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ML100 Series

ML100G-10

This page also applies to the TM100 ThinManager Ready platform.

Technical Resources

Motherboard Manual

Jetway JNU93-2930 motherboard

https://drive.google.com/file/d/1OS3VDI8vUv9Vi4skQCSzaLflG6WyjXyv/view

Auto Power On

Disconnect the system from all wire connections (power, ethernet, video, etc), then:

  • Disconnect the unit from all wire connections (power, USB, ethernet, etc.)

  • Locate the auto power on jumper

  • The default position is disabled, unless specified otherwise at the time of purchase.

  • Lift the jumper off and reinstall it so it connects both pins.

  • Auto power on is now enabled.

If your unit fails to boot or power on, a CMOS reset may help. You will need to open the unit to perform the reset. This does not void your warranty, however, any damage caused by doing so will not be covered. Ensure your body is discharged of any static electricity by touching a grounded metal surface.

  • Remove the 4x phillips screws on the outside of the case.

  • Use the tab for leverage to pull the bottom panel off

â—Ź Locate the JBAT jumper pins near the ethernet port. â—Ź Use a flathead screwdriver or other conductive object to short the two pins together for 30 seconds. â—Ź The CMOS is now clear. â—Ź Power on the unit. Note: it may take 60 seconds to reconfigure itself and restart. Wait patiently after turning it on.

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.

ML100G-51 / ML100G-52

Technical information related to the system's motherboard can be found from the support link below.

As of 12/2025, all ML100G-53s will be shipping with either I225s or I226s NICs. This will be true until we run out of stock of the I225 motherboards

The ML100 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

  1. Ensure your body is discharged of any static electricity by touching a grounded metal surface.

  2. Remove the 4x phillips screws on the outside of the case.

clear CMOS

Security Advisory

Access Security Advisories
  • Use the tab for leverage to pull the bottom panel off

    1. The internals of the unit can now be accessed

    â—Ź Locate the PWR_JP1 jumper â—Ź Move it over by 1 pin â—Ź Auto power on is now enabled

    Note: This procedure requires opening the case first. See Internal Access section above.

    • Disconnect the unit from all wire connections (power, USB, ethernet, etc.)

    • Locate the CLRMOS1 jumper

    • Move the jumper over by 1 pin

    • Wait 30 seconds

    • Restore the jumper to its original position

    • Close up and power on the system. It may power cycle several times before it begins working again.


    For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories

    Technical Resources

    Manuals & Downloads

    Motherboard

    Internal Access

    Auto Power On

    Clear CMOS

    Regulatory

    Security Advisory

    47KB
    FCC and ISED Declaration.pdf
    PDF
    Open
    149KB
    UKCA Declaration.pdf
    PDF
    Open
    89KB
    ETL Authorization to Mark.pdf
    PDF
    Open
    55KB
    Safety Information.pdf
    PDF
    Open
    89KB
    CE EMC, Safety, RoHS 3.0 DoC.pdf
    PDF
    Open

    ML100G-40 / ML100G-41 / ML100G-53

    This page also applies to the TM120 ThinManager Ready platform.

    Technical Resources

    Internal Access

    The ML100 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

    1. Ensure your body is discharged of any static electricity by touching a grounded metal surface.

    2. Remove the 4x phillips screws on the outside of the case.

    3. Use the tab for leverage to pull the bottom panel off

    1. The internals of the unit can now be accessed


    Technical information related to the system's motherboard can be found from the support link below.

    As of 12/2025, all ML100G-53s will be shipping with either I225s or I226s NICs. This will be true until we run out of stock of the I225 motherboards

    â—Ź Power on the unit and press F2 a few times to access the BIOS. â—Ź Navigate to the Advanced tab â—Ź Open the Chipset Configuration menu â—Ź Locate the Restore on AC/Power Loss option â—Ź Set it to Power On â—Ź Press escape twice to go back â—Ź Navigate to the Exit tab, Save Changes and Exit

    Disconnect the system from all wire connections (power, ethernet, video, etc), then:

    â—Ź Locate the clear CMOS jumper â—Ź Move the jumper over by 1 pin â—Ź Wait 30 seconds â—Ź Restore the jumper to its original position â—Ź Close up and power on the system. It may power cycle several times before it begins working again.

    For increased reliability it is recommended to disable the Core Performance Boost BIOS setting. To disable the setting, navigate to: Advanced -> CPU Configuration -> Core Performance Boost -> Set to “Disabled”

    Press F10 to Save & Exit.


    Technical information related to the system's motherboard can be found from the support link below.

    As of 12/2025, all ML100G-53s will be shipping with either I225s or I226s NICs. This will be true until we run out of stock of the I225 motherboards

    ***Please note that the AMD CPU’s Core Performance Boost (similar to Intel’s TurboBoost) is disabled on this series in order to maintain thermal performance in line with the expected operating temperature.***

    The auto power on feature will automatically turn the ML100 back on after DC power is lost and restored. To enable it, a jumper needs to be moved inside the unit. The ML100 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

    • Ensure your body is discharged of any static electricity by touching a grounded metal surface.

    • Remove the 4x phillips screws on the outside of the case.

    • Use the tab for leverage to pull the bottom panel off

    • Remove the two screws from the USB board and gently lift it out of the way, leaving it plugged in.

    • Remove the blue jumper circled at the top and place it on the 2 pins circled in the bottom left.

    • Note: We are borrowing the clear CMOS jumper for this procedure. If CMOS needs to be cleared at a later date, keep that in mind.

    • Auto power on is now enabled and good to go.

    For increased reliability on systems with the optional 4X4-V2000M CPU, it is recommended to disable the Core Performance Boost BIOS setting. To disable the setting, navigate to: Advanced -> CPU Configuration -> Core Performance Boost -> Set to “Disabled”

    Press F10 to Save & Exit.

    • Disconnect the unit from all wire connections (power, USB, ethernet, etc.)

    • Remove the 4x phillips screws on the outside of the case.

    • Use the tab for leverage to pull the bottom panel off

    • Remove the two screws from the USB board and gently lift it out of the way, leaving it plugged in.

    • Locate the clear CMOS jumper

    • The jumper will initially be in this position.

    • Move the jumper over by 1 pin

    • Wait 30 seconds

    • Move the jumper back to its original position.

    • Re-assemble and power up the PC. Do not touch it for 2 minutes to allow it time to reconfigure itself. If it still does not respond, contact OnLogic support.

    Technical information related to the system's motherboard can be found from the support link below.

    As of 12/2025, all ML100G-53s will be shipping with either I225s or I226s NICs. This will be true until we run out of stock of the I225 motherboards

    Version
    Details
    Link

    Update the BIOS with the file(s) above. You can follow this guide for installation instructions.

    • Locate the jumper from your system’s accessory box.

    • If you need a replacement, this is a standard 2.54mm jumper. Available from .

    • Ensure your body is discharged of any static electricity by touching a grounded metal surface.

    • Disconnect the unit from all wire connections (power, USB, ethernet, etc.)

    • Remove the 4x phillips screws on the outside of the case.

    • Use the tab for leverage to pull the bottom panel off

    • Locate the auto power on header

    • Place the jumper onto the header. Use needle nose pliers if available.

    • Auto power on is now enabled.

    • Re-assemble the system and it will turn on automatically when you plug it in.

    • Disconnect the unit from all wire connections (power, USB, ethernet, etc.)

    • Remove the 4x Philips screws on the outside of the case.

    • Use the tab for leverage to pull the bottom panel off

    â—Ź Locate the clear CMOS jumper\

    • Using a flathead screwdriver or similar conductive metal object, short the outer 2 pins of the CMOS header for 30 seconds.

    • Re-assemble and power up the system. Wait patiently for 2 minutes as it will need to restart a couple times to reconfigure.

    • If the unit is still unresponsive after 2 minutes, contact support@onlogic.com.

    For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.

    1.80A

    Update to include Intel I226 LAN support

    ML100G-40

    Motherboard

    Auto Power On

    Clear CMOS

    Troubleshooting

    ML100G-41

    Motherboard

    Auto Power On

    Troubleshooting

    Clear CMOS

    ML100G-53

    Motherboard

    BIOS Updates

    Auto Power On

    Clear CMOS

    CAD & Drawings

    Regulatory

    Security Advisory

    how-to
    DigiKey
    ML100G-53 Dimensional Drawings
    Access Security Advisories
    12MB
    ML100G-53 Simplified.zip
    archive
    Open
    78KB
    UKCA DoC.pdf
    PDF
    Open
    98KB
    CE EMC, Safety, RoHS 3.0 DoC.pdf
    PDF
    Open
    110KB
    FCC & ISED Doc.pdf
    PDF
    Open
    Download

    ML100G-42

    1- Product Overview

    1.1- Introduction

    The ML100G-42 expands on the ML100G product range, harnessing the enhanced power and capabilities of the AMD Ryzen™ 7 8840U processor in a low profile fanless system built for the challenges of the IoT edge. With a 0 to 50°C operating temperature range, and a wealth of configuration options, the ML100G-42 was engineered with versatility in mind.

    1.2- Safety

    Safety Precations, Safeguards & Information

    Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.

    Modification of the device may void certifications, warranty and/or cause possible injury to the user

    Safe Use and Installation Instructions

    Précautions et guide d’installation

    Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.

    La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures Ă  l'utilisateur.

    Instructions d'utilisation et d'installation en toute sécurité

    1. Des précautions doivent être prises lors de la manipulation de l'appareil pour éviter de se blesser ou d'endommager l'appareil.

    1.3- Box Contents & Accessories

    If you purchased additional items such as mounting brackets, power supplies, or terminal block connectors, they will be located in the system box or within the outer shipping carton.

    All drivers and product guides can be found on the corresponding product page. For more information on accessories and additional features, visit the ML100G-42 product page at https://www.onlogic.com/store/ml100g-42/

    1.4- Product Specifications

    Processor

    Radio Specifications when equipped with INT-9260 Wifi/BT (device for indoor use)

    Specification
    Value

    The front power button can be used to turn on and off the ML100G-42 system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A solid blue light indicates that the system is powered in the S0 state. The LED is off in S4 and deeper states.

    The LAN1 on ML100G-42 supports up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by the two LEDs enclosed in the port.

    The LAN2 on ML100G-42 supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by the two LEDs enclosed in the port.

    The dual serial ports support RS-232 communication.

    Two M.2 M-Key ports are present on the ML100G-42 motherboard to allow support for M-Key form-factor expansion cards. Form-factors 2242/2280 are supported on the primary slot, and the secondary slot supports 2242 form-factor; both M-Key ports are PCIe Gen 4 x 4.

    An M.2 E-Key port is present on the ML100G-42 motherboard to allow support for E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe Gen 4 x1, USB 2.0.

    The ML100G-42 has two onboard DDR5 SO-DIMM slots with the following specifications:

    • Maximum Capacity: DDR5-5600 up to 96GB (48GB per DIMM)

    • Channel configuration: Dual Channels

    If the BIOS needs to be updated, please refer to the following steps for flashing the EEPROM:

    1. Save the BIOS ROM file in a USB thumb drive (FAT32 format).

    2. Enter BIOS Setup Utility by pressing F2 or DEL during boot.

    3. Navigate to Advanced -> Instant Flash.

    4. Choose the ROM file you’d like to update.

    The ML100G-42 utilizes the AMD Ryzen™ 7 8840U processor.

    The ML100G-42 supports multiple power states.

    The power input is a 12V~24V DC-In Jack. To power the device, use only UL ITE Listed external power supplies with a DC output of 12-24VDC.

    The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters.

    Wake-Up Event
    From ACPI State

    The system includes a BIOS option for auto power-on.

    1. Enter the system’s BIOS by pressing the DELETE key repeatedly as the system is powering up

    2. Navigate to Advanced -> Chipset

    3. Change the “Restore on AC/Power Loss” setting to “Power On”

    Hailo-8 M.2 AI Accelerator Information

    This system supports the installation of the Hailo-8 M.2 AI Acceleration Module. For more information on this product, here is a link to the manufacturer’s product site:

    And here is a link to their “Developer Zone”:

    Lastly, if you encounter any issues using the Hailo device, you can contact their customer support here:

    • Temperature: 50C

      • DC Load 1 Amps on 1x Back Panel USB port

      • DC Load 1 Amps on 1x Front panel USB port

    The ML100G-42 with AMD Ryzen 7 8840U CPU operated at a steady base clock speed on the CPU cores while sustaining significant processor, memory, and storage stress loads in an ambient temperature of 50ÂşC.

    The ML100G-42 has optional Wall Mount brackets (SKU: MTW101) and DIN Rail mounting brackets (SKU: MTW101-K) available for purchase. An optional VESA mounting bracket (SKU: MTV100-K) is also available.

    For Wall Mounting, follow the steps below:

    1. Align the four screw holes on the bottom of the system with the respective holes on the mounting brackets.

    2. Attach wall mounting brackets (MTW101) to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).

    3. Install the system to the surface using keyhole slots on wall mount brackets and appropriate hardware for the surface (not provided).

    For DIN Rail Mounting, follow the steps below:

    1. Follow steps 1-2 from the Wall Mounting section.

    2. Align the mounting holes of the DIN clip bracket to the three mounting holes on the wall mount bracket.

    3. Install the DIN clips to the wall mount brackets using supplied screws and a Phillips head screwdriver.

    Note: The mounting brackets are required to support 3x the hanging weight of the system (14.82lbs / 6.72 kgs). The mating surface and hardware must be capable of supporting the same load.

    Follow the steps below for VESA mounting:

    1. Align the four screw holes on the bottom of the system with the respective holes on the mounting bracket.

    2. Attach the VESA Mount Plate to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).

    3. Install the system to VESA 75 or VESA 100 mounting pattern using provided VESA Mount screws.

    The mounting bracket systems are required to secure 3x the hanging weight of the computer system (14.82lbs / 6.72 kgs). The mating substrate must be capable of maintaining the same rating.

    Click here for the

    The ML100G-42 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

    1. Ensure your body is discharged of any static electricity by touching a grounded metal surface.

    2. Remove the 4x phillips screws on the outside of the case.

    3. Use the tab for leverage to pull the bottom panel off

    1. The internals of the unit can now be accessed

    Please click this link to go to the ASRock webpage for the motherboard in this system. You can find download links to the most recent driver & BIOS versions in the Support tab on this page:

    BIOS Version
    Release Date
    Download Link

    Configure RAID setting on BIOS

    1. Press F2 upon system booting up to go to the BIOS menu.

    2. Go to Advanced > Chipset Configuration > NVMe RAID mode > Enabled

    3. Press F10 to save and exit.

    Windows 11 RAID Installation

    For Windows OS, the AMD RAID requires three drivers to be loaded, and the sequence is rcbottom -> rcraid -> rccfg.

    1. Boot to Windows installation (two separated disks here due to inbox driver doesn’t support AMD RAID)

    2. Load the driver “rcbottom”, it will turn all the disks to be empty

    3. Load the driver “rcraid”, you should be able to see the RAID volume here

    4. Load “rccfg” to complete the AMD RAID installation.

    The JP1 Header can be used to clear the CMOS by setting pins 4-6. The system will auto clear CMOS when booting improperly.

    1. Disconnect the unit from all wire connections (power, USB, ethernet, etc.)

    2. Locate the JP1 header, located in the red circle in this image:

    1. Short pins 4 & 6, indicated in the image, with a jumper or the tip of a screwdriver

    1. Hold in place for 30 seconds

    2. Remove the jumper/screwdriver

    3. Close up and power on the system. It may power cycle several times before it begins working again.

    The computer system was evaluated for medical, IT equipment, automotive, and maritime EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing includes: EN 55032, EN 55035, IEC 60601-1, EN 62368-1, EN 60950-1, and IEC 60945. Product safety was evaluated to IEC 62368-1 and IEC 60950-1.

    This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

    This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

    Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. CAN ICES-003(A) / NMB-003(A)

    The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.

    For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.

    Revision History
    Date

    RF output power

    20dBm (2400-2485 MHz) IEEE 802.11b/g/n & BT

    10dBm (2400-2485 MHz) BLE

    23dBm (5150-5725 MHz) IEEE 802.11a/n/ac

    13.98 dBm (5725-5875MHz) IEEE 802.11a/n/ac

    Type of Modulation

    2.4GHz: DSSS/OFDM/FHSS

    5 GHz: OFDM

    Antenna Specifications

    ANT200 - PIFA type with 2dBi/2dBi gain on 2.4 & 5 GHz

    Modes of operation

    Duplex (Tx/Rx)

    Duty cycle (access protocol)

    As In: IEEE 802.11 a/b/g/n/ac

    Follow the instructions on the screen.

  • When the programming is completed, press Enter to reboot the system.

  • RTC Wake set by BIOS

    Deep S5, S5, S3

    RTC Wake set by OS

    S3

    Application: BurnIn Stress 7 test, Furmark, H/W monitoring
    Mount system onto the DIN rail.
    Press F2 again to boot to BIOS.
  • There will be a new row “RAIDXpert2 Configuration Utility” under the Advanced tab.

  • Go to RAIDXpert2 Configuration Utility. You will see the number for Total Physical Device Count and Total Logical Array Count are both listed as 2 (since you have 2 drives with 2 separated arrays).

  • Now go to Array Management > Manage Array Properties > Select Array. You’ll see 2 Non-RAID arrays.

  • Go back to previous page and go to Delete Array

  • Click Check All to select both arrays and set to Enabled, click Delete Array(s).

  • Now go to Create Array. Select desired RAID level.

  • Click Select Physical Disks. Click Check ALL to set both disks as Enabled. Click Apply Changes.

  • Click Create Array.

  • Go to Manage Array Properties > Select Array. Now you’ll see it appears as a single array under RAID 0.

  • Press F10 to save and exit, and start the Windows 11 Pro installation.

  • The RAID disk is ready for Windows installation now!

  • Care must be taken handling the device to prevent injury to self or possibility of damaging the unit.
  • Read the entire manual before using the product.

  • Install the device securely per users manual instructions.

  • To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.

  • Wall or ceiling mounting device requires use of OnLogic mounting plate or bracket.

  • Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom or rear of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.

  • Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or enclosure during operation and 30 minutes after shutdown allowing the unit to cool down.

  • Ambient operating temperature must be between 0 °C to 50 °C with a non-condensing relative humidity of 10-85%.

  • The device can be stored at temperatures between -10 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, minimum 3HR.

  • Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.

  • Do not clean the device with liquids. The chassis can be cleaned with a dry cloth or duster only. To prevent injury to self and/or damage to the device the unit must be powered down and all connecting power and other peripherals shall be disconnected prior to cleaning.

  • Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then recommended device orientation is such that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.

  • This device is intended for indoor operation only.

  • Caution, Risk of Electric Shock! Unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!

  • To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC, see specs for details.

  • Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.

  • Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.

  • Install the device only with shielded network cables.

  • The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.

  • Radio device is not intended for emergency service use.

  • Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.

  • Proper disposal of CMOS battery must comply with local governance.

  • Product must only be connected to a certified router, switch or similar network equipment

  • Product is intended for indoor use only.

  • Product cannot be connected to the public network.

  • This equipment is not suitable for use in locations where children are likely to be present.\

  • WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.

  • Lisez l'intĂ©gralitĂ© du manuel avant d'utiliser le produit.

  • Installez l'appareil en toute sĂ©curitĂ© selon les instructions du manuel de l'utilisateur.

  • Pour vous protĂ©ger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes double bande fournies avec un gain de 2 dBi/2 dBi.

  • Le dispositif de montage mural ou au plafond nĂ©cessite l'utilisation d'une plaque ou d'un support de montage. La plaque ou le support doit ĂŞtre en mĂ©tal et avoir une Ă©paisseur minimale de 1 mm.

  • Utilisez des vis Ă  tĂŞte plate M4x0,5 mm pour fixer la plaque de montage ou les supports de montage aux trous filetĂ©s au bas ou Ă  l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'Ă©paisseur supplĂ©mentaire de plaque ou de support au-delĂ  de 1,5 mm.

  • Attention surface chaude! Il est normal que l'appareil chauffe et soit chaud au toucher. Ne touchez pas la zone du dissipateur thermique ou le boĂ®tier pendant le fonctionnement et 30 minutes après l'arrĂŞt pour permettre Ă  l'unitĂ© de refroidir.

  • La tempĂ©rature ambiante de fonctionnement doit ĂŞtre comprise entre 0 °C et 50 °C avec une humiditĂ© relative sans condensation de 10 Ă  85 %.

  • L'appareil peut ĂŞtre stockĂ© Ă  des tempĂ©ratures comprises entre -10 °C et 85 °C. Remarque : L'unitĂ© doit ĂŞtre stabilisĂ©e Ă  la tempĂ©rature de fonctionnement avant utilisation, minimum 3 heures.

  • Gardez l'appareil Ă  l'Ă©cart des liquides et des matĂ©riaux inflammables. Ne pas installer dans un environnement dangereux.

  • Ne nettoyez pas l'appareil avec des liquides. Le châssis peut ĂŞtre nettoyĂ© uniquement avec un chiffon sec ou un plumeau. Pour Ă©viter de se blesser et/ou d'endommager l'appareil, l'appareil doit ĂŞtre Ă©teint et toutes les alimentations et autres pĂ©riphĂ©riques doivent ĂŞtre dĂ©connectĂ©s avant le nettoyage.

  • PrĂ©voyez un espace suffisant autour de tous les cĂ´tĂ©s de l'appareil pour un refroidissement correct et pour ne pas dĂ©passer sa limite de tempĂ©rature de fonctionnement maximale. Si l'appareil est montĂ© sur une surface verticale, l'orientation recommandĂ©e de l'appareil est telle que les ailettes du dissipateur thermique permettent Ă  l'air de monter sans obstruction. Des orientations alternatives peuvent entraĂ®ner une plage de tempĂ©ratures de fonctionnement rĂ©duite.

  • Cet appareil est destinĂ© Ă  une utilisation en intĂ©rieur uniquement.

  • Attention, risque de choc Ă©lectrique ! L'unitĂ© est alimentĂ©e uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) Ă  l'appareil !

  • Pour alimenter l'appareil, utilisez uniquement des alimentations externes rĂ©pertoriĂ©es UL ITE avec une sortie CC de 12-24 VCC, voir les spĂ©cifications pour plus de dĂ©tails.

  • Les mĂ©thodes de câblage utilisĂ©es pour le raccordement de l'Ă©quipement Ă  l'alimentation secteur doivent ĂŞtre conformes au Code national de l'Ă©lectricitĂ©, NFPA 70, et au Code canadien de l'Ă©lectricitĂ©, Partie I, CSA C22.1.

  • PrĂ©voyez suffisamment d'espace pour les connexions de câblage du bornier afin que les fils ne se plient pas et soient protĂ©gĂ©s contre les dommages accidentels.

  • Installez l'appareil uniquement avec des câbles rĂ©seau blindĂ©s.

  • L'installateur doit avoir de l'expĂ©rience dans l'installation de pièces de rechange et ĂŞtre familiarisĂ© avec les pratiques gĂ©nĂ©rales d'installation de composants Ă©lectroniques.

  • L'appareil radio n'est pas destinĂ© aux services d'urgence.

  • L'entretien et la rĂ©paration de l'appareil doivent ĂŞtre effectuĂ©s par un personnel qualifiĂ©. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit ĂŞtre du mĂŞme type que celle d'origine.

  • L'Ă©limination appropriĂ©e de la batterie CMOS doit ĂŞtre conforme Ă  la gouvernance locale.

  • Le produit doit uniquement ĂŞtre connectĂ© Ă  un routeur, un commutateur ou un Ă©quipement rĂ©seau similaire certifiĂ©

  • Le produit est destinĂ© Ă  une utilisation en intĂ©rieur uniquement.

  • Le produit ne peut pas ĂŞtre connectĂ© au rĂ©seau public.

  • Cet Ă©quipement n'est pas adaptĂ© Ă  une utilisation dans des endroits oĂą des enfants sont susceptibles d'ĂŞtre prĂ©sents.

  • ATTENTION: Il existe un risque d'explosion si la pile CMOS n'est pas remplacĂ©e correctement. L'Ă©limination de la batterie dans le feu ou dans un four chaud, ou l'Ă©crasement ou le dĂ©coupage mĂ©canique d'une batterie peut entraĂ®ner une explosion.

    \

    AMD Ryzen 7 8840U

    Memory

    2x DDR5-5600 SO-DIMM up to 96GB

    Integrated Graphics

    AMD Radeon Graphics

    Front I/O

    1x USB 3.2 Gen 2 (Type-A)

    2x USB 4 (Type-C, 5V/3A, DP1.4a) - Supports Locking Connectors

    1x Audio Jack (MIC-in, Line-out)

    1x Power Button (w/ LED indicator)

    Back I/O

    2x HDMI 2.1

    1x 2.5 GbE LAN

    1x 1 GbE LAN

    2x USB 2.0

    1x DC Jack (12V~24V)

    Expansion & Storage

    1x M.2 2230 E-key (Wi-Fi) (PCIe Gen 4 x1/ USB 2.0)

    1x M.2 2242/2280 M-key (PCIe Gen 4 x 4)

    1x M.2 2242 M-key (PCIe Gen 4 x4)

    Onboard Headers & Connectors

    1x Battery on a cable

    Special Features

    Watchdog timer

    RTC

    AMD FW TPM

    BIOS option for auto power-on

    Optional Add On Module

    2x COM (RS-232)

    Operating Systems

    Windows 11 Pro 64 Bit

    Windows 10 IoT Enterprise LTSC 2021

    Windows 11 IoT Enterprise LTSC 2024

    Ubuntu 24.04 Desktop / Server

    LAN controller

    1x Realtek RTL8125BG (2.5Gbe)

    1x Realtek RTL8111H (1Gbe)

    Power Input

    12V~24V DC-In Jack

    Dimensions

    142 x 61.5 x 111 mm

    Weight

    1.2 kg / 2.63 lbs (System Only)

    Motherboard Dimensions

    104 x 36 x 102 mm

    Mounting Options

    DIN

    Wall

    VESA

    Thermal Standards

    System Operating Temperature: 0-50C

    Storage Temperature: -10-85C

    Operating Humidity: 0% - 90%

    Extra Chassis Features

    3 Antenna holes

    Kensington Lock

    Frequency Bands

    2.4GHz and 5GHz bands

    Operating Frequency

    2400 - 2485 MHz

    5150 - 5250 MHz, 5250 - 5350 MHz

    5470 - 5725 MHz, 5725 - 5878 MHz

    Channel spacing / Bandwidth

    2.4GHz: 802.11b/g/n; 5 MHz / BT: 1MHz

    Bandwidth: 20 MHz / 40 MHz

    5 GHz: 802.11a/n/ac: 20, 40, 80, 160 MHz

    Power Button

    Deep S5, S5, S3

    LAN

    S5, S3

    USB

    S3

    1.60E

    03/03/2026

    Download

    Manual Creation Version 1.0

    10/23/2024

    2- Technical Specifications

    2.1- External Features

    Front I/O

    Back I/O

    2.2- I/O Definitions

    Front I/O Definition

    Power button / Power LED

    Rear I/O Definition

    LAN LED

    COM DB9 (optional)

