in systems that are not connected to power. Expected battery lifetime in completely unpowered systems exceeds 3 years. Time spent in service while connected to external power does not count against the battery's expected lifetime, thus extending the time-to-failure. Customers with common use cases where power is applied at all (or nearly all) times should not expect to encounter this issue during the system's lifetime.

Workaround

None. If the system fails to boot, a user may confirm that battery voltage exceeds 2.7V and replace if needed.

Resolution

Power sequence timings were adjusted in revision F01-x0003R(5-current) to enable startup without a battery.

JP-2: Digital and Chassis Ground Not Isolated

Overview

Description

Beginning in PCB rev B01-00003R5, the SIM slot connects the digital and chassis ground planes, removing isolation between the two. Under normal operating conditions, the motherboard's function should not be affected. Customers who rely on chassis ground isolation are recommended to isolate the chassis from earth ground externally.

Resolution

Steps to mitigate the issue were taken in PCB B01-00003R8 by eliminating the short. The changes are present in F01-x0003R11.

This Helix 520 / Karbon 520 Series BIOS Manual covers OnLogic Custom Features and displays standard options and configurations in the BIOS. Additional content pertaining to other configurable elements may be added in subsequent versions of this manual.

To access the BIOS setup menu, hold the Delete key on the keyboard while turning the system on. After a few seconds, the BIOS front page menu will appear.

On each menu, the selected option is shown in white, other options are shown in blue, and read-only options are shown in gray. Some menus have multiple screens, which are shown at the top of the screen. The active screen has a gray background and inactive screens have blue backgrounds.

BIOS menus are navigated by pressing keys on the keyboard: