HX500 / HX600 BIOS Manual

NOTE: To enter the BIOS on Helix systems, hold the ‘Delete’ key on your keyboard during boot.

1 - Front Page

Boot Manager

Device Management

Boot From File

Administer Secure Boot

Setup Utility

Intel(R) Management Engine BIOS Extension

InsydeH2O Version

BIOS Version

Build Date

Processor Type

CPU Speed

Number of Processors

PCH SKU

Total Memory

Channel A

Channel B

Memory Speed

Language

System Time

System Date

Numlock

Serial ATA Port X

Platform Trust Technology

Enable Hibernation

ACPI S3 Support

Native PCIE Enable

Native ASPM

Low Power S0 Idle Capability

Type

Speed

L1 Data Cache

L1 Instruction Cache

L2 Data Cache

L3 Data Cache

L4 Data Cache

VMX

SMX/TXT

Intel (VMX) Virtualization Technology

Active Processor Cores

Hyper-Threading

AES

Boot Performance Mode

Intel(R) SpeedStep(tm)

Intel(R) Speed Shift Technology

Turbo Mode

HOB Buffer Size

ECC Support

Max TOLUD

SA PCIe Code Version

VT-d

Graphics Configuration

Stop Grant Configuration

PCIe Spread Spectrum Clocking

VT-d

CHAP Device (B0:D7:F0)

Thermal Device (B0:D4:F0)

GNA Device (B0:D8:F0)

CRID Support

Above 4GB MMIO BIOS assignment

X2APIC Opt Out

IPU Device (B0:D5:F0)

Skip Scanning of External Gfx Card

Primary Display

Internal Graphics

GTT Size

Aperture Size

DVMT Pre-Allocated

DVMT Total Gfx Mem

PCI Express Configuration

SATA and RST Configuration

HD Audio

PCH LAN Controller

Wake on LAN Enable

SLP_LAN# Low on DC Power

EFI Network

Wake on WLAN and BT Enable

PXE ROM

Auto Power-On

PCI Express Clock Gating

PCI Express Root Port <n>

►PCI Express Root Port <n>

PCI Express Root Port Settings

PCI Express Root Port

ASPM

PCIE Speed

Detect Timeout

SATA Controllers

SATA Mode Selection

Serial ATA Port <n>

Software Preserve

Port <n>

Hot Plug

Configured as eSATA

External

Spin Up Device

SATA Device Type

Topology

HD Audio

ME Firmware Version

ME Firmware Mode

ME Firmware SKU

ME Firmware Status 1

ME Firmware Status 2

ME State

Manageability Features State

AMT BIOS Features

AMT Configuration

ME Unconfig on RTC Clear

Comms Hub Support

JHI Support

Core BIOS Done Message

Firmware Update Configuration

PTT Configuration

ASF Support

USB Provisioning of AMT

CIRA Configuration

ASF Configuration

Secure Erase Configuration

MEBx Resolution Settings

CIRA Configuration

Activate Remote Assistance Process

CIRA Timeout

ASF Configuration

PET Progress

WatchDog

OS Timer

BIOS Timer

ASF Sensors Table

Secure Erase Configuration

Secure Erase Mode

Force Secure Erase

MEBx Resolution Settings

Non-UI Mode Resolution

UI Mode Resolution

Graphics Mode Resolution

ME Firmware Re-Flash

PTT Capability / State

Automatic Thermal Reporting

Critical Trip Point

Active Trip Point 0

Active Trip Point 0 Fan Speed

Active Trip Point 1

Active Trip Point 1 Fan Speed

Passive Trip Point

Passive TC1 Value

Passive TC2 Value

Passive TSP Value

Active Trip Points

Passive Trip Points

Critical Trip Points

Active Trip Points

PCH Temp Read

CPU Energy Read

CPU Temp Read

Alert Enable Lock

CPU Temp

CPU Fan Speed

UART Port 1 Configuration

UART Port 2 Configuration

Fan Control

Hardware Monitor

UART Port <n>

Power Over Cable

Mode Select

CPUFANIN

CPUTIN

Mode

PWM/DC Output

Output Buffer Type

PWM Duty Cycle (%)

Fan Control (Thermal Cruise Mode)

The following settings are only available if the Mode option above is set to Thermal Cruise.

Target Temperature (°C)

Tolerance (°C)

Fan Control (Speed Cruise Mode)

Target Fan Speed

Tolerance

Fan Control (Smart Fan IV Mode)

Boundary 0 (°C)

Output 0 (%)

Boundary 1 (°C)

Output 1 (%)

Boundary 2 (°C)

Output 2 (%)

Boundary 3 (°C)

Output 3 (%)

Refresh Cycle

Current TPM Device

TPM State

TPM Active PCR Hash Algorithm

TPM Hardware Supported Hash Algorithm

BIOS Supported Hash Algorithm

TrEE Protocol Version

TPM Availability

TPM Operation

Clear TPM

Set Supervisor Password

Boot Type

Network Stack

PXE Boot Capability

Add Boot Options

USB Boot

UEFI OS Fast Boot

EFI

Note: The EFI boot order configuration in this menu can only be changed if the Add Boot Options option above is set to First or Last.

In this menu, you set which devices the system can boot to, as well as change the order in which it attempts to boot. Highlight a boot device and press Enter to enable or disable booting to it. Use the F5 and F6 keys to move the boot device up and down the list.

Exit Saving Changes

Save Change Without Exit

Exit Discarding Changes

Load Optimal Defaults

Load Custom Defaults

Save Custom Defaults

Discard Changes

RAID (Redundant Array of Independent Disks) is a technology used to stitch multiple storage drives together into a single volume for a variety of purposes. The Intel Q470 chipset on the Helix platform features Intel Rapid Storage Technology (RST), an integrated firmware-level RAID utility for SATA disks. Intel RST on Comet Lake chipsets is only supported in Windows; Linux users will need to use a dedicated hardware RAID solution or a software-level RAID utility such as mdadm.

Because the RAID volumes are maintained at the firmware level, the disks in an array do not need to match perfectly. However, the timing parameters of all disks in a certain array, such as write speed, will be limited by the chipset to the lowest value among those disks.

On the Helix platform, the M.2 B-Key, M.2 M-Key, and both cabled SATA connectors can be configured in RAID arrays.

Different types of RAID arrays are referred to as “levels”. Intel RST on the Helix platform supports four RAID levels:

RAID 0 (Striped): In a RAID 0 array, data written to the volume is split between two or more disks. Each disk’s storage space is divided into blocks, the size of which can be set by the user. When writing data to the volume, the SATA controller will rotate block-by-block between the disks. This methodology can provide noticeable improvements to read and write speeds; however, if one disk in a RAID 0 array fails, the data on the entire volume will be lost.

RAID 1 (Mirrored): In a RAID 1 array, the SATA controller mirrors all data between two or more disks. The primary benefit of this methodology is that if a drive in the array is disconnected or fails altogether, the volume will continue to function as normal. If an OS is installed on the volume, it will not be interrupted by a failing drive. A drive can then be reconnected or replaced, at which time the SATA controller will rebuild the volume (note that the rebuild process can take several hours or even days for larger volumes). This RAID configuration has no noticeable effect on write speeds but typically improves read speeds, as the system can read from multiple disks simultaneously.

RAID 5 (Striped with Parity): A RAID 5 array functions similarly to a RAID 0 array in that it stripes data across multiple disks; however, for each set of blocks, it also writes a block of parity data that can be used to recover a block on another disk if it loses that data. Thus, you can achieve some of the performance gains of a RAID 0 array while being able to withstand a single disk failure. This methodology requires at least three disks.

RAID 10 (Striped and Mirrored): A RAID 10 array combines two RAID 1 arrays in a RAID 0 array. This allows you to achieve the performance gains of a RAID 0 array while still maintaining the fault tolerance of a RAID 1 array. Data is striped between the two RAID 1 volumes, which are able to withstand and rebuild after a failed disk. This methodology requires at least four disks. This RAID level is also sometimes referred to as RAID 1+0.

Recovery: Intel Rapid Recovery Technology creates a special RAID 1 array where instead of two equivalent disks, one disk is designated the “primary” and the other the “secondary”. Data is written to the primary drive, then copied to the secondary drive as a backup. This allows you to decide if you would like the mirroring to occur continuously or only on request; in addition, the time it takes to rebuild the array after a disk failure is decreased. However, the read speed improvements of a typical RAID 1 array are not seen here, as the SATA controller will typically only read from the primary drive.

Note: Creating a new RAID array will erase all filesystems and data on all the disks used.

From the main menu, select “Device Management”. You will be greeted with the Device Manager options pictured below. Select “Intel(R) Rapid Storage Technology” to continue.

Note: The Intel(R) Rapid Storage Technology menu will only appear if you have set the SATA Mode Selection option to Intel RST Premium With Intel Optane System Acceleration. This option is located in the main BIOS setup under Advanced > PCH-IO Configuration > SATA And RST Configuration.

This menu will list all existing RAID arrays, as well as all SATA disks that are not currently in an array. Select “Create RAID Volume” to continue.

The following menu will give you the option to specify the name of your RAID volume, the RAID level of the configuration, and which disks will become part of the array. Begin by specifying the name of the volume if desired and selecting a RAID Level.

Then, select which SATA disks will be used to create the array. Note that any disks being used in a different RAID array will not be selectable. If you are creating an array with the RAID level “Recovery”, you will need to select which drive is the primary (M) and which is the secondary (R).

For RAID 0, 5, and 10 configurations, you can specify the strip size if desired. The strip size options vary depending on the RAID level of the configuration. In addition, you can set the capacity of the volume if you would like it smaller than the maximum available. If you are creating a “Recovery” array, you can also select if the slave drive is synchronized with the master continuously or only on request.

Select “Create Volume” to return to the Device Manager menu. You should now see your new volume listed in the menu; hit F10 to save your new settings and Escape to return to the main BIOS menu.

Your RAID array is now created and ready for use.

The latest BIOS updates are available within Software & Firmware section of the HX500 / HX600 Product Documentation space.

Revision History

HX500 / HX600 / HX610

1- Product Overview

1.1- Introduction

The OnLogic Helix series integrates Intel® 10th generation Comet Lake processors, offering flexible installation, reliable solid-state performance, and unique expandability for various innovations. Helix systems utilize desktop processing within a compact form factor, previously limited to lower-wattage mobile CPUs. With OnLogic's Hardshell™ Fanless Technology, you can benefit from enhanced performance and thermal management of Intel 10th gen processing, alongside triple independent display support, an extended operating temperature range, and a wide input power range.

1.2- Safety

Safety Precautions, Safeguards & Information

Do not open or modify the device. The device's components comply with FCC and CE regulations; any modification may invalidate these certifications.

Install the device securely. Be careful handling the device to prevent injury and do not drop.

Précautions et guide d’installation

Ne pas ouvrir ou modifier l'appareil. L'appareil utilise des composants conformes aux réglementations FCC et EC. La modification de l'appareil peut annuler ces certifications.
Installez l’appareil en toute sécurité. Soyez prudent lors de la manipulation de l'appareil pour éviter les blessures et ne pas faire tomber.

1.3- Box Contents & Accessories

4x Rubber Feet

Additional items such as mounting brackets, power supplies, or terminal block connectors, if purchased, will be found in the system box or outer shipping carton. For more details on accessories and features, visit the Helix series page.

Helix 500 Product Page Helix 600 Product Page

Model

Helix 500

Helix 600

Note: The HX500 is pictured, the HX600 has the same I/O configuration. The location of the DIO option is different for the HX600.

Note: The rear I/O of the HX500 is shown below. The HX600 has the same connector orientations and locations on the motherboard. The location of the Terminal block power option is different for the HX600.

Power button / Power LED

The front power button can be used to turn the Helix system on and off. It is a momentary contact button with a blue LED backlight that indicates the system's status. A single press while the system is on will initiate a graceful shutdown from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset. The system can be woken from any state by a single press of the power button. A solid blue light on the LED backlight indicates the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.

SIM card

A 3FF Subscriber Identity Module (SIM) card slot is located on the front panel of the Helix platform, providing native support for OnLogic Cellular modules. The SIM signals can be connected to either the mPCIe or M.2 B-Key internal expansion slots, with the default BIOS setting being mPCIe. Refer to the BIOS user manual for more information. The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card, use a small implement to push the card into the slot until it clicks. To remove the card, push it with a small implement until it clicks, then pull the free end of the card to remove it.

COM DB9 option

The serial port mode and voltage between Off/5V on Pin 9 on Helix can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS manual in Appendix C for configuration instructions.