    2.3- Motherboard Connectors

    M.2 M-Key

    M.2 E-Key

    SO-DIMM

    BIOS EEPROM

    JP1 Header

    System Panel Header

    2.4- Motherboard Manual

    2.5- Processor

    2.6- Power Management

    Recommended Power Supply

    Wake-Up Events

    Auto Power On

    2.7- Add-in Modules

    2.8- Thermal Results

    Test Conditions

    Test Results

    Test Result Summary

    2.9- Block Diagram

    3- Installation & Mechanical

    3.1- Dimensions

    3.2- Mounting

    Wall Mount

    DIN Rail Mounting

    VESA Mounting

    MK022 Fanless Rackmount Adapter

    3.3- Internal Access

    3.4- CAD & Drawings

    4- Software & Firmware

    4.1- Drivers & Downloads

    4.2 - BIOS

    4.3- Features & Configuration

    5- Support & Compliance

    5.1- Troubleshooting & FAQs

    Clear CMOS

    5.2- Regulatory

    CE

    FCC Statement

    ISED

    UKCA

    Download Documents

    5.3- Security Advisory

    5.4- Appendices

    Revision History

    Click here for the Motherboard Manual
    https://hailo.ai/products/ai-accelerators/hailo-8-m2-ai-acceleration-module
    https://hailo.ai/authorization/?redirect_to=https%3A%2F%2Fhailo.ai%2Fdeveloper-zone%2F
    https://hailo.ai/company-overview/contact-us
    MK022 Product Manual
    ML100G-42 Dimensional Drawings
    Click here for Driver & Download content
    Access Security Advisories
    LAN activity light description
    LAN2 activity light description
    COM DB9 Pinout
    M.2 M-Key Pinout
    17MB
    ML100G-42 Simplified.zip
    archive
    Open
    110KB
    ML100G MTBF Summary.pdf
    PDF
    Open

    ML100G-54

    The ML100G-54 expands on the ML100G product range, harnessing the enhanced power and capabilities of the Intel® Alder Lake-N N97 processor in a low profile fanless system built for the challenges of the IoT edge. With a 0 to 50°C temperature range, and a wealth of configuration options, the ML100G-54 was engineered with versatility in mind.

    If you purchased additional items such as mounting brackets, power supplies, or terminal block connectors, they will be located in the system box or within the outer shipping carton. All drivers and product guides can be found on the corresponding product page.

    All drivers and product guides can be found on the corresponding product page. For more information on accessories and additional features, visit the ML100G-54 product page at .

    Specification
    Value

    Processor

    Intel 12th Gen Alder Lake N97 Processor

    Memory

    1x DDR4-3200 SO-DIMM up to 32GB

    Integrated Graphics

    Intel UHD Graphics

    Front I/O

    2x USB 3.2 Gen 2 (Type-A)

    2x USB 3.2 Gen 2 (Type-C, 5V/3A, DP1.4a) - Supports 1 Locking Connector

    1x Audio Jack (MIC-in, Line-out)

    1x Power Button (w/ LED indicator)

    Back I/O

    Radio Specifications when equipped with INT-9260 Wifi/BT (device for indoor use)

    Frequency Bands

    2.4GHz and 5GHz bands

    Operating Frequency

    2400 - 2485 MHz

    5150 - 5250 MHz, 5250 - 5350 MHz

    5470 - 5725 MHz, 5725 - 5878 MHz

    Channel spacing / Bandwidth

    2.4GHz: 802.11b/g/n; 5 MHz / BT: 1MHz

    Bandwidth: 20 MHz / 40 MHz

    5 GHz: 802.11a/n/ac: 20, 40, 80, 160 MHz

    RF output power

    20dBm (2400-2485 MHz) IEEE 802.11b/g/n & BT

    10dBm (2400-2485 MHz) BLE

    23dBm (5150-5725 MHz) IEEE 802.11a/n/ac

    13.98 dBm (5725-5875MHz) IEEE 802.11a/n/ac

    The front power button can be used to turn on and off the ML100G-54 system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A solid blue light indicates that the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state (S3). The LED is off in S4 and deeper states.

    The LAN Ports on ML100G-54 support up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by the two LEDs enclosed in the port. The description is included below.

    LAN activity light description

    The serial port supports RS-232, RS-422, and RS-485 configurations.

    COM DB9 pinout

    An M.2 M-Key port is present on the ML100G-54 motherboard to allow support for M-Key form-factor expansion cards. 2242/2260/2280 form-factors are supported. The M-Key connector includes support for PCIe Gen3 x 1, SATA Gen III (6.0Gbps) devices.

    An M.2 E-Key port is present on the ML100G-54 motherboard to allow support for E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe Gen 3 x1, USB 2.0.

    SO-DIMM

    The ML100G-54 has one onboard DDR4 SO-DIMM slot with the following specifications:

    • Maximum Capacity: DDR4-3200 32GB

    • Channel configuration: Single Channel

    • In-Band ECC Supported

    BIOS EEPROM

    If the BIOS needs to be updated, please refer to the following steps for flashing the EEPROM:

    1. Save the BIOS ROM file in a USB thumb drive (FAT32 format).

    2. Enter BIOS Setup Utility by pressing F2 or DEL during boot.

    3. Navigate to Advanced -> Instant Flash.

    4. Choose the ROM file you’d like to update.

    5. Follow the instructions on the screen.

    6. When the programming is completed, press Enter to reboot the system.

    Access the official Motherboard manual here: Motherboard Manual

    The ML100G-54 utilizes the Intel 12th Gen Alder Lake N97 Processor

    The ML100G-54 supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters.

    Wake-Up Event
    From ACPI State

    Power Button

    Deep S5, S5, S3

    LAN

    S5, S3

    USB

    S3

    The system includes a BIOS option for auto power-on.CommentShare feedback on the editor

    1. CommentShare feedback on the editorEnter the system’s BIOS by pressing the DELETE key repeatedly as the system is powering up

    2. CommentShare feedback on the editorNavigate to Advanced -> Chipset

    3. CommentShare feedback on the editorChange the “Restore on AC/Power Loss” setting to “Power On”

    The ML100G-54 supports an optional Isolated Digital I/O add-in card (OnLogic ADP120 DIO). This option allows for interfacing with digital logic applications. For a complete explanation of features, operating voltages, and safety information, please refer to the DIO expansion manual link below:

    ADP120 DIO

    • Temperature: 50 ° C soaking for minimum of 2hrs

    • Conditions:

      • DC Load 1 Amps on 1x Back Panel USB port

      • DC Load 1 Amps on 1x Front panel USB port

      • DC Load 1.5 Amps on each of Type-C ports (total 3 Amps)

      • Application: BurnIn Stress 7 test, Furmark, H/W monitoring

    The ML100G-54 with the Intel Alder Lake N97 processor operated upwards of 80% of its rated base clock speeds on the CPU cores while sustaining significant processor, memory, and storage stress loads in an ambient temperature of 50ÂşC.

    The ML100G-54 has optional Wall Mount brackets (SKU: MTW101) and DIN Rail mounting brackets (SKU: MTW101-K) available for purchase. The ML100G-54 has an optional VESA mounting bracket (SKU: MTV100-K) available for purchase. Follow the steps below for mounting.

    For Wall Mounting, follow these steps:

    1. Align the four screw holes on the bottom of the system with the respective holes on the mounting brackets.

    2. Attach wall mounting brackets (MTW101) to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).

    3. Install system to surface using keyhole slots on wall mount brackets and appropriate hardware for the surface (not provided).

    For DIN Rail Mounting, follow these steps:

    1. Follow steps 1-2 from the Wall Mounting section.

    2. Align the mounting holes of the DIN clip bracket to the three mounting holes on the wall mount bracket.

    3. Install the DIN clips to the wall mount brackets using supplied screws and a Phillips head screwdriver.

    4. Mount system onto the DIN rail.

    Note: The mounting brackets are required to support 3x the hanging weight of the system (14.82lbs / 6.72 kgs). The mating surface and hardware must be capable of supporting the same load.

    1. Align the four screw holes on the bottom of the system with the respective holes on the mounting bracket.

    2. Attach VESA Mount Plate to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).

    3. Install the system to VESA 75 or VESA 100 mounting pattern using provided VESA Mount screws.

    The mounting bracket systems are required to secure 3x the hanging weight of the computer system (14.82lbs / 6.72 kgs). The mating substrate must be capable of maintaining the same rating.

