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Helix 520 / Karbon 520 Series Industrial Computer MCU Manual
Revision
Description
Date
1.0
Initial Release
05/27/2025
Helix 520 and Karbon 520 Series computers feature an embedded power sequencing controller and support isolated Digital Input/Output (DIO) and Controller Area Network (CAN) add-in cards. OnLogic may provide updates for the embedded sequencing controller over the product’s lifetime for feature enablement or product improvement.
The DIO module has 8 input and 8 output pins, an intrusion detection pin, two contact modes, and supports firmware updates. OnLogic provides a Low-Power Microcontroller Unit (LPMCU) command line utility to interact with the DIO microcontroller. Additionally, a custom Python package is provided in to natively embed the LPMCU tool functionality in scripting environments.
The CAN add-in card provides a two-channel CAN 2.0 A/B interface with configurable bitrates from 100 kbit/s to 1 Mbit/s. The CAN bus can be controlled programmatically on Linux using the interface or on Windows via a custom C++ API. More information on the CAN module can be found in .
Helix 520 and Karbon 520 Series computers support In-System Firmware Updates to both the DIO and power sequence microcontroller using the LPMCU tool from the download link provided in . To update the embedded sequence controller, the communications port must be enabled in the BIOS (see 3.1.1) before running either the Windows or Linux tool (3.1.2 / 3.1.3). The DIO controller VCOM port is always enabled when the add-in card is installed.
Power on the system and repeatedly press the “Delete” key to access the “Front Page” menu
Choose “Setup Utility”
Navigate to Advanced > PCH-IO Configuration > Serial IO Configuration
Locate “UART0 Controller”
After completing the firmware update, the system must be shut down (reaching S5 state) in order to allow the new firmware to be loaded and executed properly.
The optional digital input/output (DIO) add-in-card (USB-16DIO-01) adds 8 digital inputs, 8 digital outputs, and an additional intrusion (INT) pin to the system.
*GND is provided as a return path for the intrusion detection switch. It is shared with the DIO - pin (ISO_GND).
The digital outputs (DO) are open-drain, and the digital inputs (DI) are high-impedance. Both DI and DO support two operating modes: wet contact and dry contact. The table below defines the logic levels for each mode based on the voltage state at the DIO terminal.
To function properly, pin V+ of the module should be connected to external power and ground. The high side of the load should be connected to the external power source, and the low side to the module DO pin. Load current should not exceed 150 mA. Voltage ranges should be 5 V to 30 V.
Setup required for Output:
Voltage is provided by the system. Each DO will output 11 V - 12.6 V when active.
Setup required for Output:
There is no internal pull up to the DI[0:7] pins when set to WET mode. Externally supplied 5 - 30V is recognized as logic 0 and 0 - 3V as logic 1 when DI[0:7] pins are set to wet contact mode.
Setup required for Input:
When the contact type is set to DRY mode, DI[0:7] are pulled up to the internal isolated ~12V supply. An open/floating connection is recognized as logic 0 and a short to GND as logic 1 when DI[0:7] pins are set to dry contact mode.
Setup required for Input:
The DIO card uses the USB-CDC communication protocol. On Windows, it will show up as “USB Serial Device (COMx)” in the device manager. On Linux, it will show up as “/dev/ttyACMx” in the serial device list.
The pin states and contact types of the DIO add-in-card can be controlled and read from using the LPMCU tool and Python API.
Command Summary of LPMCU
*See section 4.2 for mode definitions.
From Windows Command Prompt:
Using Ubuntu Terminal:
Python API Link:
Example code, setup instructions, and API specific documentation for the Python DIO utility are available below:
Full Link:
The Helix 520 / Karbon 520 Series provide an intrusion detection feature which is disabled by default. The DIO INT signal is assigned for intrusion detection. The intrusion detection feature must be enabled from the BIOS setup menu.
Navigate to the BIOS Setup Utility Menu.
Select Advanced.
Choose OnLogic Feature Configuration.
Power Button Emulation (SCI#)
When an intrusion event is detected in the Operating System environment by shorting the INT pin to ground, a power button press is triggered. The resulting action can be a shutdown, hibernation, sleep or nothing, depending on the OS configuration for power button events.
Perform Power Cycle (SMI#)
As soon as an intrusion event is detected, the system will shut down immediately.
The Helix 520 / Karbon 520 Series support In-System Firmware Updates for the DIO add-in-card using the lpmcu-tool which can be accessed within the link provided in Section 2. The commands are shown below with example outputs:
After updating the firmware, an AC power cycle is required to allow the new firmware to be loaded and executed properly.
The optional Helix 520 / Karbon 520 Series CAN add-in card (USB-02CAN-01) provides a two-channel CAN 2.0 A/B interface. The CAN bus consists of two signal lines: CAN High and CAN Low. In the dominant state, CAN High is driven to a high voltage potential of ~3.5 Volts and CAN Low is driven to a low voltage potential of ~1.5 Volts. A nominal voltage of ~2.5 Volts measured on each signal line relative to ground while the bus is idle serves as a reliable indicator of the Helix 520 / Karbon 520 Series CAN bus operational status. Additionally, the CAN bus operates in two states: dominant and recessive. The dominant state is represented by logic level 0, while the recessive state is represented by logic level 1. The CAN interface supports configurable bitrates from 10 kbit/s to 1 Mbit/s.
Diagram of a simplified CAN bus network.
The figure above shows: 1) One termination resistor at each end of the bus, 2) required endpoints of the bus acting as either transmitters or receivers, 3) High and Low CAN bus lines, and 4) additional (optional) network members connected on the same signal lines.
GitHub Repository Location: Driver installation instructions, program environment setup instructions, and example source code are found in .
Full Link:
Linux: The driver for the CAN add-in-card is included in the Linux kernel and should automatically be present on Linux Kernel 2.6.2+. If not, refer to the GitHub README in the link above for instructions on installation and usage.
Windows: Helix 520 / Karbon 520 Series systems purchased with Windows pre-installed ship with the drivers pre-installed as well. To install the CAN add-in-card driver on non-OEM provided Windows images, please refer to the README in the link above.
The ignition sense feature can be used to turn Karbon 520 Series units on and off with a battery, or vehicle’s ignition. It can also be used in non-automotive applications using a switch instead.
An example configuration is shown below. The switch connects positive DC power to the IGN pin. The unit will turn on when power is applied to the IGN pin, and turn off when power is removed. These events have configurable delays.
The Karbon 520 Series has three options for controlling automotive settings. The simplest method is to set them through the dedicated BIOS page. The LPMCU command-line tool can also configure automotive settings, provided that the access port in Windows is correctly enabled as described in . Additionally, the custom Python package provided in Section 2 can programmatically embed ignition sensing feature control within scripting environments.
Accessing Automotive Settings in the BIOS
Power on the system and repeatedly press the Del to access the BIOS
Arrow down and choose “Setup Utility” by pressing enter
Navigate to the Advanced tab and open the Automotive Ignition menu.
Set Automotive Mode Enabled
The menu reveals the configurable options that can be set by the user
Press F10 to save and exit.
Change Windows Power Button Settings
Ignition sensing simulates a power button press. In Windows, the default behavior of the power button press is to put the system into Sleep mode. Change the power button press behavior to “Shut Down” instead.
Windows “fast startup” will interfere with ignition sensing, so this should be disabled.
The following shows an example configuration for automotive timings by the LPMCU command line utility. Enter each command consecutively.
The set and get commands featured within the LPMCU tool are used to configure and retrieve settings:
lpmcu set`` ``[command] [value]. This command is used to set or configure parameters related to the LPMCU.
lpmcu get`` ``[command]. This command is used to retrieve the current value of a specific LPMCU command.
For further help text, type lpmcu set help or lpmcu get help
From Windows Command Prompt:
Change it to “Communication port <COM>” to the enable communication port.
Press F10 to Save & Exit
DO0
Digital output pin 0
DI1
Digital input pin 1
DO1
Digital output pin 1
DI2
Digital input pin 2
DO2
Digital output pin 2
DI3
Digital input pin 3
DO3
Digital output pin 3
DI4
Digital input pin 4
DO4
Digital output pin 4
DI5
Digital input pin 5
DO5
Digital output pin 5
DI6
Digital input pin 6
DO6
Digital output pin 6
DI7
Digital input pin 7
DO7
Digital output pin 7
INT
Intrusion
GND*
ISO_GND
Read digital output pin state
Pin val (0-7)
(false:logic 0, true: logic 1)
set do
Set digital output pin state
Pin val (0-7) | state (false:low, true:high)
set di-contact
Set digital input contact type*
(false:wet, true:dry)
set do-contact
Set digital output contact type*
(false:wet, true:dry)
get di-contact
Read digital input contact type*
(false:wet, true:dry)
get do-contact
Read digital output contact type*
(false:wet, true:dry)
Set to Enabled.
Enter a low-power state when the system powers off.
The system can only wake from the power button or ignition switch in this power state.
true:enabled,
false:disabled
enabled
startup-timer
The number of seconds that ignition input must be stable before the system will power on, and input voltage must be recovered from low-voltage shutdown before power on.
1-36000 (seconds)
10
soft-off-timer
The number of seconds until the MCU requests that the system power down via a virtual power button event.
1-36000 (seconds)
10
hard-off-timer
The number of seconds until the MCU forces the system to power down. This starts only after the soft-off timer or low-voltage-timer expires.
1-36000 (seconds)
30
low-voltage-timer
The number of seconds that the input voltage can be lower than the shutdown threshold before the MCU requests that the system power down via a virtual power button event.
1-36000 (seconds)
300
shutdown-voltage
The threshold of input voltage level for triggering a low-voltage shutdown event.
1.0-48.2 (volts)
10.5
input-voltage
The current input voltage level of the system.
0-48 (volts)
1.5
Updated for K520 Series Release
07/23/2025
Description
Link
LPMCU Tool and Python Package
CAN BUS Driver Installation and Program Environment
-
ISO_GND
+
Power (VIN)/VIO+
DI0
Wet Contact Mode (Default Mode of Operation)
Dry Contact Mode
DI
Logic 1: 0 to 3 VDC
Logic 0: 5 to 30 VDC (from external source)
Logic 1: Open
Logic 0: Shorted to GND
DO
Low-side switch.
Logic 1: Floating. Pulled high by an external source (5 to 30 VDC) when connected through a resistive or inductive load.
Logic 0: Ground. Low-impedance path to isolated ground.
Supply voltage (5-30 VDC) must be provided externally.
Command
Description
Parameters
Returns
get di
Read digital input pin state
Pin val (0-7)
(false:logic 0, true: logic 1)
Command
Description
Possible Values
Default
automotive-mode
Enable or disable system automotive ignition mode
true:enabled,
false:disabled
disabled












Digital input pin 0
Logic 1: High. Pulled high by internal power (11-12.6 VDC). Logic 0: Ground. Low-impedance path to isolated ground.
get do
low-power-enable
$$ lpmcu-tool.exe -p COMx version
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions] Opening COMx...
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions::connection] Reading the firmware version...
0.0.2
$ lpmcu-tool.exe -p COMx flash path-to-binary/xxxx.bin
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions] Opening COMx...
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions] Reading update file: "path-to-binary/xxxx.bin"
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions::connection] Erasing flash region 000xxxxx-000yyyyy
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions::connection] Writing binary
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions::connection] Requesting MCU reset at next reboot
Done! Shut down system to apply the update.
// access the lpmcu-tool tool
$ chmod +x ./lpmcu-tool
// to find the ttyS number at MMIO that has baud rate 115200
$ dmesg | grep -i ttyS
$ ./lpmcu-tool -p /dev/ttySx version
$ ./lpmcu-tool -p /dev/ttySx flash xxxx.bin// Set digital output contact type as dry
lpmcu-tool.exe -p COMx set do-contact true
// Set digital output 0
lpmcu-tool.exe -p COMx set do 0 true
// Clear digital output 0
lpmcu-tool.exe -p COMx set do 0 false
// Read the state of digital input 0
lpmcu-tool.exe -p COMx get di 0// Access the lpmcu-tool tool
$ chmod +x ./lpmcu-tool
// Read the state of digital output 0
$ ./lpmcu-tool -p /dev/ttyACMx get do 0$ lpmcu-tool.exe -p COMx version
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions] Opening COMx...
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions::connection] Reading the firmware version...
0.0.2
$ lpmcu-tool.exe -p COMx flash path-to-binary/xxxx.bin
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions] Opening COMx...
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions] Reading update file: "path-to-binary/xxxx.bin"
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions::connection] Erasing flash region 000xxxxx-000yyyyy
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions::connection] Writing binary
[yyyy-mm-ddThh:mm:ssZ INFO lpmcu_actions::connection] Requesting MCU reset at next reboot
Done! Shut down system to apply the update.
// access the lpmcu-tool tool
$ chmod +x ./lpmcu-tool
$ dmesg | grep -i ttyACM
$ ./lpmcu-tool -p /dev/ttyACMx version
$ ./lpmcu-tool -p /dev/ttyACMx flash xxxx.bin// Enables system automotive ignition mode
lpmcu-tool.exe -p COMx set automotive-mode true
// Set the number of seconds that ignition input must be stable before system will power on as 60 seconds
lpmcu-tool.exe -p COMx set startup-timer 60
// Set the number of seconds until MCU requests system to power down via a virtual power button event as 30 seconds
lpmcu-tool.exe -p COMx set soft-off-timer 30
// Set the number of seconds until MCU forces system to power down as 180 seconds. This starts only after soft-off timer or low-voltage-timer expires
lpmcu-tool.exe -p COMx set hard-off-timer 180
// Set the threshold of input voltage level for triggering low-voltage shutdown event as 12.5 volts
lpmcu-tool.exe -p COMx set shutdown-voltage 12.5
// Set the number of seconds that the input voltage can be lower than the shutdown threshold before MCU requests system to power down via a virtual power button event as 120 sec
lpmcu-tool.exe -p COMx set low-voltage-timer 120
// Get the current input voltage level of the system
lpmcu-tool.exe -p COMx get input-voltageThe Helix and Karbon 520 Series computers harness the advanced power and integrated edge AI capabilities of Intel® Core™ Ultra processors, delivering highly scalable performance in a fanless, robust design. Engineered for the evolved edge, these systems offer versatile connectivity, including ModBay™ expansion, and robust reliability within their 0°C to 50°C and -40º to 70ºC operating temperature ranges, to meet the demands of diverse industrial applications. Comprehensive features like cable retention and remote management capabilities (including Intel vPro®) ensure streamlined deployment and long-term operational efficiency.