Audio

Audio input and output are provided via a 3.5mm CTIA audio jack on the front panel of the Helix platform. The audio codec used is a Realtek ALC233. Proper drivers must be installed for both the Q470 chipset and Realtek ALC233 codec. These downloads can be found within section 4 of this documentation page.

USB 3.2

There are four USB 3.2 Gen 2 ports on the front panel of the Helix platform, capable of 10Gb/s transfer rates.

4-Pin DIN power connector

Mainboard power is applied to the Helix platform via a locking 4-pin female DIN connector (Mating part: Kycon # KPPX-4P or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications.

The maximum rated current of the connector is 7A per pin. Use a wire gauge rated for the operational current. See below for the on-board connector pinout.

DisplayPort 1, 2, & 3

Helix utilizes Intel’s Integrated processor graphics, powering the onboard DisplayPorts. This supports resolutions up to 4096x2304 @ 60Hz simultaneously on all three outputs. All ports support Multi-Stream Transport (MST).

An optional CEC module can be included to add CEC (Consumer Electronics Control) functionality on DisplayPort 1 & 2. This feature is not supported on the DisplayPort 3 connector.

LAN1 - Intel I219-LM

The Intel I219 LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is an industry-standard RJ45. This port also features Intel’s vPro(R) technology, enabling remote out-of-band management and security features (requires Intel Core i5 or higher). The LAN link state is indicated by the two LEDs enclosed in the port, as described below.

LAN2 - Intel I210-IT

The second LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is an industry-standard RJ45. The LAN link state is indicated by the two LEDs enclosed in the port, as described below.

USB 3.2

The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2 ports, capable of 10Gb/s transfer rates. The two USB ports above the RJ45 LAN connectors are USB 3.2 Gen 1 ports, capable of 5 Gb/s.

Terminal block power option

If the terminal block power option is selected, mainboard power is applied to the Helix platform through a 4-pin terminal block connector (Mating part: Dinkle #2ESDAM-04P or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications. The maximum rated current of the connector is 15A per pin. Use a wire gauge rated for the operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal block with tinned wire ends or solid core wire. See below for connector pinout. When using the remote switch connections with the terminal block option, mating power switch cables should be twisted-pair wire with a floating shield to ensure proper immunity to EMI/RFI. It is recommended to keep wires less than 3 meters in length. Switches should be momentary contact type only.

The motherboard is the same for HX500 and HX600.

An M.2 B-Key port is present on the Helix motherboard to support B-Key form-factor expansion cards. Supported form-factors include 3042, 2242, 2260, and 2280. The B-Key connector supports PCIe Gen 3 x2, USB 3.2 5Gb/s, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices. The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slots. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Refer to the BIOS user manual for more information. The M.2 B-Key slot can be used in tandem with the M.2 M-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs; NVMe RAID is not supported by the chipset. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Refer to the BIOS user manual for information on using Rapid Storage Technology. A full pinout table for this expansion slot is provided in The Expansion port pintout.

An M.2 E-Key port is present on the Helix motherboard to support E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector on the Helix platform supports PCIe Gen 3 x1, USB 2.0, and Intel CNVi devices. A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3).

An M.2 M-Key port is present on the Helix motherboard to support M-Key form-factor expansion cards. Only 2280 form-factor cards are supported. The M-Key connector on the Helix platform includes support for PCIe Gen 3 x4, PCIe Gen 3 x2, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices. The M.2 M-Key slot can be used in tandem with the M.2 B-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs; NVMe RAID is not supported by the chipset. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Refer to the BIOS user manual for information on using Rapid Storage Technology. A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3).

An mPCIe port is present on the Helix motherboard to support mini-PCIe form-factor expansion cards. Full-length cards and half-length cards (with adapter) are supported. The mPCIe connector on the Helix platform supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is provided in A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3). The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slots. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Refer to the BIOS user manual (Appendix C) for more information.

The Helix platform has two onboard DDR4 SO-DIMM Slots. Specifications are as follows:

Maximum Capacity: DDR4-2666 64GB with two 32GB SO-DIMM Modules
Channel configuration: 1DIMM Per Channel (DPC) - 2 Channels
No ECC Support

The two on-board COM headers utilize standard 9-pin 2.00mm pitch male pin headers with the pin configuration provided in the table below. These serial ports support RS-232, RS-422 Full-Duplex, and RS-485 half-Duplex configurations. The serial port communication mode can be selected in the BIOS configuration. Additionally, 5V power can be enabled on pin 9 in the same BIOS menu, rated to provide 250mA of current. Refer to the BIOS manual for configuration instructions.