    Click here for the Fanless Rackmount Adapter Manual: MK022 Product Manual

    The ML100G can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

    1. Ensure your body is discharged of any static electricity by touching a grounded metal surface.

    2. Remove the 4x phillips screws on the outside of the case.

    3. Use the tab for leverage to pull the bottom panel off

    1. The internals of the unit can now be accessed

    ML100G-54 Dimensional Drawings

    Click here for access to Drivers & Downloads: Drivers

    BIOS Version
    Release Date
    Download Link

    1.70E

    03/03/2026

    The JP1 Header can be used to clear the CMOS by setting pins 4-6. The system will auto clear CMOS when booting improperly.

    1. Disconnect the unit from all wire connections (power, USB, ethernet, etc.)

    2. Locate the JP1 header, located in the red circle in this image:

    1. Short pins 4 & 6, indicated in the image, with a jumper or the tip of a screwdriver

    1. Hold in place for 30 seconds

    2. Remove the jumper/screwdriver

    3. Close up and power on the system. It may power cycle several times before it begins working again.

    The computer system was evaluated for medical, IT equipment, automotive, and maritime EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing includes: EN 55032, EN 55035, IEC 60601-1, EN 62368-1, EN 60950-1, and IEC 60945. Product safety was evaluated to IEC 62368-1 and IEC 60950-1.

    This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

    This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

    Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

    CAN ICES-003(A) / NMB-003(A)

    The computer system was evaluated for medical, IT equipment, automotive, maritime, and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.

    For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories

    Manual Creation Version 1.0
    10/23/2024

    1- Product Overview

    1.1- Introduction

    1.2- Safety

    Safe Use and Installation Instructions

    Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.

    Modification of the device may void certifications, warranty and/or cause possible injury to the user.

    1. Care must be taken handling the device to prevent injury to self or possibility of damaging the unit.

    2. Read the entire manual before using the product.

    3. Install the device securely per users manual instructions.

    4. To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.

    5. Wall or ceiling mounting device requires use of OnLogic mounting plate or bracket.

    6. Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom or rear of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.

    7. Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or enclosure during operation and 30 minutes after shutdown allowing the unit to cool down.

    8. Ambient operating temperature must be between 0 °C to 50 °C with a non-condensing relative humidity of 10-85%.

    9. The device can be stored at temperatures between -10 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, minimum 3HR.

    10. Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.

    11. Do not clean the device with liquids. The chassis can be cleaned with a dry cloth or duster only. To prevent injury to self and/or damage to the device the unit must be powered down and all connecting power and other peripherals shall be disconnected prior to cleaning.

    12. Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then recommended device orientation is such that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.

    13. This device is intended for indoor operation only.

    14. Caution, Risk of Electric Shock! Unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!

    15. To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC, see specs for details.

    16. Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.

    17. Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.

    18. Install the device only with shielded network cables.

    19. The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.

    20. Radio device is not intended for emergency service use.

    21. Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.

    22. Proper disposal of CMOS battery must comply with local governance.

    23. Product must only be connected to a certified router, switch or similar network equipment

    24. Product is intended for indoor use only.

    25. Product cannot be connected to the public network.

    26. This equipment is not suitable for use in locations where children are likely to be present.

    WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.

    Précautions et guide d’installation

    Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.

    La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures Ă  l'utilisateur.

    1. Des précautions doivent être prises lors de la manipulation de l'appareil pour éviter de se blesser ou d'endommager l'appareil.

    2. Lisez l'intégralité du manuel avant d'utiliser le produit.

    3. Installez l'appareil en toute sécurité selon les instructions du manuel de l'utilisateur.

    4. Pour vous protéger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes double bande fournies avec un gain de 2 dBi/2 dBi.

    5. Le dispositif de montage mural ou au plafond nécessite l'utilisation d'une plaque ou d'un support de montage. La plaque ou le support doit être en métal et avoir une épaisseur minimale de 1 mm.

    6. Utilisez des vis à tête plate M4x0,5 mm pour fixer la plaque de montage ou les supports de montage aux trous filetés au bas ou à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support au-delà de 1,5 mm.

    7. Attention surface chaude! Il est normal que l'appareil chauffe et soit chaud au toucher. Ne touchez pas la zone du dissipateur thermique ou le boîtier pendant le fonctionnement et 30 minutes après l'arrêt pour permettre à l'unité de refroidir.

    8. La température ambiante de fonctionnement doit être comprise entre 0 °C et 50 °C avec une humidité relative sans condensation de 10 à 85 %.

    9. L'appareil peut être stocké à des températures comprises entre -10 °C et 85 °C. Remarque : L'unité doit être stabilisée à la température de fonctionnement avant utilisation, minimum 3 heures.

    10. Gardez l'appareil à l'écart des liquides et des matériaux inflammables. Ne pas installer dans un environnement dangereux.

    11. Ne nettoyez pas l'appareil avec des liquides. Le châssis peut être nettoyé uniquement avec un chiffon sec ou un plumeau. Pour éviter de se blesser et/ou d'endommager l'appareil, l'appareil doit être éteint et toutes les alimentations et autres périphériques doivent être déconnectés avant le nettoyage.

    12. Prévoyez un espace suffisant autour de tous les côtés de l'appareil pour un refroidissement correct et pour ne pas dépasser sa limite de température de fonctionnement maximale. Si l'appareil est monté sur une surface verticale, l'orientation recommandée de l'appareil est telle que les ailettes du dissipateur thermique permettent à l'air de monter sans obstruction. Des orientations alternatives peuvent entraîner une plage de températures de fonctionnement réduite.

    13. Cet appareil est destiné à une utilisation en intérieur uniquement.

    14. Attention, risque de choc électrique ! L'unité est alimentée uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) à l'appareil !

    15. Pour alimenter l'appareil, utilisez uniquement des alimentations externes répertoriées UL ITE avec une sortie CC de 12-24 VCC, voir les spécifications pour plus de détails.

    16. Les méthodes de câblage utilisées pour le raccordement de l'équipement à l'alimentation secteur doivent être conformes au Code national de l'électricité, NFPA 70, et au Code canadien de l'électricité, Partie I, CSA C22.1.

    17. Prévoyez suffisamment d'espace pour les connexions de câblage du bornier afin que les fils ne se plient pas et soient protégés contre les dommages accidentels.

    18. Installez l'appareil uniquement avec des câbles réseau blindés.

    19. L'installateur doit avoir de l'expérience dans l'installation de pièces de rechange et être familiarisé avec les pratiques générales d'installation de composants électroniques.

    20. L'appareil radio n'est pas destiné aux services d'urgence.

    21. L'entretien et la réparation de l'appareil doivent être effectués par un personnel qualifié. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être du même type que celle d'origine.

    22. L'élimination appropriée de la batterie CMOS doit être conforme à la gouvernance locale.

    23. Le produit doit uniquement être connecté à un routeur, un commutateur ou un équipement réseau similaire certifié

    24. Le produit est destiné à une utilisation en intérieur uniquement.

    25. Le produit ne peut pas être connecté au réseau public.

    26. Cet équipement n'est pas adapté à une utilisation dans des endroits où des enfants sont susceptibles d'être présents.

    ATTENTION: Il existe un risque d'explosion si la pile CMOS n'est pas remplacée correctement. L'élimination de la batterie dans le feu ou dans un four chaud, ou l'écrasement ou le découpage mécanique d'une batterie peut entraîner une explosion.

    1.3- Box Contents & Accessories

    1.4- Product Specifications

    https://www.onlogic.com/store/ml100g-54/

    2- Technical Specifications

    2.1- External Features

    Front I/O

    Back I/O

    2.2- I/O Definitions

    Front I/O definition

    Power button / Power LED

    Rear I/O definition

    DIO (optional)

    LAN LED

    COM DB9 option

    2.3- Motherboard Connectors

    M.2 M-Key

    M.2 E-Key

    USB 2.0 Header

    COM Port Header (RS-232/422/485)

    JP1 Header

    System Panel Header

    2.4- Motherboard Manual

    2.5- Processor

    2.6- Power Management

    Wake-Up Events

    Auto Power On

    2.7- Add-in Modules

    2.8- Thermal Results

    Test Conditions

    Test Results

    Test Result Summary

    2.9- Block Diagram

    3- Installation & Mechanical

    3.1- Dimensions

    3.2- Mounting

    Wall Mount

    DIN Rail Mounting

    VESA Mounting

    MK022 Fanless Rackmount Adapter

    3.3- Internal Access

    3.4- CAD & Drawings

    4- Software & Firmware

    4.1- Drivers & Downloads

    4.2 - BIOS

    5- Support & Compliance

    5.1- Troubleshooting & FAQ

    Clear CMOS

    5.2- Regulatory

    CE

    FCC Statement

    ISED

    UKCA

    Download Documents

    5.3- Security Advisory

    5.4- Appendices

    Revision History

    22MB
    ML100G-54 Simplified.zip
    archive
    Open
    110KB
    ML100G-42-54-56_MTBF_Summary.pdf
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    2x HDMI 2.0b

    2x 2.5 GbE LAN

    2x USB3.2 Gen2 (Type-A)

    1x DC Jack (9V~19V)

    Expansion & Storage

    1x M.2 2230 E-key (Wi-Fi) (PCIe x1 / USB 2.0)