For more information on accessories and additional features, visit the following product pages:
警告:為避免電磁干擾,本產品不應安裝或使用於住宅環境
Warning: To avoid electromagnetic interference, this product should not be installed or used in a residential environment
Any included or additional accessories, such as mounting brackets, power supplies, or antennas, are located in the accessory box at the bottom of the system box. All drivers and product guides can be found on the product's dedicated webpage.
Note: Pin 6 and 12 are motherboard GND pins.
Note: Pin 2 or the "-" label is the motherboard GND pin.
*Note: Pin 1 and pin 20 are isolated DIO ground pins, which are different from the motherboard GND. It is not recommended to connect them directly to the motherboard GND unless your application requires it.
Notes:
The CAN H pins are labeled "+" on the system.
The CAN L pins are labeled "-" on the system.
The ISO GND pins are labeled with the GND symbol on the system, however both are independent isolated grounds. It is not recommended to connect them together if both CAN bus channels are not on the same network.
The CBDT122 serial breakout cable converts an HX520/K520 serial connector to two DB9 connectors.
This image shows the difference between the 2x DB9 Breakout Cable and the standard COM Mating Connector:
Power LED Definition
Off: Power off.
Slow Blink (1/3Hz): Low/Standby Power State.
On: Power On/Normal Power State.
Drive Activity LED
Blinking: Read/Write activity on m.2 storage device.
Error LED Definition
Slow Blinking (0.5Hz): Boot Issue (no boot device found).
Fast Blinking (4Hz): Voltage fault.
Solid: Memory Fault or no DIMMs installed.
The Helix and Karbon 520 Series have six USB 3.2 Gen 2 Type A ports (10 Gbps, 5V @ 900mA). Optional ModBay cards can add up to eight more USB 3.2 Gen2 Ports.
The Helix 520 Series has two Thunderbolt Gen 4 compliant ports (40 Gbps). Maximum 5V@3A/port or 5V@4.5A total for 2 ports. Single port maximum power is 15W and 2 ports maximum power is 22.5W.
The Karbon 520 Series has two USB 4 ports (40 Gbps). Maximum 5V@3A/port or 5V@4.5A total for 2 ports. Single port maximum power is 15W and 2 ports maximum power is 22.5W.
The Helix and Karbon 520 Series have two full-size DisplayPorts, both supporting DP 2.1 up to UHBR20. Please refer to Intel documentation for additional Core Ultra Series 1 and Core Ultra Series 2 display output specifications: .
The Helix and Karbon 520 Series have one 3FF Micro-SIM card slot on the top panel that works with 4G LTE and 5G cellular modems. The SIM card is mapped to the M.2 B-key slot. The SIM slot is push-push; push to insert and push to remove.
The Helix and Karbon 520 Series allow the enablement of a factory reset switch accessible through the front I/O face of the system that, when depressed, resets system BIOS settings back to factory defaults or custom set values.
The Intel i226 LAN Port on the Helix 520 (i226-LM) and Karbon 520 (i226-IT) Series support up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. This port also features Intel’s vPro® technology enabling remote out-of-band management and security features (supported on motherboards with Intel Core Ultra 5 135H and Intel Core Ultra 7 165h/265H Processors). The LAN link state is shown by the two LEDs on the port. The description of LED activity is shown in section 6.4.3 above.
For instructions on enabling vPro/AMT on the Helix 520 and Karbon 520 Series of systems, refer to the .
Motherboard Features
Please Note: There is a difference in labeling of front USB C ports between the HX520 series and K520 series. The HX520 series carries a Thunderbolt 4 logo while the K520 Series carries a USB 4 logo.
This slot supports PCIe Gen 4 x4 and is designed for NVMe or storage drives. A full pinout table for this expansion slot is provided in the .
This expansion slot is capable of supporting PCIe Gen 4 x2, SATA III, USB 3.2 Gen 2, USB 2.0, and one SIM card input from the external I/O. This slot is designed to support various expansion cards such as SATA storage drives and 4G LTE or 5G cellular cards. A full pinout table for this expansion slot is provided in the .
This slot supports PCIe Gen 4 x1 and USB 2.0 signals and is designed for M.2 2230 Wi-Fi expansion cards.
The systems have one PCIe x16 connector on the motherboard. It is used with OnLogic risers for various PCIe configurations in models HX/K522/3/4/5.
This riser supports a dual slot, full height, half length PCIe Gen 5 (x16 Physical/ x8 Electrical) expansion card in the HX524. There are two fan headers on the riser as well to support the fan in the chassis.
The Helix 520 series supports up to two DDR5 SO-DIMM slots rated up to 5600MTUs (MTL) and 6400MTUs (ARL).
In-Band Error Correction Code (IBECC) is optionally supported for symmetrical RAM configurations. IBECC is a specialized memory protection technology designed to enhance system reliability without requiring the additional physical memory chips traditionally associated with ECC (Error Correction Code). See BIOS Manual for more information.
The power consumption of the Helix 520 Series was measured for various system configurations, workloads, and power states at a 24V system input voltage. Tests were conducted using Furmark and Burnintest v9.0 to stress system components. These tests were performed with Intel Turbo Boost Enabled. The build configurations and power consumption are listed in the tables below. The power consumption listed below is the average power draw over a 5 minute window from the test start. This includes a brief period of PL2 power levels (Intel turbo Boost) where the power consumption is elevated. The highest power consumption seen during the period of turbo PL2 is shown at the bottom of each table. The data collected is similarly representative of systems in the Karbon 520 series.
The power consumption for each system configuration is recorded below.
The Helix and Karbon 520 Series support multiple power states. The wake-up events can be configured in the MCU and BIOS. This section describes the power management functions you can perform and gives information on protection circuitry for power adapters.
*Only supports legacy S3
The DC voltage levels specified are the absolute maximum allowable values for the system to function safely. The protection circuitry allows for brief transient voltages above these levels.
When an external GPU card is installed, the MCU will start monitoring the input voltage. The GPU power brake will be asserted when the input voltage is less than 15.6V to avoid excessive current draw from the power source in order to protect the power cable and input connector from damage. This GPU power brake will be de-asserted when the input voltage is higher than 17.1V.
Assertion of the GPU Power Brake is necessary at low voltages where high power draw from CPU, GPU, and platform devices would result in high input currents that may exceed ratings of the power connectors. The GPU brake will limit GPU power power at these voltages until input voltage is returned to safe levels.
When the power brake is activated, the power LED blinks at 25 Hz.
The 4x LAN Expansion (MODBAY-4LAN02) adds additional RJ45 GbE LAN ports to the HX523 and K523. This ModBay uses dedicated Intel I210-IT network controllers for each port which support speeds up to 1 Gbps.
Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC
The 4x PoE Expansion (MODBAY-4POE01) adds RJ45 GbE PoE LAN ports to the HX523 and K523. Each port supports up to 1 Gbps and PoE output. PoE power budget depends on system power input.
Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC
The 3x M12 LAN Expansion (MODBAY-M12LAN01) adds additional M12 X-coded GbE LAN ports to the HX523 and K523. This ModBay uses dedicated Intel I210-IT network controllers for each port which support speeds up to 1 Gbps.
Supported cables:
CABLE-M12-RJ45-5M (5 Meter X-coded M12 to RJ45)
CABLE-M12-RJ45-10M (10 Meter X-coded M12 to RJ45)
Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC
The 3x M12 PoE Expansion (MODBAY-M12POE01) adds additional M12 X-coded GbE PoE LAN ports to the HX523. This ModBay uses dedicated Intel I210-IT network controllers for each port which support speeds up to 1 Gbps. Additionally, each port supports PoE output. The power budget for PoE is dependent on the voltage of the system power input. Refer to Appendix C for PoE power budgets.
Supported cables:
CABLE-M12-RJ45-5M (5 Meter X-Coded RJ45 to M12)
CABLE-M12-RJ45-10M (10 Meter X-Coded RJ45 to M12)
Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC
The 2x 10Gb LAN Expansion (MODBAY-10GLAN01) adds RJ45 10 GbE LAN ports to the HX523. This ModBay uses a single X550 network controller which supports individual port speeds up to 10 Gbps and a maximum combined speed up to 15 Gbps across both ports.
Operating Temperature: HX523 0ºC to 40°C Operating Temperature: K523 -40ºC to 40ºC
The 4x USB3 Expansion (MODBAY-04USB-02) adds additional USB 3.2 Gen 2 Type-A ports to the HX523. This ModBay uses two USB controllers which support individual port speeds up to 10 Gbps and a maximum combined speed up to ~26 Gbps across all ports. The controllers are the PCI11400 (PCIe Gen 3 x2 to 2x USB 3.2 Gen 2) and the USB7206i (1x USB 3.2 Gen 2 to 2x USB 3.2 Gen 2). Each port is rated to 5V @ 900mA of power delivery per USB-IF specification. These ports can only wake in sleep and are not active in Hibernate system states.
Operating Temperature: HX523 0ºC to 50°C Operating Temperature: K523 -40ºC to 70ºC
The nominal power budget for all PoE ports on the Helix 520 and Karbon 520 Series is provided below. These values are provided for room temperature operating conditions. Please contact OnLogic for specific derating information for your installation.
Testing Conditions
Temperature Range: 0ºC to 50ºC
Step size: 5ºC / 10ºC
Stress Levels
CPU (100% - Intel PTAT)
Results Summary
Temperature Range: -40ºC to 70ºC
Step size: 5ºC / 10ºC / 20ºC
Stress Levels
Step 1: Remove the two screws in the rear of the system.
Step 2: Align the two screw holes on the back of the system with the holes in the DIN clip.
Step 3: Fasten the din clip with the screws removed in step 1 (M3X0.5 Flathead Screw, 6mm Long) WARNING: Using a screw longer than 6mm may damage the system.
Step 4: Hook the spring side of the DIN clip onto the DIN rail, then press firmly until the clip snaps over the other side of the rail.
Step 1: Remove the four screws in the rear of the system.
Step 2: Align the four screw holes on the back of the system with the holes in the DIN clip.
Step 3: Fasten the DIN clip with the screws removed in step 1 (M3X0.5 Flathead Screw, 6mm Long) WARNING: Using a screw longer than 6mm may damage the system.
Step 4: Hook the spring side of the DIN clip onto the DIN rail, then press firmly until the clip snaps over the other side of the rail.
Step 1: Remove the four screws in the rear of the system.
Step 2: Align the first 2 screw holes on the back of the system with the holes in the DIN clip.
Step 3: Fasten the DIN clip with the screws removed in step 1 (M3X0.5 Flathead Screw, 6mm Long) WARNING: Using a screw longer than 6mm may damage the system.
Step 4: Repeat steps 2-3 for the second DIN clip. Ensure the second DIN clip is oriented in the same direction as the first DIN clip
Step 5: Hook the spring side of the DIN clip onto the DIN rail, then press firmly until the clip snaps over the other side of the rail.
Step 1: Align the four screw holes on the bottom of the system with the respective holes on the mounting brackets.
Step 2: Attach wall mounting brackets (MTW101) or DIN mount Bracket (MTD102-K), to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).
Step 3 (Wall Mount only): Install system to surface using keyhole slots on wall mount brackets and appropriate hardware for the surface (not provided).
Step 4 (DIN Bracket only): Align the mounting holes of the din clip bracket to the three mounting holes on the wall mount bracket. Install the 6x M4 screws (M4x0.7 Self Tapping, Philips Head, 6mm Long) to secure the DIN clip.
Step 5 (DIN Bracket only): Hook the solid side of the DIN clip onto the DIN rail, then press firmly until the clip snaps over the other side of the rail.
Step 1: Peel feet from adhesive.
Step 2: Align feet with markings on Secondary Heatsink as shown.
Step 1: Align the four screw holes on the bottom of the system with the respective holes on the VESA bracket.
Step 2: Attach VESA Bracket to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long) Use a torque of at least 200 N-cm (18 in-lbs) to attach the bracket.
Step 3: Install the system to VESA 75 or VESA 100 mounting pattern using provided VESA Mount screws.
Step 1: Separate the two bracket segments by first removing the M4 screw on either side of the bracket (M4X0.7 Phillips head, 6 mm long). With the screws removed, the bracket segments can be separated by removing the smaller bracket from the hooked tabs on the top edge of the larger bracket.
Step 2: Align the screw holes indicated with “1” marking with the bottom holes of the system. Secure the system using the 4x supplied M3 screws (M3X0.5 Flathead Screw, 6mm Long). Use a torque of at least 200 N-cm (18 in-lbs) to attach the bracket.
Step 3: Install the large bracket/system assembly to a VESA 75 or VESA 100 mounting pattern on a monitor stand/arm using the provided M4x0.7 8mm length screws. Note the arrow marking on the bracket indicating which side of the bracket should be facing UP.
Step 4: Install the remaining smaller bracket to a monitor VESA 75 or VESA 100 mounting pattern using the provided M4x0.7 8mm long screws. Note the arrow marking on the bracket indicating which side of the bracket should be facing UP.
Step 5: Install the small bracket/monitor assembly to the large bracket/system assembly on the mounting arm by aligning the hooks/tabs and slot the pieces together. Secure the bracket segments together using the 2x M4 screws removed in Step 1.
Properly opening OnLogic systems does not void the warranty in most cases, however, some precautions are necessary to avoid damaging the system.
Perform this disassembly in an area free of static discharge.
Disconnect power, video, and any other connections to the system. It should be fully unplugged.
Ideally, wear a grounding strap. If that is not available, regularly touch a grounded metal surface to discharge your body of static electricity.
All of the different system models in this series begin their disassembly by removing the bottom plate:
After removing the bottom plate, you will have access to the motherboard. The motherboard used is the same for all variants in the series. Here is the layout:
Reference the full here.
Windows Drivers
Please follow this link for a guide on updating your system's drivers:
LPMCU Tool
Reference here.
MCU Updates
DIO Python Package
Download Instructions
Download .zip File - For a simple copy of the files, use this direct download link:
Clone with Git - Use a terminal to clone the repository.
Drivers
Drivers are available in INF formats, which can be installed via a Windows deployment server, or through the Device Manager. Follow our guide for .
Windows 11 -
Please follow this link for a guide on updating your system's drivers:
Reference the full .
If the system fails to power on or is unresponsive, clearing the CMOS may help. It will also restore the BIOS to factory defaults.
The CMOS reset button on all HX52X systems can be found next to the power button, as indicated here
To perform the reset, begin by powering off the system
While holding the reset button, press power button to power the system on
Description
Some Windows installation methods may result in serial port number collisions.
The Helix 520 Series systems implement three serial port types - PCH UART, SIO COM, and USB VCOM. Depending on the order of driver installation, Windows may assign duplicate serial port numbers (in the format COM[n]).
Resolution
Serial port numbers can be changed from the Windows Device Manager after driver installation, or drivers can be injected via enterprise deployment methods prior to first boot to mitigate this issue.
Windows installations performed by OnLogic are shipped with unique serial interface numbers. DIO Labeling
Description
The Helix 520 Series top plate DIO labeling has “-” and “GND” labels for pins that both connect to the DIO expansion isolated ground (ISO_GND). The other ground pins indicated by the system labeling are tied to the non-isolated DC GND. There is no functional impact to system performance, but some users may find this labelling confusing.
Resolution
GND label on the DIO connector will be changed to ISO_GND on a future revision.
Description
Ethernet port assignments in Windows may not be issued consistently between configurations due to Windows port enumeration rules, meaning that the indicated port numbers on the front of the system may not match the numbers assigned by Windows.
Resolution
Users/installers may associate external Ethernet port numbers with the Windows-assigned scheme using the Powershell command Get-NetAdapterHardwareInfo.
In the results generated by the command, adapter names and PCIe Bus numbers are displayed. The external port numbers from the plate label are equivalent to the PCIe Bus numbers (Port 1 = Bus 1, etc.). The Powershell command Rename-NetAdapter can then be used to rename Ethernet ports to user preference.
Description
Intel VMD is a technology allowing for internal storage to be added to RAID configurations without a discrete RAID controller. While OnLogic is not currently offering configurations that are VMD-compatible, the BIOS options for VMD are available for future use.
When VMD is enabled via the BIOS configuration menu, and drives are added to the VMD controller by enabling either VMD Global Mapping or adding individual drives to the VMD controller from the same menu page, systems may fail to boot after the configuration is applied.
Resolution
Users are advised to keep VMD and VMD Global Mapping disabled. There is no workaround.
RAID support is offered via a discrete controller in the Helix 522 model and is not affected by this issue.
Description
The Windows driver for the GPIO subsystem of the Microchip PCI11000 family IO controllers used on the Helix 523 model and MODBAY-04USB-02 expansion card is not signed, so Windows will not load it. A yellow bang ( ! ) warning indicator and error message is displayed in the Windows Device Manager.
This error message has no effect on system performance and may be ignored. The GPIO subsystem is required to be enabled on-chip for full function, but no direct driver/OS interaction is required.
Resolution
A signed driver release is in progress, and will be made available when it is complete.
Description
When attempting to use Wake-on-LAN (WoL) from S4 (hibernate) and S5 (soft off) power states, the system may hang, preventing proper system startup. This issue is specific to the Modbay-M12LAN01 card.
Resolution
For WoL from S4 or S5 power states, the Modbay-M12PoE or Modbay-4LAN cards should be used. The Modbay-M12LAN01 card is only recommended for Wake-on-LAN from S3 (sleep) power state.
Description
When Wake On PME is enabled in the BIOS but WoL is disabled in the operating system for LAN port 1 in Ubuntu 24.04 Desktop/Server, the disagreement in settings causes unintended wake events to occur from S4/S5.
Resolution
Ensure agreement between the wake on PME setting in the BIOS and WoL setting in the OS. If WoL functionality is desired, ensure both settings are enabled. If WoL functionality is not desired, ensure both settings are disabled.
This device has been tested to the relevant EMC and Safety standards. Modifications by the user may invalidate certifications. Testing included EN 55032, EN 55035, EN 60601-1-2, IEC 62368-1, IEC 60945 Ed. 4, and many others, please see specifications for details.
This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
CAN ICES-003(A) / NMB-003(A)
The computer system was evaluated for medical and IT equipment EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.
This product must be used with an in-line EMI filter when connected directly to a DC mains supply in maritime and DNV applications. The recommended EMI filter is a Delta 30DKCS5. Any filter used must be appropriately rated to handle the voltage and current draw of the system and must have a minimum insertion loss of 30dB at 1MHz.
Datasheet for the 30DKCS5 including electrical specifications, wiring diagram, and dimensions.
This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI). If this equipment is used in a domestic environment, radio interference may occur, in which case the user may be required to take corrective actions.
For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.
Memory
2x DDR5 5600 SO DIMM Up to 96GB Total Optional IBECC (Enabled in BIOS)
2x DDR5 5600 SO DIMM Up to 96GB Total Optional IBECC (Enabled in BIOS)
Integrated Graphics
Intel UHD Graphics
Intel Arc (Dual Channel Memory Required)
Intel UHD Graphics
Intel Arc (Dual Channel Memory Required)
Front I/O
1x Power Button
1x Factory Reset Switch
1x 3.5mm Audio Jack
6x USB 3.2 Gen 2 (Type A)
2x Thunderbolt 4, USB Type C (40 Gb/s)
4x 2.5Gb LAN
1x Power Button
1x Factory Reset Switch
1x 3.5mm Audio Jack
6x USB 3.2 Gen 2 (Type A)
2x USB4, USB Type C (40 Gb/s)
4x 2.5Gb LAN
Top I/O
1x 4 pin Terminal Block Power
1x 3ff SIM Slot (Mapped to M.2 B-Key)
5x Antenna Mounting Holes
1x Grounding Lug
1x 5 pin Terminal Block Power
1x 3ff SIM Slot (Mapped to M.2 B-Key)
5x Antenna Mounting Holes
1x Grounding Lug
Bottom I/O
1x Remote Switch
2x DisplayPort 2.1 UHBR20
2x Dual COM (RS-232, RS-485, RS-422)
1x Fan Hat Connector
1x Remote Switch
2x DisplayPort 2.1 UHBR20
2x Dual COM (RS-232, RS-485, RS-422)
1x Fan Hat Connector
Expansion & Storage
1x M.2 M-Key 2280/2260 (PCIe Gen4 x4)
1x M.2 E-Key 2230 (WiFi), PCIe Gen4 x1, USB2.0)
1x M.2 B-Key 3042/3052/2280 (PCIe Gen4 x2, USB2.0 or PCIe Gen4 x1, USB3.2 Gen 1 or SATA III, USB3.2 Gen 1)
1x PCIe Gen5 x16 mechanical/x8 electrical FHHL
1x M.2 M-Key 2280/2260 (PCIe Gen4 x4)
1x M.2 E-Key 2230 (WiFi), PCIe Gen4 x1, USB2.0)
1x M.2 B-Key 3042/3052/2280 (PCIe Gen4 x2, USB2.0 or PCIe Gen4 x1, USB3.2 Gen 1 or SATA III, USB3.2 Gen 1)
1x PCIe Gen5 x16 mechanical/x8 electrical FHHL
Special Features
1x Kensington Lock
1x Kensington Lock
Optional Add-On Modules
1x 8 Pin Isolated CAN
1x 20 Pin Isolated DIO
1x 8 Pin Isolated CAN
1x 20 Pin Isolated DIO
Operating Systems
Windows 11 IoT Enterprise LTSC2024
Windows 11 Pro (Pending Intel Enablement)
Ubuntu 24.04 Desktop/Server
Red Hat Enterprise Linux 9.6+/ Red Hat Enterprise Linux 10.0+ (HX520 Series)
Windows 11 IoT Enterprise LTSC2024
Windows 11 Pro (Pending Intel Enablement)
Ubuntu 24.04 Desktop/Server
Red Hat Enterprise Linux 9.6+/ Red Hat Enterprise Linux 10.0+ (K520 Series)
LAN Controllers
4x I226-V (Core Ultra 5 125H/225H)
3x I226-V, 1x I226-LM (Core Ultra 7 165H/265H & Core Ultra 5 135H/235H)
4x I226-IT
Antenna Holes
6x Antenna holes
6x Antenna holes
Voltage Input
Rated Input 12-24VDC HX521
Rated Input 12-24VDC HX522
Rated Input 19-24VDC HX523/4/5
Rated Input 12-48VDC K521
Rated Input 12-48VDC K522
Rated Input 19-48VDC K523/4/5
Dimensions
HX521: 50.8mm x 177 mm x 225mm
HX522/523/524/525: 108mm x 177mm x 225mm
K521: 50.8mm x 177 mm x 225mm
K522/523/524/525: 108mm x 177mm x 225mm
Mounting
DIN
VESA
In-Line VESA
Wall
DIN
VESA
In-Line VESA
Wall
Operating Temperature
0°C to 50°C
-40°C to 70°C
Storage Temperature
-40°C to 85°C
-40°C to 85°C
Operating Humidity
5% to 95% Non-Condensing
5% to 95% Non-Condensing
RoHS Directive (2011/65/EU, (EU)2015/863)
WEEE Directive (2012/19/EU)
IEC60601-1-2, 4th ed.
EN 60945, 4th ed.
4
IN_7
5
OUT_6
6
IN_6
7
OUT_5
8
IN_5
9
OUT_4
10
IN_4
11
OUT_3
12
IN_3
13
OUT_2
14
IN_2
15
OUT_1
16
IN_1
17
OUT_0
18
IN_0
19
V_DIO+
20
ISO_GND*
On
LAN Link established
Link
Yellow
Blinking
LAN activity occurring
Speed
-
Off
100 or 10Mb/s data rate
Speed
Amber / Orange
On
1000 Mb/s data rate
Speed
Green
On
2500 Mb/s data rate
D
Thunderbolt 4 (USB-C) (2x) *HX520 Series)
USB 4 (40Gb/s) (USB-C)(2x) *K520 Series)
E
CMOS Battery
F
2.5 GbE LAN ports (4x)
G
Remote Switch
H
DisplayPorts (2x)
J
COM RS-232/422/485 ports (2x)
K
External fan header
L
PCIe Aux power and fan control header
M
DDR5 SO-DIMM slots (2x)
N
PCIe Gen 5.0 (x16 Physical/x8 Electrical)
P
4-pin Power Input
Q
M.2 E-Key PCIe Gen4 x1 / USB 2.0
R
M.2 B-Key PCIe Gen4 x2, USB 2.0 / PCIe Gen4 x1, USB 3.2 Gen 1 / SATA Gen3 x1, USB 3.2 Gen 1
S
M.2 M-Key PCIe Gen4 x4
USB Type C / Thunderbolt
S5, S4, S3*
Only supported with Thunderbolt vPro Docking system[cite: 324].
USB Type A
S3*
Minimum safe reverse voltage
-24V
-48V
60W
48V
90W
90W
K520 Series Only
SSD, and RAM (80% - Passmark BiT)
GPU (100% if applicable - Furmark)
SSD, and RAM (80% - Passmark BiT)
GPU (100% if applicable - Furmark)
git clone https://github.com/onlogic/onlogic-m031-manager.git
SSH:
git clone git@github.com:onlogic/onlogic-m031-manager.git
The screen will show "System will reboot to reset to default." and will prompt the user to press “ok”
The system will reset
The reset to default completes
Severity:
Low
Severity:
Low
Severity:
Low
Severity:
High
Severity:
Low
Severity:
Low
Severity:
Low
Variants
HX521 - Base System
HX522 - SATA/HotSwap Expansion
HX523 - ModBay Expansion
HX524 - PCIe Expansion
HX525 - MXM Expansion
K521 - Base System
K522 - SATA/HotSwap Expansion
K523 - ModBay Expansion
K524 - PCIe Expansion
K525 - MXM Expansion
Processor
MTL-H Core Ultra 5 125H
MTL-H Core Ultra 5 135H
MTL-H Core Ultra 7 165H
ARL-H Core Ultra 5 225H
ARL-H Core Ultra 7 265H
MTL-H Core Ultra 5 125H
MTL-H Core Ultra 5 135H
MTL-H Core Ultra 7 165H
ARL-H Core Ultra 5 225H
ARL-H Core Ultra 7 265H
UL/IEC CB Scheme 62368-1 Product Safety
EU Low Voltage Directive 2014/35/EU
FCC 47 CFR Part 15 Subpart B (Class A)
EN 55032
CISPR 32/EN 55035
CISPR 35/EN 55035
Radio Equipment Directive (2014/53/EU)
1
ISO_GND*
2
INTRUSION
3
Link
-
Off
LAN Link not established
Link
Item
Description
A
Power Button
B
Audio Jack
C
USB 3.2 Gen 2 Type-A ports (6x)
PCIe GEN4 x2 lane + USB2.0
PCIe GEN4 x1 Lane + USB3.2 Gen1 (inclusive of USB2.0)
SATA GEN3 x1 Lane + USB3.2 GEN1 (inclusive of USB2.0)
USB3.2 GEN1 (inclusive of USB2.0)
Power Button
Ultra-low power (PG3), S5, S3*
LAN
S5, S4, S3*
Must be enabled in BIOS[cite: 324].
Nominal operating voltage
12-24V
12-48V
Maximum safe DC voltage
28.8V
57.6V
12V
30W
N/A
Vadc
24V
Remove x4 screws from the bottom of the system
Note: Remove any/all mounting hardware.
You will now have access to the hot swap bay section of your system
Further Disassembly is possible but not recommended. Please contact technical support before continuing.
You will now have access to the modbay section of your system
Further disassembly is possible but not recommended. Please contact Technical support before continuing
You will now have access to the PCIe expansion section of your system
Further disassembly is possible but not recommended. Please contact Technical support before continuing
You will now have access to the MXM expansion section of your system
Further disassembly is possible but not recommended. Please contact Technical support before continuing
Z01-0009S102
Z01-0009S011
v9.0.0
Category:
OS Compatibility
SKU(s) Affected:
HX520 Series
Revision(s) Affected:
All
Revision Resolved:
Open
Category:
Mechanical
SKU(s) Affected:
HX520 Series
Revision(s) Affected:
All
Revision Resolved:
Open
Category:
Port Enumeration
SKU(s) Affected:
HX/K520 Series
Revision(s) Affected:
All
Revision Resolved:
Open
Category:
Firmware
SKU(s) Affected:
HX/K520 Series
Revision(s) Affected:
Z01-009I010 and before
Revision Resolved:
Z01-009I011
Category:
OS Compatibility
SKU(s) Affected:
HX/K523, MODBAY-04USB-02
Revision(s) Affected:
All
Revision Resolved:
Open
Category:
System Compatibility
SKU(s) Affected:
ModBay-M12LAN01 - HX523/K523
Revision(s) Affected:
B02-00035R3
Revision Resolved:
Open
Category:
OS Compatibility
SKU(s) Affected:
HX52x, K52x
Revision(s) Affected:
All
Revision Resolved:
Open
Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.
Modification of the device may void certifications, warranty and/or cause possible injury to the user.
Safe use and installation instructions
Care must be taken handling the device to prevent injury to self or possibility of damaging the unit.
Read the entire manual before using the product.
Install the device securely per user manual instructions.
VESA mounting device should use 4x M4x0.7mm L=10mm screws to VESA arm or mount to threaded holes on rear of chassis. Screws should be a minimum length of 6mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.
Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or back enclosure during operation and up to 30 minutes after shutdown allowing the unit to cool down.
Ambient operating temperature must be between 0 to 50°C (HX520 Series) or -40ºC to 70ºC (K520 Series) with a non-condensing relative humidity of 5-95%.
The device can be stored at temperatures between -40 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, for a minimum of 3 hours.
Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.
Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then the recommended device orientation is such that heatsink fins allow air to rise unobstructed.
Caution, Risk of Electric Shock! The unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!
To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC (HX520 Series) or 12-48VDC (K520 Series), see specs for details.
When installing the device only use shielded network cables.
The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.
Service and repair of the device must be done by qualified skilled service personnel. This includes, but is not limited to replacement of the CMOS battery. The replacement CMOS battery must be UL recognized and meet the same minimum requirements as the original.
Proper disposal of the CMOS battery must comply with local governance.
The radio device is not intended for emergency service use.
To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band PIFA antennas with 2dBi/2dBi gain (2.4, 5Ghz, and 6 Ghz) for Wifi/BT.
This equipment is not suitable for use in locations where children are likely to be present.
WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.
Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.
La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures à l'utilisateur.
Instructions d'utilisation et d'installation en toute sécurité
Des précautions doivent être prises lors de la manipulation de l'appareil pour éviter de se blesser ou d'endommager l'appareil.
Lisez l'intégralité du manuel avant d'utiliser le produit.
Installez l'appareil en toute sécurité selon les instructions du manuel de l'utilisateur..
Le dispositif de montage VESA doit utiliser 4 vis M4x0,7 mm L = 10 mm sur le bras VESA ou être monté sur des trous filetés à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 6 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support au-delà de 1,5 mm.
Attention, surface chaude! Il est normal pour les unités de se réchauffer et de devenir chaude au toucher. Évitez de toucher les surfaces de dissipation de chaleur ou le boîtier pendant l’utilisation ou jusqu’à 30 minutes après l’arrêt pour permettre à l’unité de se refroidir.
La température ambiante de fonctionnement doit être comprise entre 0 et 50 °C (série HX520) ou entre -40 °C et 70 °C (série K520) avec une humidité relative sans condensation de 5 à 95 %.
L'appareil peut être stocké à des températures comprises entre -40 °C et 85 °C. Remarque : L'unité doit être stabilisée à la température de fonctionnement avant utilisation, minimum 3 heures.
Gardez l'appareil à l'écart des liquides et des matériaux inflammables. Ne pas installer dans un environnement dangereux.
Prévoyez un espace suffisant autour de tous les côtés de l'appareil pour un refroidissement correct et pour ne pas dépasser sa limite de température de fonctionnement maximale. Si l'appareil est installé sur une surface verticale, l'orientation recommandée de l'appareil est telle que les ailettes du dissipateur thermique permettent à l'air de monter sans obstruction. Des orientations alternatives peuvent entraîner une plage de températures de fonctionnement réduite.
Avertissement! Risque de choc électrique ! L'unité est alimentée uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) à l'appareil !
Pour alimenter l'appareil, utilisez uniquement des blocs d'alimentation externes homologués UL ITE avec une sortie CC de 12 à 24 V CC (série HX520) ou 12 à 48 V CC (série K520), voir les spécifications pour plus de détails.
Installez l'appareil uniquement avec des câbles réseau blindés.
L'installateur doit avoir de l'expérience dans l'installation du marché secondaire et être familiarisé avec les pratiques générales d'installation de l'électronique.
L'entretien et la réparation de l'appareil doivent être effectués par un personnel d'entretien qualifié et qualifié. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être reconnue UL et d'un type similaire à l'original.
L'élimination appropriée de la batterie CMOS doit être conforme à la gouvernance locale
L'appareil radio n'est pas destiné aux services d'urgence..
Pour vous protéger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes PIFA double bande fournies avec un gain de 2 dBi/2 dBi (2,4, 5 Ghz, et 6 Ghz) pour le Wifi/BT.
Cet équipement n'est pas adapté à une utilisation dans des endroits où des enfants sont susceptibles d'être présents.
AVERTISSEMENT : Il existe un risque d'explosion si la pile CMOS n'est pas remplacée correctement. L'élimination de la batterie dans le feu ou dans un four chaud, ou l'écrasement ou le découpage mécanique d'une batterie peut entraîner une explosion.
請勿開啟和修改該設備!該設備符合各種國家和國際安全、電磁相容和環境要求。
修改設備可能會使認證、保固失效和/或對使用者造成傷害。
安全使用和安裝說明
操作設備時必須小心,以防止傷害自己或損壞設備。
使用產品前請閱讀完整手冊。
請依照使用手冊說明安全地安裝設備。
VESA 安裝設備應使用 4 個 M4x0.7 毫米 L=10 毫米螺絲固定 VESA 支架或將其安裝到機殼背面的螺紋孔中。螺絲長度至少應為 6 毫米。板或支架厚度每超過 1.5 毫米,螺絲長度每增加 1 毫米。
VESA 安裝設備應使用 4x M4x0.7mm L=10mm 螺絲固定在 VESA 臂上或安裝到底盤後部的螺紋孔中。螺絲的長度至少應為 6 毫米。板或支架的厚度每超過 1.5 毫米,螺絲長度每增加一毫米,螺絲長度增加 1 毫米。
小心,表面高溫!設備發熱且摸起來很燙是正常現象。在運作期間以及關機後 30 分鐘內請勿觸摸散熱器區域或後部外殼,以便設備冷卻。
環境工作溫度必須介於 0 至 50°C(HX520 系列)或 -40ºC 至 70ºC(K520 系列)之間,且無凝結相對濕度為 5-95%。
該設備可儲存在-40°C至85°C的溫度下。注意:設備在使用前必須穩定在工作溫度範圍內,至少3小時。
如果 CMOS 電池更換不正確,則可能有爆炸的危險。將電池投入火中或熱爐中,或以機械方式擠壓或切割電池可能會導致爆炸。
Additional information can be found in the HX520 / K520 MCU Manual
Additional information can be found in the HX520 / K520 MCU Manual
Based on OnLogic testing, a fanhat is not required for system operation across the full specified ambient temperature range - the system will operate without failures. However, especially above 50°C but also generally, and depending on application/use case, a fanhat can provide a beneficial performance bump. The improvement will vary depending on anticipated workload(s) and environment(s), and more specific customer validation is recommended to determine if fanhat use is warranted.
The MXM GPU that is installed in the HX525 system only supports an active DisplayPort signal and will not work with passive adapters or signal splitters. You will need to use an active adapter to convert the video signal. These use a chip to boot the conversion performance, which help to eliminate video issues. A video adapter without the additional chip circuitry is a passive adapter, which only work for some conversions and are not supported on the MXM GPU. Generally, DisplayPort adapters will need an active adapter to convert to VGA, DVI, or HDMI connections. Active adapters can be readily found online.
Here is a list of the operating systems that we have validated and will support on these systems:
Windows 11 Professional
Windows 11 IoT Enterprise 2024 LTSC
Windows 10 IoT Enterprise 2021 LTSC
Ubuntu 24.04 Desktop LTS64-bit
Ubuntu 24.04 Server LTS 64-bit
Ubuntu 22.04 Desktop LTS64-bit
Ubuntu 22.04 Server LTS 64-bit























































OUT_7
Yellow
60W
設備四周應留出足夠的空間,以確保設備正常散熱,且不超過其最高工作溫度限值。如果設備安裝在垂直表面,建議將設備朝向設定為使散熱片能夠讓空氣順暢上升。
小心,有觸電危險! 本設備僅由低電壓直流電 (DC) 供電!請勿將交流電 (AC) 接入本設備!
To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC (HX520 Series) or 12-48VDC (K520 Series), see specs for details.
僅使用屏蔽網路線安裝此設備。
安裝人員應具有售後安裝經驗並熟悉安裝電子設備的一般做法。
設備的維護和維修必須由合格的熟練維修人員進行。這包括但不限於更換 CMOS 電池。更換的 CMOS 電池必須經過 UL 認證,且符合原廠電池相同的最低要求。
CMOS 電池的正確處理必須符合當地的管理規定。
無線電設備不適用於緊急服務用途。
為防止過度射頻暴露,請與使用者和射頻天線保持至少 20 公分的距離。 Wifi/藍牙連線請僅使用提供的增益為 2dBi/2dBi(2.4、5GHz 和 6GHz)的雙頻 PIFA 天線。
本設備不適合在可能有兒童的地方使用。













This Helix 520 / Karbon 520 Series BIOS Manual covers OnLogic Custom Features and displays standard options and configurations in the BIOS. Additional content pertaining to other configurable elements may be added in subsequent versions of this manual.
To access the BIOS setup menu, hold the Delete key on the keyboard while turning the system on. After a few seconds, the BIOS front page menu will appear.
On each menu, the selected option is shown in white, other options are shown in blue, and read-only options are shown in gray. Some menus have multiple screens, which are shown at the top of the screen. The active screen has a gray background and inactive screens have blue backgrounds.
BIOS menus are navigated by pressing keys on the keyboard:
F1: Shows help on available keyboard shortcuts.
↑/↓: Select the option above or below the currently-selected option.
→/←: Activate the screen to the right or left of the currently-activated screen.
Enter: Activates the selected option. If the option is a menu, the menu is opened. If the selected option is a configurable option, a dialog box is opened to enter a new value.
F5/F6: Change the selected option to its previous or next value.
Esc: Returns to the previous menu.
F9: Restores all options to their factory default values.
F10: Saves all options and restarts the system.
Several options are available on the front page:
Continue: continues the boot process normally, booting the installed operating system
Boot Manager: opens a menu to select which device should be booted
Device Management: opens a menu which shows the status of the system hardware
The boot manager menu shows the devices available to be booted. The installed operating system and any attached USB drives will be listed. If enabled in the setup utility, the UEFI shell is also listed. Selecting an option boots it.
The setup utility shows the status of the system and allows many configuration options to be changed. These options affect the functionality, stability and security of the system, and should not be changed without an understanding of their meaning.
The setup utility has many screens. Press the →/← arrow keys to select between them.
Several configuration options are frequently used.
Default value: S0 State; possible values: S0 State, S5 State
Controls the state the system enters after G3 (power loss). If set to S5, the system remains off when initially connected to power. If set to S0, the system boots when connected to power.
Secure Boot verifies the digital signatures of boot software to ensure only trusted software loads during a computer's startup. A Supervisor password is required to change these settings.
Default value: Enabled; possible values: Enabled, Disabled
Enables or disables Wake-on-LAN functionality on the onboard network interfaces.
The main screen shows the BIOS version, information about the installed CPU, and the system date and language.
CPU Configuration
The "CPU Configuration" section provides a comprehensive set of options for managing the processor's features, performance, and security.
Chipset Configuration
This section contains settings related to the motherboard's chipset. A warning precedes these settings, indicating that incorrect values can lead to system malfunction.
System Agent (SA) Configuration
Advanced > System Agent (SA) Configuration -> Graphics Configuration
Primary Display:
When set to Auto, with iGFX enabled, and an external GPU card and monitor are connected, the BIOS will direct video output to the external card.
If no monitor is connected, the system will reboot and switch to the internal graphics.
PCH-IO Configuration
PCH-FW Configuration
This section pertains to the Serial ATA (SATA) interface, primarily used for connecting storage devices. The top-level entries for individual SATA ports (0-7) are informational placeholders.
RAID Mode Configurations (HX522/K522 Specific)
This section pertains to RAID Mode configuration in the BIOS.
On the front page of the BIOS navigate to "Device Management".
Enter "ASMedia 106x RAID Mode Setting #0"
Select the RAID Mode under "Controller #0: RAID mode Setting"
Set "Controller #0: RAID Mode Change for next Reset" to "Yes"
Press "F10" to save the change.
Return to the BIOS Front Page and Select "Continue"
Press Ctrl + Alt + Del to perform a cold reboot
USB Configuration
This section manages the system's Universal Serial Bus (USB) controllers and ports.
Advanced > SIO NCT6126D
UART Port Configuration
Power Enable: COM port power over enable.
Default mode: Disabled.
This section groups settings for the system's power consumption and performance.
OnLogic Feature Configuration
Pseudo G3: A power management state that mimics a full power-off (G3) while maintaining a low-power state for faster wake-up times.
M.2 Power Off in Soft-Off State: When enabled, the M.2 slot will power off during soft-off states, including hibernation and system shutdown, to save more power.
Retimer Compliance Mode: This is for Thunderbolt certification tests only when enabled.
Console redirection allows the input and output of a computer's console to be rerouted to another device or location, often for remote management or troubleshooting
Automotive Ignition
Advanced > Automotive Ignition (Only for Karbon 520)
For a brief overview of automotive ignition functionality, refer to the .
Automotive ignition settings are shown below. Note: These values are only examples.
Input Voltage (Unit: Volt): [12.0]
Ignition State:
Automotive Mode:
Description of Settings:
Input Voltage: Instant input voltage level reading.
Ignition State: Instant ignition state reading.
Automotive Mode: Enable or disable all automotive ignition features.
In-Band Error Correction Code (IBECC) is a specialized memory protection technology designed to enhance system reliability without requiring the additional physical memory chips traditionally associated with ECC (Error Correction Code). Unlike standard ECC, which utilizes dedicated "side-band" data lanes and extra DRAM chips to store parity bits, IBECC embeds the error-correcting data directly within the standard memory bandwidth. This allows for industrial-grade data integrity on hardware configurations. IBECC protects data against single-bit errors (Single-Bit Error Correction) and detects multi-bit errors (Double-Bit Error Detection) within the existing memory ranks. A small portion of the system’s total available RAM is reserved to store the ECC metadata. This results in a negligible reduction in total usable memory but significantly increases resilience against data corruption.
Enabling IBECC
To enable IBECC, enable Expert Mode and navigate to Advanced > Memory Configuration.
Set In-Band ECC Support to Enabled.
BIOS Secure Boot is a security feature that prevents malicious software from loading during your PC's startup. It verifies the digital signatures of boot components against a database of trusted keys. If a signature doesn't match, the system will not boot, protecting against pre-boot malware.
To enable Secure Boot:
Go to the Security page to set a Supervisor Password. Then save and exit.
Go to "Administer Secure Boot" on the front page to enable secure boot.
After enabling Secure Boot, the system will only boot to signed EFI boot files or Operating Systems.
If the BIOS detects a 5-second assertion of FAC_RST_R_N at power-on, it will:
Reset default UEFI settings to OnLogic factory defaults.
Clear any custom defaults.
Clear any UEFI passwords (Power On and Boot).
To perform a factory reset:
Hold the factory reset button while the system is powered off.
While holding the reset button, press the power button to power the system on.
After 5 seconds, release the factory reset button.
The screen will show "System will reboot to reset to default." and prompt the user to press “ok”. Note: The blank screen could take up to 3 minutes.
BIOS Secure Flash is a security measure that protects the BIOS from unauthorized modifications by requiring digitally signed BIOS updates. Only OnLogic-signed BIOS images can be updated to the system.
The exit screen provides options to leave the setup utility and to load and save settings.
Exit Saving Changes: saves the current configuration and restarts the system to apply it
Save Change Without Exit: saves the current configuration but does not restart the system
Exit Discarding Changes: returns to the front page without saving or applying the current configuration
Remote Power Control
Only one of the four onboard LAN ports supports vPro. Port 4, as shown below, must be used to connect to the host PC.
To enable Intel AMT using MEBX in the BIOS setup menu:
Navigate to the front page of the BIOS setup menu and select MEBX.
Set up a new password. First, enter the default password: admin, then enter a new password.
After setting a new password, Intel® AMT will be enabled.
To access Local AMT:
Open the system's Device Manager and check that the LAN device is enumerated correctly.
Open a browser and load the local WebUI: http://127.0.0.1:16992.
Enter the Intel® AMT login, input username (admin) and the password.
On another system on the same network, open a browser and open the WebUI as follows: https://[DUT IP address]:16993.
Ensure both systems are connected to the same network.
If a message indicating “Your connection is not private” appears, select proceed.
Go to BIOS setting > Setup Utility > Advanced > PCH-FW Configuration > AMT Configuration > MAC Pass Through .
Check that the MAC address of the Thunderbolt dock LAN port matches the VPro LAN port.
Intel vPro remote KVM is a hardware-level remote management feature that allows an IT administrator to take full control of a computer's keyboard, video, and mouse (KVM) as if they were physically sitting in front of it.
Requirements:
Intel vPRO Enterprise SKU CPU.
Software Required: MeshCommander / Intel Endpoint Management Assistant (EMA) / Third-Party IT Management Solutions.
An example of execution using MeshCommander is shown below.
Add a computer with the hostname and select “Digest / TLS” in the Auth / Security field.
Click Connect to connect to the host computer.
Go to “Remote Desktop” to connect and enter the Consent code that is displayed on the host computer.
The OnLogic Helix series integrates Intel® 10th generation Comet Lake processors, offering flexible installation, reliable solid-state performance, and unique expandability for various innovations. Helix systems utilize desktop processing within a compact form factor, previously limited to lower-wattage mobile CPUs. With OnLogic's Hardshell™ Fanless Technology, you can benefit from enhanced performance and thermal management of Intel 10th gen processing, alongside triple independent display support, an extended operating temperature range, and a wide input power range.
4x Rubber Feet
Additional items such as mounting brackets, power supplies, or terminal block connectors, if purchased, will be found in the system box or outer shipping carton. For more details on accessories and features, visit the Helix series page.
Administer Secure Boot: opens a menu which manages the Secure Boot configuration of the system
Setup Utility: opens the BIOS setup utility
MEBx: opens the Intel AMT configuration utility
N/A
Advanced-> CPU Configuration
Performance Core
Read Only
Displays L1 Data Cache, L1 Instruction Cache, L2 Cache, and L3 Cache sizes.
N/A
N/A
Advanced-> CPU Configuration
ID, Brand String, VMX, SMX/TXT, TXT Crash Code, TXT SPAD, Boot Guard Status, Boot Guard ACM Policy Status, Boot Guard SACM Information
Read Only
Informational displays providing various identification details, technology statuses, and security-related information about the CPU.
N/A
N/A
Advanced-> CPU Configuration
CPU Flex Ratio Override
Option List
Enables or disables the ability to manually override the CPU's flexible ratio (multiplier). Used for overclocking or underclocking.
"Disabled, Enabled"
Disabled
Advanced-> CPU Configuration
CPU Flex Ratio Settings
Numeric Input
When 'CPU Flex Ratio Override' is enabled, allows setting the specific CPU ratio (multiplier).
"Minimum: 0, Maximum: 63, Step: 0"
Default: 20
Advanced-> CPU Configuration
Intel (VMX) Virtualization Technology
Option List
Enables or disables Intel Virtualization Technology (VT-x), required for running virtual machines.
"Disabled, Enabled"
Enabled
Advanced-> CPU Configuration
AVX
Option List
Enables or disables the Intel Advanced Vector Extensions (AVX) instruction set.
"Disabled, Enabled"
Enabled
Advanced-> CPU Configuration
Active Performance-cores
Option List
Allows users to select the number of active Performance-cores (P-cores).
"Various (e.g., All, 1, 2,..., 31)"
All
Advanced-> CPU Configuration
Active Efficient-cores
Option List
Allows users to select the number of active Efficient-cores.
"Various (e.g., All, 1, 2,..., 31)"
All
Advanced-> CPU Configuration
Active SOC-North Efficient-cores
Option List
Allows users to select the number of active SOC-North Efficient-cores.
"Various (e.g., All, 1, 2,..., 31)"
All
Advanced-> CPU Configuration
Hyper-Threading
Option List
Enables or disables Intel Hyper-Threading Technology.
"Disabled, Enabled"
Enabled
Advanced-> CPU Configuration
BIST
Option List
Enables or disables the Built-In Self-Test (BIST) for the CPU.
"Disabled, Enabled"
Disabled
Advanced-> CPU Configuration
AP threads Idle Manner
Option List
Configures how Application Processor (AP) threads behave when idle.
"HALT Loop, MWAIT Loop (Default), RUN Loop"
MWAIT Loop
Advanced-> CPU Configuration
AES
Option List
Enables or disables Intel Advanced Encryption Standard (AES) New Instructions.
"Disabled, Enabled"
Enabled
Advanced-> CPU Configuration
MachineCheck
Option List
Enables or disables the Machine Check Architecture (MCA) feature.
"Disabled, Enabled"
Enabled
Advanced-> CPU Configuration
MonitorMWait
Option List
Enables or disables the MONITOR/MWAIT instructions for managing CPU idle states.
"Disabled, Enabled"
Enabled
Advanced-> CPU Configuration
Total Memory Encryption
Option List
Enables or disables Total Memory Encryption (TME).
"Disabled, Enabled"
Disabled
Advanced-> CPU Configuration
X2APIC Enable
Option List
Enables or disables X2APIC mode for handling interrupts in systems with many logical processors.
"Disabled, Enabled"
Enabled
Enabled
N/A
Enabled
Advanced-> USB Configuration
USB Legacy SMI bit Clean
Options List
A low-level setting related to legacy USB behavior. Controls a System Management Interrupt (SMI) bit.
"Disabled, Enabled"
Disabled
Disabled
Default mode: 5V.
Fan Control
Fan Hat Control: Default mode is Thermal Cruise.
PCIe Riser Fan Control: Default mode is Thermal Cruise.
Hardware Monitor
Temperature:
Rear_Temp: Power Input Entrance area temperature.
Riser_Temp: Riser card temperature.
Front_Temp: Remote Power Button Area temperature.
Voltage:
VINPUT: Input voltage.
VCELL: RTC battery voltage.
Fan Speed:
Fan_HAT_FAN_RPM
PCIe_Riser_Fan_RPM
Watch-Dog Timer
The OS built-in driver refreshes the Watch-Dog Timer periodically. If the system hangs, the driver stops refreshing the WDT. The expiration of the timer will trigger a hardware reset to reboot the system.
The WDT length range is 1 to 255 minutes.
Always Off: Turn off WDT function.
Always On: Turn on WDT function.
Timeout value in sec / min
Suspended at BIOS Setup: Turn on WDT except in the BIOS setup menu.
Enabled
Advanced-> Power & Performance
Intel Speed Shift Technology Interrupt
Option List
Enables or disables interrupt control for Intel Speed Shift Technology, which dynamically adjusts CPU frequency and voltage.
"Disabled, Enabled"
Enabled
Intrusion Detect (requires a DIO expansion card): If enabled, the following actions can be taken when intrusion is detected:
Perform Power Cycle - Forced power-off and on
Power Button Emulation - Mimics a power button press
No Action
SATA/SSD S.M.A.R.T. Monitoring and Display: If enabled, it monitors the health of HDDs/SSDs for predictive failures, displaying a warning during startup if any critical S.M.A.R.T. attribute indicates a problem.
Startup Timer (Unit: Sec): [10]
Soft Off Timer (Unit: Sec): [10]
Hard Off Timer (Unit: Sec): [30]
Low Voltage Timer (Unit: Sec): [300]
Shutdown Voltage Integer (Unit: Volt): [10]
Shutdown Voltage Decimal (Unit: 0.1 Volt): [5]
Startup Timer: The number of seconds the ignition input must be stable before the system powers on, or input voltage must recover from low-voltage shutdown before powering on.
Soft Off Timer: The number of seconds until a virtual power button shutdown event is triggered.
Hard Off timer: The number of seconds until the system is forced to power down, beginning only after the soft-off or low-voltage timer expires.
Low Voltage Timer: The number of seconds the input voltage can be lower than the shutdown threshold before a virtual power button shutdown event.
Shutdown Voltage Integer: Integer part of the low-voltage shutdown threshold. The minimum recommended value is 10.5 V.
Shutdown Voltage Decimal: Decimal part of the low-voltage shutdown threshold.
Disabled
1.1
Advanced-> Security
TPM Availability
Option List
When Hidden, doesn’t expose the TPM to the OS.
"Available, Hidden"
Available
Advanced-> Security
TPM Operation
Option List
TPM2 State Operation Options.
"No Operation (default), Enable, SetPCRBanks (Algorithm), LogAllDigests, SetPPRequiredForClear_True, SetPPRequiredForClear_False, SetPPRequiredForTurnOn_False, SetPPRequiredForTurnOn_True, SetPPRequiredForTurnOff_False, SetPPRequiredForTurnOff_True, SetPPRequiredForChangePCRs_False, SetPPRequiredForChangePCRs_True, SetPPRequiredForChangeEPS_False, SetPPRequiredForChangeEPS_True"
No Operation
Advanced-> Security
Clear TPM
Option List
Remove all TPM context associated with a specific owner.
"[ ], [ X ]"
"[ ]"
Advanced-> Security
Set Supervisor Password
Alphanumeric Entry
Entry for supervisor password to lock specific settings.
"[ ], [ X ]"
"[ ]"
Enabled
Advanced-> Power
Auto Wake on S5
Option List
Auto wake on S5, by day of the month or fixed time of every day.
"Disabled, By Every Day, By Day of Month"
Disabled
Advanced-> Power
S5 Long Run Test
Option List
Forces to enable RTC S5 wake up, even if the OS disables it.
"Disabled, Enabled"
Disabled
Enabled
Advanced-> Boot
Quiet Boot
Option List
Disables or enables booting in Text Mode.
"Disabled, Enabled"
Enabled
Advanced-> Boot
Network Stack
Option List
Enables or Disables the onboard NICs before UEFI handoff.
"Disabled, Enabled"
Enabled
Advanced-> Boot
PXE Boot Capability
Option List
Sets the PXE Boot mode. Note: This setting is unavailable unless Network Stack is Enabled.
"Disabled, UEFI: IPv4, UEFI: IPv6, UEFI: IPv4/IPv6"
Disabled
Advanced-> Boot
Power Up In Standby Support
Option List
Enables or Disables Native Active State Power Management (ASPM).
"Enabled, Disabled"
Disabled
Advanced-> Boot
Storage PCI Option ROM Access Right support
Option List
Disable or enable storage PCI option ROM Access Right.
"Enabled, Disabled"
Enabled
Advanced-> Boot
ESATA Drive Boot Access Right Support
Option List
Disable or enable ESATA drive boot Access Right.