For BIOS update instructions, refer to the BIOS Manual in section 4 for reflashing instructions.

The on-board power switch header can control the power state of the Helix platform in parallel with the front panel power button. Mating power switch cables should be twisted-pair wire with a floating shield to ensure proper immunity to EMI/RFI. The mating connector is a standard 2.54mm female header. It is recommended to keep wires less than 3 meters in length. Switches must be momentary contact type only.

A 2mm pin header and jumpers are used to clear the CMOS settings and select the hardware auto power-on behavior of the Helix platform. ATX mode can be selected by moving the pin jumper to connect pins 3 and 5. In ATX mode, the system power-on is controlled by the system power button or other supported wake events. When the pin jumper connects pins 1 and 3, the system operates in AT mode, powering on when system power is first applied. The default selection is ATX mode. The system CMOS settings can be cleared with the second pin jumper by following these steps:

Disconnect system power.
Place jumper in the “clear” position.
Wait 10 seconds.
Remove jumper from the “clear” position and return to default position.

The RTC battery on the Helix platform retains BIOS CMOS settings and maintains the system's real-time clock. If the RTC battery is low, CMOS settings will not be retained, and an alert may be received in the operating system. The cabled RTC battery should be replaced with a Maxell CR2032-WK11 (or UL listed equivalent). An equivalent battery must use a Hirose DF13-2S-1.25c connector to mate with the on-board connector.

Helix features an onboard TPM (Trusted Platform Module) header. Helix supports OnLogic’s module (OnLogic part TPM01) featuring TPM 2.0. This provides the option for a dedicated secure module to secure Helix through cryptographic keys.

The two on-board SATA Data connectors utilize the standard 7-pin SATA Data latching connector with the standard pin configuration. These connectors support SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps). Additionally, they support firmware-level RAID arrays using Intel Rapid Storage Technology. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Characteristics of the SATA ports, such as RAID arrays, can be configured in the BIOS; refer to the BIOS manual for further details.

The on-board SATA Power connector provides 5V and 12V power to multiple SATA devices with the pin configuration shown in the table below. It uses a 4-pin 2.50mm pitch male pin connector with an opening for a small retention tab. The connector is rated to 2A per contact. Any mating connector with the correct form factor, such as TE Connectivity part number 171822-4, can be used to connect a cable to the header. The connector can only be used to power internal devices.

The on-board fan header can power and control any three or four-wire fan (including variable-speed PWM fans) using the standard pin configuration shown in the table below. Three-wire fans will only connect to pins 1-3. This header utilizes a standard 4-pin 2.54mm pitch fan connector with a small retention tab. Any mating connector with the standard form factor, such as Molex part number 0470541000, can be used to connect a fan. Most CPU and case fans utilize this connector and pinout. The 12V pin on this connector can provide up to 1A of current.

The on-board USB 2.0 header provides a pair of USB 2.0 signals. It utilizes a standard 9-pin 2.54mm pitch male pin connector with the pin configuration shown in the table below. The 5V power pins (1 & 2) can provide up to 1A of current.

HDMI-CEC (Consumer Electronics Control) is a communication protocol that supports the control of displays over an HDMI interface. The Helix platform supports CEC via the optional add-on module ADP107. For a full description of supported features, refer to the ADP107 product manual here:

Mainboard power can be applied to the Helix platform via the locking 4-pin Molex Micro-Fit connector (Mating part: Molex # 0430250400 or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications. The maximum rated current of the connector is 8A per pin. Use a wire gauge rated for the operational current. See below for connector pinout.

The LGA1200 CPU socket on the Helix platform supports all 10th Gen Intel S-series processors up to 35W TDP.

The Helix platform features a standard PCI Express x16 slot on the bottom side that supports PCIe Gen 1 (2.5 GT/s), Gen 2 (5 GT/s), and Gen 3 (8 GT/s). Any PCIe x1, x4, x8, or x16 card using PCIe Gen 1 through Gen 3 will function in this slot. In the HX600, a riser card is included to add a PCIe expansion card to the expanded chassis.

Reference the full .