    1x M.2 2242/2260/2280 M-key (PCIe Gen 3 x 1, SATA III)

    Onboard Headers & Connectors

    1x Battery on a cable

    1x Serial Header (RS 232/422/485)

    2x USB 2.0 (2.00 pitch header)

    Special Features

    Watchdog timer

    RTC

    TPM 2.0 onboard IC

    BIOS option for auto power-on

    Optional Add On Module

    4G, COM (RS-232/422/485), DIO (x4/x4)

    Operating Systems

    Windows 11 Pro 64 Bit

    Windows 10 IoT Enterprise LTSC 2021

    Windows 11 IoT Enterprise LTSC 2024

    Ubuntu 24.04 Desktop / Server

    LAN controller

    2x Realtek RTL8125BG

    Power Input

    9V~19V DC-In Jack

    Dimensions

    142 x 61.5 x 111 mm

    Weight

    1.15 kg / 2.5 lbs (System Only)

    Motherboard Dimensions

    104 x 36 x 102 mm

    Mounting Options

    DIN

    Wall

    VESA

    Thermal Standards

    System Operating Temperature: 0-50C

    Storage Temperature: -10-85C

    Operating Humidity: 0% - 90%

    Extra Chassis Features

    4 Antenna holes

    Type of Modulation

    2.4GHz: DSSS/OFDM/FHSS

    5 GHz: OFDM

    Antenna Specifications

    ANT200 - PIFA type with 2dBi/2dBi gain on 2.4 & 5 GHz

    Modes of operation

    Duplex (Tx/Rx)

    Duty cycle (access protocol)

    As In: IEEE 802.11 a/b/g/n/ac

    RTC Wake set by BIOS

    Deep S5, S5, S3

    RTC Wake set by OS

    S3

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    ML100G-56

    1- Product Overview

    1.1- Introduction

    The ML100G-56 is an extension of the ML100G product line, offering enhanced performance through Intel® Core™ Ultra 7 and Ultra 5 processors in a low-profile, fanless system designed for the demands of the IoT edge. It features a 0 to 50°C operating temperature range and diverse configuration options, emphasizing its versatile design.

    1.2- Safety

    Safety Precautions, Safeguards & Information

    Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.

    Modification of the device may void certifications, warranty and/or cause possible injury to the user.

    Safe use and installation instructions

    Précautions et guide d’installation

    Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.

    La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures Ă  l'utilisateur.

    Instructions d'utilisation et d'installation en toute sécurité

    1.3- Box Contents & Accessories

    If you purchased additional items such as mounting brackets, power supplies or terminal block connectors, they will be located in the system box or within the outer shipping carton.

    All drivers and product guides can be found on the product page. For more information on accessories and additional features, visit the ML100G-56 product page.

    1.4- Product Specifications

    Specification
    Value

    Radio Specifications when equipped with INT-9260 Wifi/BT (device for indoor use)

    Specification
    Value

    The front power button can be used to turn on and off the system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A solid blue light indicates that the system is powered in the S0 state. The LED is off in S4 and deeper states.

    The ML100G-56 supports an optional Isolated Digital I/O add-in card (OnLogic ADP120 DIO). This option allows for interfacing with digital logic applications. For a complete explanation of features, operating voltages, and safety information, please refer to the DIO expansion manual below:

    The LAN ports on ML100G-56 support up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by the two LEDs enclosed in the port. The description is included below.

    The serial port supports RS-232, RS-422, and RS-485 configurations.

    Pin
    RS-232
    RS-422
    RS-485
    Pin
    Function
    Function
    Pin
    Pin
    Function
    Function
    Pin
    Location
    Connector Type

    Two M.2 M-Key ports are present on the ML100G-56 motherboard to allow support for M-Key form-factor expansion cards. Form-factors 2242/2280 are supported on the primary slot, and the secondary slot supports 2242 form-factor, both M-Key ports are PCIe Gen 4 x 4. A full pinout table for this expansion slot is provided in Appendix B.

    An M.2 E-Key port is present on the ML100G-56 motherboard to allow support for E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe x1, USB 2.0, and CNVi. A full pinout table for this expansion slot is provided in Appendix B.

    The ML100G-56 has two onboard DDR5 SO-DIMM slots with the following specifications:

    • Maximum Capacity: DDR5-5600 up to 96GB (48GB per DIMM)

    • Channel configuration: Dual Channels

    If the BIOS needs to be updated, please refer to the following steps for flashing the EEPROM.

    1. Save the BIOS ROM file in an USB thumb drive (FAT32 format)

    2. Enter BIOS Setup Utility by pressing F2 or DEL during boot

    3. Navigate to Advanced -> Instant Flash

    4. Choose the ROM file you’d like to update

    Setting
    Description

    The ML100G-56 supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters.

    Wake-Up Event
    From ACPI State
    • Temperature: 50°C soaking for minimum of 2hrs

    • Conditions:

      • DC Load 1 Amps on 1x Back Panel USB port

    The ML100G-56 with Intel Core Ultra 7 processor 155U operated upwards of 80% of its rated base clock speeds on the CPU cores while sustaining significant processor, memory and storage stress loads in an ambient temperature of 50ÂşC.

    The ML100G-56 has optional Wall Mount brackets (SKU : MTW101) and DIN Rail mounting brackets (SKU : MTW101-K) available for purchase.

    For Wall Mounting, follow steps below :

    1. Align the four screw holes on the bottom of the system with the respective holes on the mounting brackets.

    2. Attach wall mounting brackets (MTW101) to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).

    3. Install system to surface using keyhole slots on wall mount brackets and appropriate hardware for the surface (not provided).

    For DIN Rail Mounting, follow the below steps:

    1. Follow steps 1-2 from the Wall Mounting section.

    2. Align the mounting holes of the din clip bracket to the three mounting holes on the wall mount bracket.

    3. Install the din clips to the wall mount brackets using supplied screws and a Phillips head screwdriver.

    Note: The mounting brackets are required to support 3x the hanging weight of the system (14.82lbs / 6.72 kgs). The mating surface and hardware must be capable of supporting the same load.

    The ML100G-56 has an optional VESA mounting bracket (SKU : MTV100-K) available for purchase. Follow the steps below for mounting.

    1. Align the four screw holes on the bottom of the system with the respective holes on the mounting bracket.

    2. Attach VESA Mount Plate, to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long)

    3. Install the system to VESA 75 or VESA 100 mounting pattern using provided VESA Mount screws.

    The mounting bracket systems are required to secure 3x the hanging weight of the computer system (14.82lbs / 6.72 kgs). The mating substrate must be capable of maintaining the same rating.

    The ML100G can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered.

    1. Ensure your body is discharged of any static electricity by touching a grounded metal surface.

    2. Remove the 4x phillips screws on the outside of the case.

    3. Use the tab for leverage to pull the bottom panel off

    1. The internals of the unit can now be accessed

    • Enter the system’s BIOS by pressing the DELETE key repeatedly as the system is powering up

    • Navigate to Advanced -> Chipset

    • Change the “Restore on AC/Power Loss” setting to “Power On”

    1. Press F2 upon system booting up to go to the BIOS menu.

    2. Go to Advanced > Storage Configuration > VMD Configuration > Enabled

    1. Press F10 to save and exit.

    2. Press F2 again to boot to BIOS.

    3. There will be a new row “Intel(R) Rapid Storage Technology” under the Advanced tab.

    1. Go to Intel(R) Rapid Storage Technology. You will see the drives you’ve slotted in listed under the Non-RAID Physical Disks. Now go to Create RAID Volume.

    1. Select RAID 0, check the box for both disks and then click Create Volume.

    1. Now, you’ll see 2 drives have been merged into a single RAID volume.

    1. Press F10 to save and exit, and start the Windows 11 Pro installation.

    1. Make sure you have downloaded the in a thumbdrive in advance.

    2. Plug in the thumbdrive with the driver downloaded.

    3. At the WIndows 11 Setup page below, click Load Driver to pre-load the driver needed for RAID configuration.

    1. Browse to the folder where your driver is located.

    1. Select Intel RST VMD Managed Controller 09AB and then click Install.

    1. Now, you will see both drives have been merged into a single volume and ready for installation!

    **Similar steps applied to RAID 1 Configuration.

    1. Go to Device Manager > Disk Drives. It will show if your disk is under normal / RAID 0 / RAID 1 volume.

    1. Run CrystalDiskMark test to compare the disk performance. The RAID 0 array should show higher sequential read/write speeds compared to a single drive.

    2. For RAID 0, removing one of the disks will cause the system to go into bluescreen.

    The ML100 can be opened by the user. This does not void the warranty, however, any damage caused by doing so will not be covered. Please see the Internal Access instructions above.

    • Locate the JP1 header, located in the red circle in this image:

    • Short pins 4 & 6, indicated in the image, with a jumper or the tip of a screwdriver

    • Hold in place for 30 seconds

    • Remove the jumper/screwdriver

    • Close up and power on the system. It may power cycle several times before it begins working again.