"Enabled, Disabled"
Enabled
Advanced-> Boot
Add Boot Options
Option List
Determines how new boot options are added into boot order.
"First, Last, Auto"
Auto
Advanced-> Boot
ACPI Selection
Option List
Selects booting to ACPI Version.
"ACPI3.0, ACPI4.0, ACPI5.0 ACPI6.0, ACPI6.1, ACPI6.2, ACPI6.3, ACPI6.4, ACPI6.5"
ACPI 6.3
Advanced-> Boot
USB Boot
Option List
Disables or enables booting to USB Boot Devices.
"Enabled, Disabled"
Enabled
Advanced-> Boot
UEFI OS Fast Boot
Numeric Entry
Enables or Disables Fast Boot mode. When enabled, the BIOS will not initialize the keyboard.
"Enabled, Disabled"
Disabled
Advanced-> Boot
Timeout
Option List
The number of seconds the firmware will wait before booting the default selection.
0~10
3
Advanced-> Boot
Automatic Failover
Option List
If enabled, failure of the boot device will result in an attempt to boot from the next device in boot order.
"Enabled, Disabled"
Enabled
Advanced-> Boot
Group Boot Options
Option List
Enables or disabled the grouping of boot options.
"Grouped, Non-Grouped"
Grouped
Advanced-> Boot
Sync Order
Option List
Disables or sets to Sync Boot Order or Sync Boot Device Type Order.
"Disabled, Sync Boot Order, Sync Boot Device Type Order"
Disabled
Advanced-> Boot
Adjust Non-BIOS Boot Options
Option List
When enabled, the position of Non-BIOS created boot options will be adjusted to follow the boot options position policy.
"Disabled, Enabled"
Enabled
Advanced-> Boot
Group Auto Boot Order
Option List
When enabled, keeps the boot option order of each group in “Auto” position policy.
"Disabled, Enabled"
Disabled
Advanced-> Boot
Device Type in Boot Manager
Option List
When enabled, shows the boot device type label in the boot manager.
"Disabled, Enabled"
Enabled
Advanced-> Boot
Boot Device Type Order
Option List
Allows changing the boot device type order.
"Hard Disk Drive [X]", "CD/DVD-ROM Drive [X]", "USB [X]", "Network [X]", "Others [X]"
Shown as above
Advanced-> Boot
Hard Disk Drive
Option List
Allows changing the Hard Drive Boot Order.
"[Hard Disk Drive] [X]"
"[X]"
Advanced-> Boot
Others
Option List
Allows changing Other Device Boot Order.
"EFI Internal Shell [X]"
"EFI Internal
Shell [X]"
The system will reboot and reset to default.
Load Custom Defaults: loads a previously saved custom configuration
Save Custom Defaults: saves the current configuration so it can be loaded later
Discard Changes: restores the current configuration to its original state
Press F10 to Save and Exit, then navigate to Setup Utility > Advanced > PCH-FW Configuration to check the ME Firmware Version to confirm the ME is installed.
The system status will be displayed in the local WebUI.
admin and for the password enter the password configured in the BIOS MEBX tab, then select Sign in.A WebUI will appear. Ensure the IP address shown is the same as the DUT IP address (VPRO system).
Select Remote Control to control the Power Off, Cycle power off and on, Reset, and Graceful shutdown of the DUT system.
Advanced-> CPU Configuration
Efficient-core Information
Read Only
Displays L1 Data Cache, L1 Instruction Cache, L2 Cache, and L3 Cache sizes.
Advanced-> Chipset Configuration
Platform Trust Technology
Options List
Enables or disables Intel Platform Trust Technology (PTT), a firmware-based implementation of a Trusted Platform Module (TPM).
Advanced-> System Agent (SA) Configuration
Graphics Configuration, TCSS Setup Menu, VMD Setup Menu, VT-d Setup Menu, GNA Device, CRID Support, IPU Device, NPU Device
Various Options
Refer to Section 5.5 - Advanced > System Agent (SA) Configuration -> Graphics Configuration
Advanced->PCH-IO Configuration
SATA Configuration, USB Configuration, Security Configuration, HD Audio Configuration, THC Configuration, SerialIO Configuration, ISH configuration, Thermal Throttling Control, PMC Configuration
Various Options
SATA Configuration: Configures SATA ports for storage devices. USB Configuration: Manages the behavior of USB controllers and ports.
Advanced->PCH-FW Configuration
ME Firmware Version, ME Firmware Mode, ME Firmware SKu, ME Firmware Status 1-6, ME State, Manageability Features States, AMT BIOS Features, AMT Configuration, ME Unconfig on RTC Clear, Core BIOS Done Message, CSE Data Resilience Support, FDO Shipment State Override, Firmware Update Configuration, FIPS Configuration, Unique Platform ID Configuration, ME Debug Configuration, Anti-Rollback SVn Configuration, OEM Key Revocation Configuration, Extend CSME Measurement to TPM-PCR
Various Options
PCH-FW configuration: Configure Management Engine Technology Parameters. Console redirection configuration: Configures the redirection of console output to a serial port. Refer to Section 5.3.
Advanced-> SATA Configuration
Serial ATA Port 0-7
Read-Only
These entries represent the physical SATA ports available. They are informational and not directly configurable at this level.
Advanced -> USB Configuration
USB BIOS Support
Options List
Enables or disables fundamental USB support within the BIOS, allowing USB keyboards and mice to function before the OS loads.
Advanced-> PCIe Configuration
Port8xh Decode, Compliance Test Mode, PCIE Clock, SOC Configuration, PCI Express Root Port PXPA1, PCI Express Root Port PXPA2, PCI Express Root Port PXPA3, PCI Express Root Port PXPA4, PCI Express Root Port PXPB1, PCI Express Root Port PXPB2, PCI Express Root Port PXPB3, PCI Express Root Port PXPB4, PCI Express Root Port PXPC, IOE Configuration, PCI Express Root Port PXPD, PCI Express Root Port PXPE, PCI Express Root Port PXPF
Various Options
PCIe Root Port settings
Advanced-> Console Redirection Configuration
Console Serial Redirect
Option List
Console Redirection Settings.
Advanced->SIO NCT6126D
UART Port 1 Configuration, UART Port 2 Configuration, UART Port 3 Configuration, UART Port 4 Configuration, Fan Control, Hardware Monitor, Watchdog Timer
Various Options
Contains settings specific to the Super I/O (SIO) controller, often responsible for managing legacy ports and hardware monitoring. Refer to Section 5.4 - Advanced > NCt6162D
Advanced-> Power & Performance
Overclocking Lock
Option List
Locks or unlocks the CPU's overclocking features to prevent accidental changes.
Advanced->OnLogic Feature Configuration
Pseudo G3, Retimer Compliance Mode, LAN Controller 1 & 2, LAN Controller 3 & 4, Intrusion Detection
Various Options
Refer to Section 5.2 - Advanced > OnLogic Feature Configuration
Advanced->Automotive Ignition
Automotive Ignition
Various Options
Refer to Section 5.2 - Advanced > Automotive Ignition (Only for Karbon 520)
IGNITION PIN
12V ~ 48V (constant DC)
OPEN
Advanced-> Expert Mode
Expert Mode
Option List
Enables or disables the display of advanced BIOS configuration options. Enabling it exposes additional, technical parameters.
Advanced-> Security
TrEE Protocol Version
Option List
Trusted Execution Environment EFI Protocol version.
Advanced-> Power
Wake On PME
Option List
Determines the action taken when the system power is off and a PCI Power Management Enable wake up event occurs.
Advanced-> Boot
Quick Boot
Option List
Allows InsydeH2O to skip certain tests while booting, decreasing boot time.












N/A
"Enabled, Disabled"
N/A
N/A
"Disabled, Enabled"
"Disabled, Enabled"
"Disabled, Enabled"
"1.1, 1.0"
"Disabled, Enabled"
"Disabled, Enabled"
System Dimensions
8.26" x 2" x 6.06"
210 x 50.8 x 154 mm
8.26" x 2.55" x 11.9"
210 x 64.8 x 303mm
Board Dimensions
8" x 5.5"
8" x 5.5"
Note: The HX500 is pictured, the HX600 has the same I/O configuration. The location of the DIO option is different for the HX600.
Note: The rear I/O of the HX500 is shown below. The HX600 has the same connector orientations and locations on the motherboard. The location of the Terminal block power option is different for the HX600.
Power button / Power LED
The front power button can be used to turn the Helix system on and off. It is a momentary contact button with a blue LED backlight that indicates the system's status. A single press while the system is on will initiate a graceful shutdown from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset. The system can be woken from any state by a single press of the power button. A solid blue light on the LED backlight indicates the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.
SIM card
A 3FF Subscriber Identity Module (SIM) card slot is located on the front panel of the Helix platform, providing native support for OnLogic Cellular modules. The SIM signals can be connected to either the mPCIe or M.2 B-Key internal expansion slots, with the default BIOS setting being mPCIe. Refer to the BIOS user manual for more information. The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card, use a small implement to push the card into the slot until it clicks. To remove the card, push it with a small implement until it clicks, then pull the free end of the card to remove it.
COM DB9 option
The serial port mode and voltage between Off/5V on Pin 9 on Helix can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS manual in Appendix C for configuration instructions.
Audio
Audio input and output are provided via a 3.5mm CTIA audio jack on the front panel of the Helix platform. The audio codec used is a Realtek ALC233. Proper drivers must be installed for both the Q470 chipset and Realtek ALC233 codec. These downloads can be found within section 4 of this documentation page.
USB 3.2
There are four USB 3.2 Gen 2 ports on the front panel of the Helix platform, capable of 10Gb/s transfer rates.
4-Pin DIN power connector
Mainboard power is applied to the Helix platform via a locking 4-pin female DIN connector (Mating part: Kycon # KPPX-4P or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications.
The maximum rated current of the connector is 7A per pin. Use a wire gauge rated for the operational current. See below for the on-board connector pinout.
DisplayPort 1, 2, & 3
Helix utilizes Intel’s Integrated processor graphics, powering the onboard DisplayPorts. This supports resolutions up to 4096x2304 @ 60Hz simultaneously on all three outputs. All ports support Multi-Stream Transport (MST).
An optional CEC module can be included to add CEC (Consumer Electronics Control) functionality on DisplayPort 1 & 2. This feature is not supported on the DisplayPort 3 connector.
LAN1 - Intel I219-LM
The Intel I219 LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is an industry-standard RJ45. This port also features Intel’s vPro(R) technology, enabling remote out-of-band management and security features (requires Intel Core i5 or higher). The LAN link state is indicated by the two LEDs enclosed in the port, as described below.
LAN2 - Intel I210-IT
The second LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is an industry-standard RJ45. The LAN link state is indicated by the two LEDs enclosed in the port, as described below.
USB 3.2
The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2 ports, capable of 10Gb/s transfer rates. The two USB ports above the RJ45 LAN connectors are USB 3.2 Gen 1 ports, capable of 5 Gb/s.
Terminal block power option
If the terminal block power option is selected, mainboard power is applied to the Helix platform through a 4-pin terminal block connector (Mating part: Dinkle #2ESDAM-04P or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications. The maximum rated current of the connector is 15A per pin. Use a wire gauge rated for the operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal block with tinned wire ends or solid core wire. See below for connector pinout. When using the remote switch connections with the terminal block option, mating power switch cables should be twisted-pair wire with a floating shield to ensure proper immunity to EMI/RFI. It is recommended to keep wires less than 3 meters in length. Switches should be momentary contact type only.
The motherboard is the same for HX500 and HX600.
An M.2 B-Key port is present on the Helix motherboard to support B-Key form-factor expansion cards. Supported form-factors include 3042, 2242, 2260, and 2280. The B-Key connector supports PCIe Gen 3 x2, USB 3.2 5Gb/s, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices. The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slots. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Refer to the BIOS user manual for more information. The M.2 B-Key slot can be used in tandem with the M.2 M-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs; NVMe RAID is not supported by the chipset. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Refer to the BIOS user manual for information on using Rapid Storage Technology. A full pinout table for this expansion slot is provided in The Expansion port pintout.
An M.2 E-Key port is present on the Helix motherboard to support E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector on the Helix platform supports PCIe Gen 3 x1, USB 2.0, and Intel CNVi devices. A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3).
An M.2 M-Key port is present on the Helix motherboard to support M-Key form-factor expansion cards. Only 2280 form-factor cards are supported. The M-Key connector on the Helix platform includes support for PCIe Gen 3 x4, PCIe Gen 3 x2, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices. The M.2 M-Key slot can be used in tandem with the M.2 B-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs; NVMe RAID is not supported by the chipset. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Refer to the BIOS user manual for information on using Rapid Storage Technology. A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3).
An mPCIe port is present on the Helix motherboard to support mini-PCIe form-factor expansion cards. Full-length cards and half-length cards (with adapter) are supported. The mPCIe connector on the Helix platform supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is provided in A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3). The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slots. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Refer to the BIOS user manual (Appendix C) for more information.
The Helix platform has two onboard DDR4 SO-DIMM Slots. Specifications are as follows:
Maximum Capacity: DDR4-2666 64GB with two 32GB SO-DIMM Modules
Channel configuration: 1DIMM Per Channel (DPC) - 2 Channels
No ECC Support
The two on-board COM headers utilize standard 9-pin 2.00mm pitch male pin headers with the pin configuration provided in the table below. These serial ports support RS-232, RS-422 Full-Duplex, and RS-485 half-Duplex configurations. The serial port communication mode can be selected in the BIOS configuration. Additionally, 5V power can be enabled on pin 9 in the same BIOS menu, rated to provide 250mA of current. Refer to the BIOS manual for configuration instructions.
For BIOS update instructions, refer to the BIOS Manual in section 4 for reflashing instructions.
The on-board power switch header can control the power state of the Helix platform in parallel with the front panel power button. Mating power switch cables should be twisted-pair wire with a floating shield to ensure proper immunity to EMI/RFI. The mating connector is a standard 2.54mm female header. It is recommended to keep wires less than 3 meters in length. Switches must be momentary contact type only.