Intel® 10th Gen Comet Lake Core 35W Celeron/i3/i5/i7/i9

The power consumption of the H500 and H600 systems was measured for various system configurations, workloads, and power states at both 12V and 24V system input voltages. Tests were performed using Burnintest v9.0 build 1012 to stress system components with and without graphics enabled. These tests were performed with Intel Turbo Boost disabled; enabling Turbo will draw additional power. The build configurations and power consumption are listed in the tables below. (Note: system configurations using discrete GPUs are limited to 19V-24V input. Only 24V is tested for Configuration 3).

*The configurations below are using representative samples of internal devices; the specific components mentioned below may vary from the devices provided by OnLogic.

The power consumption for each system configuration is recorded below:

Config 1 Low Power Consumption

Config 2 Mid Power Consumption

Config 3 High Power Consumption

These specified DC levels are the absolute maximum values for the pins for system function and safety. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.

The base HX500 system can operate with an input voltage ranging from 8V - 24V DC; however, different configurations will impact total system draw and may limit input voltage flexibility in the final application. The minimum system voltage will be limited by total system power draw and the 14A current limit of the power connectors on the motherboard. The total system power draw should be divided by the input voltage to remain within the power connector's current limit and checked against supply capability. HX600 systems with GPU configurations should use no less than 19V at the input, with 24V recommended. Please contact OnLogic for assistance calculating the total max power draw of your desired configuration. Most HX500 systems operating at 8V with turbo enabled will exceed the input current limit. Systems with Intel Turbo Boost enabled can draw up to 70W at the CPU with stock settings. Additional internal system peripherals and USB loads may cause system instability due to protection mechanisms. Systems requiring an input voltage under 12V will achieve best stability by disabling CPU turbo, or by limiting peak CPU turbo draw under 50W with a custom BIOS. Please contact OnLogic sales for additional information on custom BIOS configurations.

The Helix platform supports multiple power states. Wake-up events can be configured in the BIOS. This section describes the supported power management functions and provides information on protection circuitry for power adapters.

The auto power on feature will turn the Helix system back on after a power loss. This can be useful for automatic recovery after a power outage, or applications where the system’s power button is not easily accessible.

Power on the Helix unit and immediately press Del to access the Front Page config menu
Using the arrow keys, navigate down to “Setup Utility” and press enter

From the “Advanced” tab, select “PCH-IO Configuration”

Change “Auto Power-On” to “Enabled”

Press F10 to save and exit
Press Enter to confirm
Auto power on is now enabled

DIO option

The Helix platform supports an optional Isolated Digital I/O add-in card (OnLogic ADP120). This option enables integration of the Helix platform with existing PLC integrations or other digital logic applications. For a complete explanation of features, operating voltages, and safety information, refer to the DIO expansion information here:

The thermal performance of the Helix platform was validated by fully loading system components while the test system was exposed to high ambient temperatures in a thermal chamber environment. CPU and GPU clock speeds were measured for the duration of the test. Results were analyzed by comparing the average clock speed over the test duration to the rated base clock speed. A passing result was defined by an average clock speed no less than 10% of the rated base clock. No CPU or GPU throttling was observed during testing of both the HX500 and HX600 at the maximum rated temperature, with some configurations running above the base clock frequency.

The image below shows the thermal test results from an HX500 in a thermal chamber with an I9 10900T (10C @1.90GHz) processor installed over 10 hours at a 100% workload.

The table below shows the key takeaway values from the above test.

The image below shows the thermal test results from an HX600 in a thermal chamber over 4 hours. During the last hour of the test, after the system saturates at the required temperature, FurMark is started, running the GPU at 100% workload to find the system's limits.

The table below shows the key takeaway values from the above test.

Step 1: Attach wall mounting brackets to the chassis using the supplied screws. Specifications are as follows:

Screw type: M3X0.5 FH 120 Degree Screw

Length: 4 mm

Step 2: Locate the 4 holes that line up accordingly to the bracket as shown below.

Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.

Step 4 (for DIN Bracket): Using the outer 2 holes of the 3-hole set on the wall mount bracket, line up the DIN bracket.

Step 5 (for DIN Bracket): Using the supplied screws and a Phillips head screwdriver, mount the DIN bracket to the bracket.

Step 6 (for DIN Bracket): Mount system onto the DIN rail.

Step 1: Attach the VESA mounting plate to the chassis using:

Screw type: M3X0.5 FH 120 Degree Screw

Length: 4 mm

Step 2: Locate the 4 holes that line up accordingly to the bracket as shown.