    CE

    The computer system was evaluated for medical, IT equipment, automotive, and maritime EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing includes: EN 55032, EN 55035, IEC 60601-1, EN 62368-1, EN 60950-1, and IEC 60945. Product safety was evaluated to IEC 62368-1 and IEC 60950-1.

    FCC Statement

    This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

    ISED

    This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

    Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. CAN ICES-003(A) / NMB-003(A)

    UKCA

    The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.

    Download Documents

    For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.

    Expansion & Storage

    1x M.2 2230 E-key (Wi-Fi) (PCIe x1 / USB 2.0/ CNVi)

    1x M.2 2242/2280 M-key (PCIe Gen 4 x 4)

    1x M.2 2242 M-key (PCIe Gen 4 x4)

    Onboard Headers & Connectors

    1x Battery on a cable

    1x Serial Header (RS 232/422/485)

    2x USB 2.0 (2.00 pitch header)

    Special Features

    Watchdog timer

    RTC

    Intel PTT

    BIOS option for auto power-on

    Optional Add On Module

    4G, COM (RS-232/422/485), DIO (x4/x4)

    Operating Systems

    Windows 11 Pro 64 Bit

    Windows 10 IoT Enterprise LTSC 2021

    Windows 11 IoT Enterprise LTSC 2024

    Ubuntu 24.04 Desktop / Server

    LAN controller

    1x Intel I226LM

    1x Intel I226V

    Power Input

    12V~24V DC-In Jack

    Dimensions

    142 x 61.5 x 111 mm

    Weight

    1.25 kg / 2.8 lbs (System Only)

    Motherboard Dimensions

    104 x 36 x 102 mm

    Mounting Options

    DIN

    Wall

    VESA

    Thermal Standards

    System Operating Temperature: 0-50C

    Storage Temperature: -10-85C

    Operating Humidity: 0% - 90%

    Extra Chassis Features

    4 Antenna holes

    RF output power

    20dBm (2400-2485 MHz) IEEE 802.11b/g/n & BT

    10dBm (2400-2485 MHz) BLE

    23dBm (5150-5725 MHz) IEEE 802.11a/n/ac

    13.98 dBm (5725-5875MHz) IEEE 802.11a/n/ac

    Type of Modulation

    2.4GHz: DSSS/OFDM/FHSS

    5 GHz: OFDM

    Antenna Specifications

    ANT200 - PIFA type with 2dBi/2dBi gain on 2.4 & 5 GHz

    Modes of operation

    Duplex (Tx/Rx)

    Duty cycle (access protocol)

    As In: IEEE 802.11 a/b/g/n/ac

    TX+

    TX+/RX+

    3

    TX

    RX+

    NC

    4

    DTR

    RX-

    NC

    5

    GND

    NC

    NC

    6

    DSR

    NC

    NC

    7

    RTS

    NC

    NC

    8

    CTS

    NC

    NC

    9

    NC

    NC

    NC

    3.3 V

    4

    5

    NC

    NC

    6

    7

    NC

    NC

    8

    9

    GND

    LED#

    10

    11

    NC

    3.3 V

    12

    13

    NC

    3.3 V

    14

    15

    GND

    3.3 V

    16

    17

    NC

    3.3 V

    18

    19

    NC

    NC

    20

    21

    GND

    NC

    22

    23

    NC

    NC

    24

    25

    NC

    NC

    26

    27

    GND

    NC

    28

    29

    NC

    NC

    30

    31

    NC

    NC

    32

    33

    GND

    USB_D+

    34

    35

    NC

    USB_D-

    36

    37

    NC

    NC

    38

    39

    GND

    SMB_CLK

    40

    41

    PERn0/SATA-B+

    SMB_DATA

    42

    43

    PERp0/SATA-B-

    NC

    44

    45

    GND

    NC

    46

    47

    PETn0/SATA-A-

    NC

    48

    49

    PETp0/SATA-A+

    PERST#

    50

    51

    GND

    CLKREQ#

    52

    53

    REFCLKn

    WAKE#

    54

    55

    REFCLKp

    NC

    56

    57

    GND

    NC

    58

    59

    CONNECTOR Key M

    CONNECTOR Key M

    60

    61

    CONNECTOR Key M

    CONNECTOR Key M

    62

    63

    CONNECTOR Key M

    CONNECTOR Key M

    64

    65

    CONNECTOR Key M

    CONNECTOR Key M

    66

    67

    NC

    SUSCLK

    68

    69

    PEDET

    3.3 V

    70

    71

    GND

    3.3 V

    72

    73

    GND

    3.3 V

    74

    75

    GND

    3.3 V

    4

    5

    USB_D-

    NC

    6

    7

    GND

    NC

    8

    9

    CNV_WGR_D1-

    CNV_RF_RESET#

    10

    11

    CNV_WGR_D1+

    NC

    12

    13

    GND

    MODEM_CLKREQ

    14

    15

    CNV_WGR_D0-

    NC

    16

    17

    CNV_WGR_D0+

    GND

    18

    19

    GND

    NC

    20

    21

    CNV_WGR_CLK-

    CNV_BRI_RSP

    22

    23

    CNV_WGR_CLK+

    KEY

    24

    25

    KEY

    KEY

    26

    27

    KEY

    KEY

    28

    29

    KEY

    KEY

    30

    31

    KEY

    CNV_BGI_DT

    32

    33

    GND

    CNV_RGI_RSP

    34

    35

    PETp0

    CNV_BRI_DT

    36

    37

    PETn0

    NC

    38

    39

    GND

    NC

    40

    41

    PERp0

    NC

    42

    43

    PERn0

    NC

    44

    45

    GND

    NC

    46

    47

    REFCLKp0

    NC

    48

    49

    REFCLKn0

    SUSCLK

    50

    51

    GND

    PERST0#

    52

    53

    CLKREQ0#

    W_DISABLE2#

    54

    55

    WAKE0#

    W_DISABLE1#

    56

    57

    GND

    SMB_DATA

    58

    59

    CNV_WT_D1-

    SMB_CLK

    60

    61

    CNV_WT_D1+

    NC

    62

    63

    GND

    RESERVED

    64

    65

    CNV_WT_D0-

    NC

    66

    67

    CNV_WT_D0+

    NC

    68

    69

    GND

    NC

    70

    71

    CNV_WT_CLK-

    3.3V

    72

    73

    CNV_WT_CLK+

    3.3V

    74

    75

    GND

    4

    SATA3 Port

    5

    System Panel Header

    6

    JP1 Header

    7

    USB2 Header

    8

    COM Port Header

    9

    DC Jack (12V~24V)

    Follow the instructions on the screen

  • When the programming is completed, press Enter to reboot the system

  • +A

    +B

    6

    7

    GND

    GND

    8

    9

    Dummy

    10

    GND

    DSR#

    6

    7

    RTS#

    CTS#

    8

    9

    Dummy

    10

    4-6

    Clear CMOS

    5-7

    DACC* (Default)

    GND

    PWRBTN#

    6

    7

    RESET#

    GND

    8

    9

    Dummy

    10

    RTC Wake set by BIOS

    Deep S5, S5, S3

    RTC Wake set by OS

    S3

    DC Load 1 Amps on 1x Front panel USB port
  • Application: BurnIn Stress 7 test, Furmark, H/W monitoring

  • Mount system onto the DIN rail.
    Care must be taken handling the device to prevent injury to self or possibility of damaging the unit.
  • Read the entire manual before using the product.

  • Install the device securely per users manual instructions.

  • To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.

  • Wall or ceiling mounting device requires use of OnLogic mounting plate or bracket.

  • Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom or rear of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.

  • Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or enclosure during operation and 30 minutes after shutdown allowing the unit to cool down.

  • Ambient operating temperature must be between 0 °C to 50 °C with a non-condensing relative humidity of 10-85%.

  • The device can be stored at temperatures between -10 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, minimum 3HR.

  • Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.

  • Do not clean the device with liquids. The chassis can be cleaned with a dry cloth or duster only. To prevent injury to self and/or damage to the device the unit must be powered down and all connecting power and other peripherals shall be disconnected prior to cleaning.

  • Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then recommended device orientation is such that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.

  • This device is intended for indoor operation only.

  • Caution, Risk of Electric Shock! Unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!

  • To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC, see specs for details.

  • Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.

  • Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.

  • Install the device only with shielded network cables.

  • The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.

  • Radio device is not intended for emergency service use.

  • Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.

  • Proper disposal of CMOS battery must comply with local governance.

  • Product must only be connected to a certified router, switch or similar network equipment

  • Product is intended for indoor use only.

  • Product cannot be connected to the public network.

  • This equipment is not suitable for use in locations where children are likely to be present. WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.

  • Des prĂ©cautions doivent ĂŞtre prises lors de la manipulation de l'appareil pour Ă©viter de se blesser ou d'endommager l'appareil.
  • Lisez l'intĂ©gralitĂ© du manuel avant d'utiliser le produit.

  • Installez l'appareil en toute sĂ©curitĂ© selon les instructions du manuel de l'utilisateur.

  • Pour vous protĂ©ger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes double bande fournies avec un gain de 2 dBi/2 dBi.