A 2mm pin header and jumpers are used to clear the CMOS settings and select the hardware auto power-on behavior of the Helix platform. ATX mode can be selected by moving the pin jumper to connect pins 3 and 5. In ATX mode, the system power-on is controlled by the system power button or other supported wake events. When the pin jumper connects pins 1 and 3, the system operates in AT mode, powering on when system power is first applied. The default selection is ATX mode. The system CMOS settings can be cleared with the second pin jumper by following these steps:
Disconnect system power.
Place jumper in the “clear” position.
Wait 10 seconds.
Remove jumper from the “clear” position and return to default position.
The RTC battery on the Helix platform retains BIOS CMOS settings and maintains the system's real-time clock. If the RTC battery is low, CMOS settings will not be retained, and an alert may be received in the operating system. The cabled RTC battery should be replaced with a Maxell CR2032-WK11 (or UL listed equivalent). An equivalent battery must use a Hirose DF13-2S-1.25c connector to mate with the on-board connector.
Helix features an onboard TPM (Trusted Platform Module) header. Helix supports OnLogic’s module (OnLogic part TPM01) featuring TPM 2.0. This provides the option for a dedicated secure module to secure Helix through cryptographic keys.
The two on-board SATA Data connectors utilize the standard 7-pin SATA Data latching connector with the standard pin configuration. These connectors support SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps). Additionally, they support firmware-level RAID arrays using Intel Rapid Storage Technology. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Characteristics of the SATA ports, such as RAID arrays, can be configured in the BIOS; refer to the BIOS manual for further details.
The on-board SATA Power connector provides 5V and 12V power to multiple SATA devices with the pin configuration shown in the table below. It uses a 4-pin 2.50mm pitch male pin connector with an opening for a small retention tab. The connector is rated to 2A per contact. Any mating connector with the correct form factor, such as TE Connectivity part number 171822-4, can be used to connect a cable to the header. The connector can only be used to power internal devices.
The on-board fan header can power and control any three or four-wire fan (including variable-speed PWM fans) using the standard pin configuration shown in the table below. Three-wire fans will only connect to pins 1-3. This header utilizes a standard 4-pin 2.54mm pitch fan connector with a small retention tab. Any mating connector with the standard form factor, such as Molex part number 0470541000, can be used to connect a fan. Most CPU and case fans utilize this connector and pinout. The 12V pin on this connector can provide up to 1A of current.
The on-board USB 2.0 header provides a pair of USB 2.0 signals. It utilizes a standard 9-pin 2.54mm pitch male pin connector with the pin configuration shown in the table below. The 5V power pins (1 & 2) can provide up to 1A of current.
HDMI-CEC (Consumer Electronics Control) is a communication protocol that supports the control of displays over an HDMI interface. The Helix platform supports CEC via the optional add-on module ADP107. For a full description of supported features, refer to the ADP107 product manual here:
Mainboard power can be applied to the Helix platform via the locking 4-pin Molex Micro-Fit connector (Mating part: Molex # 0430250400 or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications. The maximum rated current of the connector is 8A per pin. Use a wire gauge rated for the operational current. See below for connector pinout.
The LGA1200 CPU socket on the Helix platform supports all 10th Gen Intel S-series processors up to 35W TDP.
The Helix platform features a standard PCI Express x16 slot on the bottom side that supports PCIe Gen 1 (2.5 GT/s), Gen 2 (5 GT/s), and Gen 3 (8 GT/s). Any PCIe x1, x4, x8, or x16 card using PCIe Gen 1 through Gen 3 will function in this slot. In the HX600, a riser card is included to add a PCIe expansion card to the expanded chassis.
Reference the full BIOS Manual here.
Intel® 10th Gen Comet Lake Core 35W Celeron/i3/i5/i7/i9
The power consumption of the H500 and H600 systems was measured for various system configurations, workloads, and power states at both 12V and 24V system input voltages. Tests were performed using Burnintest v9.0 build 1012 to stress system components with and without graphics enabled. These tests were performed with Intel Turbo Boost disabled; enabling Turbo will draw additional power. The build configurations and power consumption are listed in the tables below. (Note: system configurations using discrete GPUs are limited to 19V-24V input. Only 24V is tested for Configuration 3).
*The configurations below are using representative samples of internal devices; the specific components mentioned below may vary from the devices provided by OnLogic.
The power consumption for each system configuration is recorded below:
Config 1 Low Power Consumption
Config 2 Mid Power Consumption
Config 3 High Power Consumption
These specified DC levels are the absolute maximum values for the pins for system function and safety. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.
The base HX500 system can operate with an input voltage ranging from 8V - 24V DC; however, different configurations will impact total system draw and may limit input voltage flexibility in the final application. The minimum system voltage will be limited by total system power draw and the 14A current limit of the power connectors on the motherboard. The total system power draw should be divided by the input voltage to remain within the power connector's current limit and checked against supply capability. HX600 systems with GPU configurations should use no less than 19V at the input, with 24V recommended. Please contact OnLogic for assistance calculating the total max power draw of your desired configuration. Most HX500 systems operating at 8V with turbo enabled will exceed the input current limit. Systems with Intel Turbo Boost enabled can draw up to 70W at the CPU with stock settings. Additional internal system peripherals and USB loads may cause system instability due to protection mechanisms. Systems requiring an input voltage under 12V will achieve best stability by disabling CPU turbo, or by limiting peak CPU turbo draw under 50W with a custom BIOS. Please contact OnLogic sales for additional information on custom BIOS configurations.
The Helix platform supports multiple power states. Wake-up events can be configured in the BIOS. This section describes the supported power management functions and provides information on protection circuitry for power adapters.
The auto power on feature will turn the Helix system back on after a power loss. This can be useful for automatic recovery after a power outage, or applications where the system’s power button is not easily accessible.
Power on the Helix unit and immediately press Del to access the Front Page config menu
Using the arrow keys, navigate down to “Setup Utility” and press enter
From the “Advanced” tab, select “PCH-IO Configuration”
Change “Auto Power-On” to “Enabled”
Press F10 to save and exit
Press Enter to confirm
Auto power on is now enabled
DIO option
The Helix platform supports an optional Isolated Digital I/O add-in card (OnLogic ADP120). This option enables integration of the Helix platform with existing PLC integrations or other digital logic applications. For a complete explanation of features, operating voltages, and safety information, refer to the DIO expansion information here:
The thermal performance of the Helix platform was validated by fully loading system components while the test system was exposed to high ambient temperatures in a thermal chamber environment. CPU and GPU clock speeds were measured for the duration of the test. Results were analyzed by comparing the average clock speed over the test duration to the rated base clock speed. A passing result was defined by an average clock speed no less than 10% of the rated base clock. No CPU or GPU throttling was observed during testing of both the HX500 and HX600 at the maximum rated temperature, with some configurations running above the base clock frequency.
The image below shows the thermal test results from an HX500 in a thermal chamber with an I9 10900T (10C @1.90GHz) processor installed over 10 hours at a 100% workload.
The table below shows the key takeaway values from the above test.
The image below shows the thermal test results from an HX600 in a thermal chamber over 4 hours. During the last hour of the test, after the system saturates at the required temperature, FurMark is started, running the GPU at 100% workload to find the system's limits.
The table below shows the key takeaway values from the above test.
Step 1: Attach wall mounting brackets to the chassis using the supplied screws. Specifications are as follows:
Screw type: M3X0.5 FH 120 Degree Screw
Length: 4 mm
Step 2: Locate the 4 holes that line up accordingly to the bracket as shown below.
Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.
Step 4 (for DIN Bracket): Using the outer 2 holes of the 3-hole set on the wall mount bracket, line up the DIN bracket.
Step 5 (for DIN Bracket): Using the supplied screws and a Phillips head screwdriver, mount the DIN bracket to the bracket.
Step 6 (for DIN Bracket): Mount system onto the DIN rail.
Step 1: Attach the VESA mounting plate to the chassis using:
Screw type: M3X0.5 FH 120 Degree Screw
Length: 4 mm
Step 2: Locate the 4 holes that line up accordingly to the bracket as shown.
Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.
Properly opening OnLogic systems does not void the warranty in most cases, however, some precautions are necessary to avoid damaging the system.
Perform this disassembly in an area free of static discharge and with the system fully unplugged.
Ideally, wear a grounding strap. If that is not available, regularly touch a grounded metal surface to discharge your body of static electricity.
Begin by removing the 4x Phillips P2 screws circled in red.
Next, use a small tool or your fingernail to pry the bottom place loose. It should come loose with minimal force.
The bottom plate will fall away from the system and is completely disconnected.
Set the plate aside. The disassembly process is complete.
You now have access to the internals.
This picture shows an example configuration.
Ram, WiFi, Primary Storage, Additional Storage
Begin by removing the 5x Phillips P2 screws circled in red.
Next, use a small tool or your fingernail to pry the bottom place loose. It should come loose with minimal force.
The bottom plate will fall away from the system and is completely disconnected.
Set the plate aside. The disassembly process is complete.
You now have access to the internals.
This picture shows an example configuration.
Ram, WiFi, Primary Storage, Additional Storage, PCI-E Expansion
Begin by removing the two Phillips P1 retaining screws from the card bracket. Set the bracket aside.
Determine the number of slots your PCI-E card takes up.
For a single slot card, punch out the top cover. For a dual slot card, punch out both.
Use pliers to bend the knockout a few times and it will fall off.
Set PCI-E Card in the case and slide it into the slot.
Reinstall the bracket removed in the first step. It will hold the card in place.
If needed, push the card into position before fully tightening the screws.
The card should appear level in the slot. If it is crooked, loosen the retaining screw and reposition it.
The installation is complete.
For a detailed overview of the BIOS screens and individual settings, refer to the BIOS Manual:
Z01-0002A052
Remove secure flash feature
Z01-0002A042
Add - "Enroll Key Only" for "Secure Boot" options.
Update the BIOS with the file(s) above. You can follow this How-to guide for installation instructions.
Drivers
Drivers are available in INF formats, which can be installed via a Windows deployment server, or through the Device Manager.
Windows 10
07/16/2020
Windows 11
07/16/2020
The Helix platform complies with the EN 55032:2015 standards for radiated and conducted emissions limits. The unit is compliant with EN 55035:2016 and tailored by EN 60601-1-2 for ESD, radiated immunity, magnetic immunity, electrical fast transient (EFT) AC power line, dips/interrupts and EFT signal line immunity based on performance criteria in Tables 4, 5, 6, 7, 8, and 9.
ESD immunity tests were performed following EN 55035 in accordance with EN 61000-4-2 and EN 60601-1-2 in accordance with EN 61000-4-2. The unit does not exhibit susceptibility to 4-kV and 6-kV contact/8-kV air and 8kV contact/15kV air discharges applied singly or repetitively and directly or indirectly. The relative humidity during unit testing was measured to be between 30% and 60%. The Helix platform was unaffected during testing.
Radiated immunity tests were performed following EN 55035 in accordance with EN 61000-4-3 and EN 60601-1-2 in accordance with EN 61000-4-3. The system does not exhibit susceptibility to 10 V/m radiated electric fields, amplitude modulated at 1000 Hz, 80%, from 80 MHz to 6 GHz. Frequencies listed are samples and spots. The Helix platform was unaffected during testing. The system does not exhibit susceptibility to radiated electric fields, in accordance with EN 61000-4-3 Table 9. The Helix platform was unaffected during testing.
Magnetic immunity tests were performed following EN 60601-1-2 in accordance with EN 61000-4-8. The system does not exhibit susceptibility to radiated magnetic fields of 30 A/m at 50/60Hz. The Helix platform was unaffected during testing.
Electrical fast transient immunity tests were performed following EN 55035 in accordance with EN 61000-4-4 and EN 60601-1-2 in accordance with EN 61000-4-4. The system does not exhibit susceptibility to 1-kV/2-kV electrical fast transients, delivered in 5-kHz bursts to power lines. “A” result = No effect on EUT. The system does not exhibit susceptibility to 0.5-kV/1-kV electrical fast transients, delivered in 5-kHz bursts to signal lines. The Helix platform was unaffected during testing.
Dips/interrupts immunity tests were performed following EN 55035 and EN 60601-1-2 in accordance with EN 61000-4-11. The system does not exhibit susceptibility. The Helix platform was unaffected during testing.
For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories: https://www.onlogic.com/security/advisories/
JP-1: Failure to Boot Without RTC Battery
Overview
SKU(s) Affected
HX500, HX600, HX610
Revision(s) Affected
F01-00003R(1-4)
Revision Resolved
F01-x0003R(5-current)
Description
The EXM501 does not initiate the power-up sequence if an RTC battery is not installed or the battery voltage is low (dead). Battery discharge primarily occurs in systems that are not connected to power. Expected battery lifetime in completely unpowered systems exceeds 3 years. Time spent in service while connected to external power does not count against the battery's expected lifetime, thus extending the time-to-failure. Customers with common use cases where power is applied at all (or nearly all) times should not expect to encounter this issue during the system's lifetime.
Workaround
None. If the system fails to boot, a user may confirm that battery voltage exceeds 2.7V and replace if needed.
Resolution
Power sequence timings were adjusted in revision F01-x0003R(5-current) to enable startup without a battery.
JP-2: Digital and Chassis Ground Not Isolated
Overview
SKU(s) Affected
HX500, HX600, HX610
Revision(s) Affected
B01-00003R(5-7)
Revision Resolved
B01-00003R8
Description
Beginning in PCB rev B01-00003R5, the SIM slot connects the digital and chassis ground planes, removing isolation between the two. Under normal operating conditions, the motherboard's function should not be affected. Customers who rely on chassis ground isolation are recommended to isolate the chassis from earth ground externally.
Resolution
Steps to mitigate the issue were taken in PCB B01-00003R8 by eliminating the short. The changes are present in F01-x0003R11.
First release of HX500/HX600 manual
7/10/2020
Included page numbers
7/22/2020
Appendix A: Errata added
8/27/2020
Do not open or modify the device. The device's components comply with FCC and CE regulations; any modification may invalidate these certifications.