Properly opening OnLogic systems does not void the warranty in most cases, however, some precautions are necessary to avoid damaging the system.

Perform this disassembly in an area free of static discharge and with the system fully unplugged.
Ideally, wear a grounding strap. If that is not available, regularly touch a grounded metal surface to discharge your body of static electricity.

Begin by removing the 4x Phillips P2 screws circled in red.

Next, use a small tool or your fingernail to pry the bottom place loose. It should come loose with minimal force.

The bottom plate will fall away from the system and is completely disconnected.
Set the plate aside. The disassembly process is complete.

You now have access to the internals.
This picture shows an example configuration.

Ram, WiFi, Primary Storage, Additional Storage

Begin by removing the 5x Phillips P2 screws circled in red.

Next, use a small tool or your fingernail to pry the bottom place loose. It should come loose with minimal force.

The bottom plate will fall away from the system and is completely disconnected.
Set the plate aside. The disassembly process is complete.

You now have access to the internals.
This picture shows an example configuration.

Ram, WiFi, Primary Storage, Additional Storage, PCI-E Expansion

Begin by removing the two Phillips P1 retaining screws from the card bracket. Set the bracket aside.

Determine the number of slots your PCI-E card takes up.
For a single slot card, punch out the top cover. For a dual slot card, punch out both.
Use pliers to bend the knockout a few times and it will fall off.

Set PCI-E Card in the case and slide it into the slot.

Reinstall the bracket removed in the first step. It will hold the card in place.
If needed, push the card into position before fully tightening the screws.

The card should appear level in the slot. If it is crooked, loosen the retaining screw and reposition it.
The installation is complete.

For a detailed overview of the BIOS screens and individual settings, refer to the BIOS Manual:

Version

Link

Release Notes

Update the BIOS with the file(s) above. You can follow this guide for installation instructions.

Drivers

Drivers are available in INF formats, which can be installed via a Windows deployment server, or through the Device Manager.

The Helix platform complies with the EN 55032:2015 standards for radiated and conducted emissions limits. The unit is compliant with EN 55035:2016 and tailored by EN 60601-1-2 for ESD, radiated immunity, magnetic immunity, electrical fast transient (EFT) AC power line, dips/interrupts and EFT signal line immunity based on performance criteria in Tables 4, 5, 6, 7, 8, and 9.

ESD immunity tests were performed following EN 55035 in accordance with EN 61000-4-2 and EN 60601-1-2 in accordance with EN 61000-4-2. The unit does not exhibit susceptibility to 4-kV and 6-kV contact/8-kV air and 8kV contact/15kV air discharges applied singly or repetitively and directly or indirectly. The relative humidity during unit testing was measured to be between 30% and 60%. The Helix platform was unaffected during testing.

Radiated immunity tests were performed following EN 55035 in accordance with EN 61000-4-3 and EN 60601-1-2 in accordance with EN 61000-4-3. The system does not exhibit susceptibility to 10 V/m radiated electric fields, amplitude modulated at 1000 Hz, 80%, from 80 MHz to 6 GHz. Frequencies listed are samples and spots. The Helix platform was unaffected during testing. The system does not exhibit susceptibility to radiated electric fields, in accordance with EN 61000-4-3 Table 9. The Helix platform was unaffected during testing.

Magnetic immunity tests were performed following EN 60601-1-2 in accordance with EN 61000-4-8. The system does not exhibit susceptibility to radiated magnetic fields of 30 A/m at 50/60Hz. The Helix platform was unaffected during testing.

Electrical fast transient immunity tests were performed following EN 55035 in accordance with EN 61000-4-4 and EN 60601-1-2 in accordance with EN 61000-4-4. The system does not exhibit susceptibility to 1-kV/2-kV electrical fast transients, delivered in 5-kHz bursts to power lines. “A” result = No effect on EUT. The system does not exhibit susceptibility to 0.5-kV/1-kV electrical fast transients, delivered in 5-kHz bursts to signal lines. The Helix platform was unaffected during testing.

Dips/interrupts immunity tests were performed following EN 55035 and EN 60601-1-2 in accordance with EN 61000-4-11. The system does not exhibit susceptibility. The Helix platform was unaffected during testing.

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories:

JP-1: Failure to Boot Without RTC Battery

Overview