  • Le dispositif de montage mural ou au plafond nĂ©cessite l'utilisation d'une plaque ou d'un support de montage. La plaque ou le support doit ĂŞtre en mĂ©tal et avoir une Ă©paisseur minimale de 1 mm.

  • Utilisez des vis Ă  tĂŞte plate M4x0,5 mm pour fixer la plaque de montage ou les supports de montage aux trous filetĂ©s au bas ou Ă  l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'Ă©paisseur supplĂ©mentaire de plaque ou de support au-delĂ  de 1,5 mm.

  • Attention surface chaude! Il est normal que l'appareil chauffe et soit chaud au toucher. Ne touchez pas la zone du dissipateur thermique ou le boĂ®tier pendant le fonctionnement et 30 minutes après l'arrĂŞt pour permettre Ă  l'unitĂ© de refroidir.

  • La tempĂ©rature ambiante de fonctionnement doit ĂŞtre comprise entre 0 °C et 50 °C avec une humiditĂ© relative sans condensation de 10 Ă  85 %.

  • L'appareil peut ĂŞtre stockĂ© Ă  des tempĂ©ratures comprises entre -10 °C et 85 °C. Remarque : L'unitĂ© doit ĂŞtre stabilisĂ©e Ă  la tempĂ©rature de fonctionnement avant utilisation, minimum 3 heures.

  • Gardez l'appareil Ă  l'Ă©cart des liquides et des matĂ©riaux inflammables. Ne pas installer dans un environnement dangereux.

  • Ne nettoyez pas l'appareil avec des liquides. Le châssis peut ĂŞtre nettoyĂ© uniquement avec un chiffon sec ou un plumeau. Pour Ă©viter de se blesser et/ou d'endommager l'appareil, l'appareil doit ĂŞtre Ă©teint et toutes les alimentations et autres pĂ©riphĂ©riques doivent ĂŞtre dĂ©connectĂ©s avant le nettoyage.

  • PrĂ©voyez un espace suffisant autour de tous les cĂ´tĂ©s de l'appareil pour un refroidissement correct et pour ne pas dĂ©passer sa limite de tempĂ©rature de fonctionnement maximale. Si l'appareil est montĂ© sur une surface verticale, l'orientation recommandĂ©e de l'appareil est telle que les ailettes du dissipateur thermique permettent Ă  l'air de monter sans obstruction. Des orientations alternatives peuvent entraĂ®ner une plage de tempĂ©ratures de fonctionnement rĂ©duite.

  • Cet appareil est destinĂ© Ă  une utilisation en intĂ©rieur uniquement.

  • Attention, risque de choc Ă©lectrique ! L'unitĂ© est alimentĂ©e uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) Ă  l'appareil !

  • Pour alimenter l'appareil, utilisez uniquement des alimentations externes rĂ©pertoriĂ©es UL ITE avec une sortie CC de 12-24 VCC, voir les spĂ©cifications pour plus de dĂ©tails.

  • Les mĂ©thodes de câblage utilisĂ©es pour le raccordement de l'Ă©quipement Ă  l'alimentation secteur doivent ĂŞtre conformes au Code national de l'Ă©lectricitĂ©, NFPA 70, et au Code canadien de l'Ă©lectricitĂ©, Partie I, CSA C22.1.

  • PrĂ©voyez suffisamment d'espace pour les connexions de câblage du bornier afin que les fils ne se plient pas et soient protĂ©gĂ©s contre les dommages accidentels.

  • Installez l'appareil uniquement avec des câbles rĂ©seau blindĂ©s.

  • L'installateur doit avoir de l'expĂ©rience dans l'installation de pièces de rechange et ĂŞtre familiarisĂ© avec les pratiques gĂ©nĂ©rales d'installation de composants Ă©lectroniques.

  • L'appareil radio n'est pas destinĂ© aux services d'urgence.

  • L'entretien et la rĂ©paration de l'appareil doivent ĂŞtre effectuĂ©s par un personnel qualifiĂ©. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit ĂŞtre du mĂŞme type que celle d'origine.

  • L'Ă©limination appropriĂ©e de la batterie CMOS doit ĂŞtre conforme Ă  la gouvernance locale.

  • Le produit doit uniquement ĂŞtre connectĂ© Ă  un routeur, un commutateur ou un Ă©quipement rĂ©seau similaire certifiĂ©

  • Le produit est destinĂ© Ă  une utilisation en intĂ©rieur uniquement.

  • Le produit ne peut pas ĂŞtre connectĂ© au rĂ©seau public.

  • Cet Ă©quipement n'est pas adaptĂ© Ă  une utilisation dans des endroits oĂą des enfants sont susceptibles d'ĂŞtre prĂ©sents.

  • ATTENTION: Il existe un risque d'explosion si la pile CMOS n'est pas remplacĂ©e correctement. L'Ă©limination de la batterie dans le feu ou dans un four chaud, ou l'Ă©crasement ou le dĂ©coupage mĂ©canique d'une batterie peut entraĂ®ner une explosion.

    \

    Processor

    Intel® Core™ Ultra 7 Processor 155U - Series 1

    Intel Core Ultra 5 Processor 125U - Series 1

    Memory

    2x DDR5-5600 SO-DIMM up to 96GB

    Integrated Graphics

    Intel Arc™ Graphics

    Front I/O

    1x USB 3.2 Gen 2 (Type-A)

    1x USB 4/Thunderbolt 4 (Type-C, 5V/3A, DP2.1) - Supports Locking Connector

    1x USB 3.2 Gen2 x2 (Type-C, 5V/3A, DP1.4a) - Supports Locking Connector

    1x Audio Jack (MIC-in, Line-out)

    1x Power Button (w/ LED indicator)

    Back I/O

    Frequency Bands

    2.4GHz and 5GHz bands

    Operating Frequency

    2400 - 2485 MHz

    5150 - 5250 MHz, 5250 - 5350 MHz

    5470 - 5725 MHz, 5725 - 5878 MHz

    Channel spacing / Bandwidth

    2.4GHz: 802.11b/g/n; 5 MHz / BT: 1MHz

    Bandwidth: 20 MHz / 40 MHz

    5 GHz: 802.11a/n/ac: 20, 40, 80, 160 MHz

    1

    DCD

    TX-

    TX-/RX-

    2

    1

    GND

    3.3 V

    2

    3

    1

    GND

    3.3 V

    2

    3

    1

    M.2 2242/2280 M-key (PCIe Gen 4 x 4)

    2

    M.2 2230 E-key (Wi-Fi) (PCIe x1/ USB 2.0/ CNVi)

    3

    M.2 2242 M-key (PCIe Gen 4 x4)

    1

    USB_PWR

    USB_PWR

    2

    3

    -A

    -B

    4

    1

    DCD#

    RXD

    2

    3

    TXD

    DTR#

    4

    1-3

    Reserved JP for AT (Default)

    6-8

    Reserved JP for Clear CMOS (Default)

    1-2

    SIO AT Mode

    1

    HDD LED+

    PWR LED+

    2

    3

    HDD LED-

    PWR LED-

    4

    Power Button

    Deep S5, S5, S3

    LAN

    S5, S3

    USB

    S3

    2- Technical Specifications

    2.1- External Features

    Front I/O

    Back I/O

    2.2- I/O Definitions

    Front I/O Definition

    Power Button / Power LED

    Rear I/O Definition

    DIO (Optional)

    LAN LED

    COM DB9 Option

    Expansion Port Pinout

    M.2 M-Key

    M.2 E-Key

    2.3- Motherboard Connectors

    M.2 M-Key

    M.2 E-Key

    SO-DIMM

    BIOS EEPROM

    USB 2.0 Header

    COM Port Header (RS-232/422/485)

    JP1 Header

    * Auto clear CMOS when system boot improperly

    System Panel Header

    2.4- Power Management

    Wake-Up Events

    2.5- Thermal Management

    Test Conditions

    Test Results

    Test Result Summary

    2.6- Block Diagram

    3- Installation & Mechanical

    3.1- Dimensions

    3.2- Mounting

    Wall Mounting

    DIN Rail Mounting

    VESA Mounting

    3.3- Internal Access

    3.4- CAD & Drawings

    4- Software & Firmware

    4.1- Drivers & Downloads

    4.2 BIOS

    4.3- Features & Configuration

    Enable Auto Power On

    Configure RAID setting on BIOS

    Windows 11 RAID Installation

    Verify RAID Setup Success

    5- Support & Compliance

    5.1- Troubleshooting & FAQ

    Clear CMOS

    5.2- Regulatory

    5.3- Security Advisory

    ADP120 Isolated DIO Module
    ML100G-56 Dimensional Drawings
    Drivers
    BIOS Flies
    Intel Rapid Start Driver
    Access Security Advisories
    18MB
    ML100G-56 Simplified.zip
    archive
    Open
    110KB
    ML100G-42 54 56 MTBF Summary - signed.pdf
    PDF
    Open

    2x HDMI 2.1 TMDS

    2x 2.5 GbE LAN

    2x USB3.2 Gen2 (Type-A)

    1x DC Jack (12V~24V)

    RX

    GND

    USB_D+

    5

    5

    5