Install the device securely. Be careful handling the device to prevent injury and do not drop.
Wall or ceiling mounting device requires use of a mounting plate or bracket. The plate or bracket must be of metal construction and have a minimum thickness of 1mm.
Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom or rear of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.
The ambient operating temperature must be between 0 °C and 50 °C with a non-condensing relative humidity of 10-90%.
The device can be stored at temperatures between -10 °C and 85 °C.
Keep the device away from liquids and flammable materials.
Do not clean the device with liquids; the chassis can be cleaned with a cloth.
Allow at least 2 inches of space around all sides of the device for proper cooling.
If mounted on a vertical surface, orient the device so that heatsink fins allow unobstructed air circulation. Alternative orientations may reduce the operational temperature range.
This device is intended for indoor operation only.
Use a UL Listed external power supply with a rated output of 8-24Vdc.
Install the device only with shielded network cables.
For automotive installation, only use SAE approved cables.
The installer should be experienced in aftermarket installation and familiar with general practices for installing electronic devices in vehicles.
The device should not be installed in the driver’s area of a vehicle.
The device should be mounted according to accepted aftermarket practices and materials for vehicle installation.
Only use UL Listed connectors.
Service and repair of the device, including CMOS battery replacement, must be performed by qualified service personnel. The replacement CMOS battery must be the same type as the original.
Proper disposal of the CMOS battery must comply with local regulations. WARNING: There is a risk of explosion if the CMOS battery is replaced incorrectly. Disposing of the battery in fire or a hot oven, or mechanically crushing or cutting it, can result in an explosion.
Ne pas ouvrir ou modifier l'appareil. L'appareil utilise des composants conformes aux réglementations FCC et EC. La modification de l'appareil peut annuler ces certifications.
Installez l’appareil en toute sécurité. Soyez prudent lors de la manipulation de l'appareil pour éviter les blessures et ne pas faire tomber.
Le montage au mur ou au plafond nécessite l’utilisation d’une plaque de montage ou d’un support. La plaque ou le support doit être en métal et doit avoir une épaisseur minimale de 1 mm.
Utilisez des vis à tête plate M3x0,5mm pour fixer la plaque de montage ou les supports aux trous filetés situés au bas ou à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support dépassant 1,5 mm.
La plage de températures de fonctionnement doit être de 0 °C à 50 °C avec une humidité relative de 10 à 90% sans condensation. La température de fonctionnement dépend du choix du composant, y compris de l'adaptateur d'alimentation. Voir le tableau 1 ci-dessous pour le déclassement.
La plage de températures de stockage doit être de -10 °C à 85 °C.
Gardez l'appareil à l'écart des liquides et des matières inflammables.
Ne nettoyez pas l'appareil avec des liquides. Le châssis peut être nettoyé avec un chiffon.
Laissez au moins 5 cm d'espace autour de tous les côtés de l'appareil pour un refroidissement correct. Si l’appareil est monté sur une surface verticale, l’orientation recommandée est telle que les ailettes du dissipateur de chaleur permettent à l’air de monter sans obstruction. Les orientations alternatives peuvent entraîner une réduction de la plage de température de fonctionnement.
Cet appareil est conçu uniquement pour une utilisation en intérieur.
Utilisez une alimentation externe listée UL avec une sortie nominale de 8-24Vdc.
Installez l’appareil uniquement avec des câbles réseau blindés.
L'entretien et la réparation de l'appareil doivent être effectués par du personnel qualifié. Cela inclut, sans toutefois s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être du même type que l’originale.
La mise au rebut des batteries usagées doit être réalisée conformément aux réglementations environnementales.
ATTENTION: Risque d’explosion si la batterie est remplacée par une batterie de type incorrect. Les batteries doivent être recyclées dans la mesure du possible.

If the system fails to power on or is unresponsive, clearing the CMOS may help. It will also restore the BIOS to factory defaults.
Begin by following the Internal Access Instructions. Make sure the system is disconnected from power, monitor, and all peripheral connections. Once the system is open, see below.
Please note that the lights found on the Hot-swap bays used in the HX600 series are not activity lights and do not indicate the presence of or any activity on an installed drive. These lights indicate that the bay itself is currently receiving power from the system and can help determine at a glance if a bay has failed.
The maximum sustained power draw of the HX500 is approximately 60 watts, with short duration draw of up to 120 watts with high CPU load. The HX600 has the same base power draw plus any expansion cards. These numbers are estimates and the power supply selected should have overhead.
The M.2 B-Key slot can be used in tandem with the M.2 M-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs. NVMe RAID is not supported by the chipset. RAID arrays that mix together M.2 SATA and cabled 2.5” SATA drives can also be created (HX600 Only).
As of this writing (4/14/2021), there is a known issue in Ubuntu 18.04 and 20.04 that causes DisplayPort audio not to work. As a workaround, one of the audio kernel modules needs to be blacklisted.
To do so, open a terminal and run the following commands:
Reboot the system, and DP audio should once again be functional.
Further details can be found on .
V3.3: 3.3V rail voltage.
VRTC: RTC voltage.
V1.25: 1.25V rail voltage.
Locate the CMOS jumper indicated by the orange markings
Locate the CMOS CLR jumper
Move the jumper up by 1 pin and leave it there for 30 seconds.
Restore the jumper to the original position.
The CMOS has now been cleared. Reassemble the system and power it on. It may restart several times to reconfigure the CMOS.
If the issue has not been resolved by the reset, contact technical support.
The mounting bracket installation is complete.
User supplied screws can be used to attach the system to the desired surface.
If DIN mounting is desired, install the DIN clips onto the brackets using the included screws.
Tighten very gently as the screws are threading into plastic.
The system is ready for Din mounting
CPU (on solder side of board)
Socket LGA 1200 - Comet Lake S
Socket LGA 1200 - Comet Lake S
PCH
Q470
Q470
Memory
2 x SO-DIMM (2 x 32GB max Dual Channel)
64 GB Total
2 x SO-DIMM (2 x 32GB max Dual Channel)
64 GB Total
LAN Controller
1x Intel 219 -with AMT
1x Intel 210
1x Intel 219 -with AMT
1x Intel 210
Expansion
1x M.2 2280/60/3042 B-Key (PCIe x2, USB 3.2 5Gb/s, SATA)
1x M.2 2230 E-key (Wi-Fi) (PCIe / USB 2.0 / CNVi)
1x M.2 2280 M-key (PCIe x 4, SATA III)
1x mPCIe (PCIe x 1, USB 2.0)
1x M.2 2260/3042 B-Key (PCIe x 2, USB 3.2 5Gb/s, SATA)
1x M.2 2230 E-key (Wi-Fi) (PCIe / USB 2.0 / CNVi)
1x M.2 2280 M-key (PCIe x 4, SATA III)
1x 16x PCIe Gen 3
1x mPCIe (PCIe x 1, USB 2.0)
Back I/O
3x Full size DisplayPort 1.2 with CEC support by optional add-on module
2x Gb LAN (2 x Intel)
2x USB 3.2 10 Gb/s
2x USB 3.2 5 Gb/s
4pin Mini DIN with 12~24 V input
3x Full size DisplayPort 1.2 with CEC support by optional add-on module
2x Gb LAN (2 x Intel)
2x USB 3.2 10 Gb/s
2x USB 3.2 5 Gb/s
4pin Mini DIN with 12~24 V input
Expansion bay I/O (GPU, hot swap drive, Etc)
Front I/O
1x Power LED button
1x 3.5 mm Audio headset (mic-in, line-out) - CTIA
3FF-Sim slot (Mapped to the B-Key and mPCIe, BIOS selected)
4x USB 3.2 10Gb/s
1x Power LED button
1x 3.5 mm Audio headset (mic-in, line-out) - CTIA
3FF-Sim slot (Mapped to the B-Key and mPCIe, BIOS selected)
4x USB 3.2 10Gb/s
Onboard Headers & Connectors
1x Battery on a cable
2x Serial Header
2x USB 2.0 (2x5 header 2.54mm)
1x 4-Pin power for devices, 12V and 5V
1x 4-Pin power for Terminal Block Power/GPU power
Auto Power On (AT/ATX Mode Select)
1x PCIe x16 mating connector
2x SATA III connector
1x 4-Pin Fan Header
1x CEC Header
1x Battery on a cable
2x Serial Header
2x USB 2.0 (2x5 header 2.54mm)
1x 4-Pin power for devices, 12V and 5V
1x 4-Pin power for Terminal Block Power/GPU power
Auto Power On (AT/ATX Mode Select)
1x PCIe x16 mating connector
2x SATA III connector
1x 4-Pin Fan Header
1x CEC Header
Voltage Input
8~24V via DC jack or Aux power header
12~24V via DC jack or Aux power header (without GPU)
19~24V via DC jack or Aux power header (with GPU present)
Power Input
4 Pin Din with optional 4-pin Terminal Block (support remote switch, 4 Pin Din covered when not in use.)
4 Pin Din with optional 4-pin Terminal Block (support remote switch, 4 Pin Din covered when not in use.)
BIOS
Insyde H2O BIOS
Insyde H2O BIOS
Operating Systems
Windows 10, Ubuntu 18.04, Ubuntu 20.04 LTS, Yocto, Win10 IOT Core, ThinManager
Windows 10, Ubuntu 18.04, Ubuntu 20.04 LTS, Yocto, Win10 IOT Core, ThinManager
Special Features
Watchdog timer
RTC
PTT in BIOS,
TPM header - support TPM01
Support for Vision Processing Units
Support for 4G LTE and GPS expansion cards
Hardware Auto Power On
Rapid Branding
Watchdog timer
RTC
PTT in BIOS,
TPM header - support TPM01
Support for Vision Processing Units
Support for 4G LTE and GPS expansion cards
Hardware Auto Power On
Rapid Branding
Thermal Standards (Subject to change through RFI and RFQ steps)
Board Operating Temperature: 0-50C
Storage Temperature: -10-85C
Operating Humidity: 0% - 90% (non-condensing)
Board Operating Temperature: 0-50C
Storage Temperature: -10-85C
Operating Humidity: 0% - 90% (non-condensing)
Extra Chassis Features
6 Antenna holes
Wall Mount
DIN Rail Mount
VESA Mount
6 Antenna holes
2.5" Hard drive hot swap bracket (later release, Q3 2020)
GPU Fan array
Regulatory
SAFETY IEC/UL/EN 62368-1
EMC CISPR 32/35 Class A
FCC Part 15 Class A
IEC/EN 60601-1-2:2014 EMC Ready
Radio Equipment Directive (2014/53/EU) - Only applicable for configurations with wireless transmitters
RoHS 3 Directive (2015/863/EU)
WEEE Directive (2012/19/EU)
SAFETY IEC/UL/EN 62368-1
EMC CISPR 32/35 Class A
FCC Part 15 Class A
IEC/EN 60601-1-2:2014 EMC Ready
Radio Equipment Directive (2014/53/EU) - Only applicable for configurations with wireless transmitters
RoHS 3 Directive (2015/863/EU)
WEEE Directive (2012/19/EU)
Severity
Medium
Severity
Low
Added Section 4.3 Input voltage qualifications
10/20/2020
Updated mounting dimensions for HX500
Corrected block diagram to 3FF SIM slot
01/21/2021
Revision 3.0 - Extrovert 4G LTE changed to > OnLogic Cellular
02/09/2023
echo "options snd-hda-intel dmic_detect=0" | sudo tee -a /etc/modprobe.d/alsa-base.confecho "blacklist snd_soc_skl" | sudo tee -a /etc/modprobe.d/blacklist.conf


































































The UEFI BIOS is a small program which runs when your computer starts and configures its basic functions. That configuration is automatic, and most users will be satisfied with the default configuration. If the default configuration is not sufficient, the BIOS has setup menus which can be used to reconfigure the computer.
The purpose of this manual is to document the function of the BIOS and its available configuration options. The text of this document lists the BIOS menus and options exactly as they appear in the BIOS menus: in the correct order, with the correct default values for this BIOS version. Some options are hidden based on how other options are set and which hardware is detected in the system, so some options may not appear on all systems. Informative screenshots are also provided throughout, but their contents may not exactly match this BIOS version.
To access the BIOS setup menu, hold the Delete key on the keyboard while turning on the system. After a few seconds, the BIOS front page menu is shown:
On each menu, the selected option is shown in white, other options are shown in blue, and read-only options are shown in gray. Some menus have multiple screens, which are shown at the top of the screen. The active screen is shown with a gray background and inactive screens are shown with blue backgrounds.
BIOS menus are navigated by pressing keys on the keyboard:
F1 shows help on available keyboard shortcuts
↑/↓ arrow keys select the option above or below the currently-selected option
→/← arrow keys activate the screen to the right or left of the currently-activated screen
Several options are available on the front page:
Continue: continues the boot process normally, booting the installed operating system
Boot Manager: opens a menu to select which device should be booted
Device Management: opens a menu which shows the status of the system hardware
The boot manager menu shows the devices available to be booted. The installed operating system and any attached USB drives will be listed. If enabled in the setup utility, the UEFI shell is also listed. Selecting an option boots it.
The setup utility shows the status of the system and allows many configuration options to be changed. These options affect the functionality, stability and security of the system, and should not be changed without an understanding of their meaning.
The setup utility has many screens. Press the →/← arrow keys to select between them. Each screen is described below.
Several configuration options are frequently used.
Default value: S0 State; possible values: S0 State, S5 State, Last
Controls the state the system enters after G3 (power loss). If set to S5, the system remains off when initially connected to power. If set to S0, the system boots when connected to power.
The main screen shows the BIOS version, information about the installed CPU, and the system date and language.
The Advanced menu contains the following options:
Boot Configuration (menu)
Configures Boot Settings.
Peripheral Configuration (menu; only in expert mode)
Configures the peripheral devices.
SATA Configuration (menu)
Select the SATA controller and hard disk drive type installed in your system
USB Configuration (menu; only in expert mode)
Configure the USB supp
Chipset Configuration (menu)
Advanced Chipset Configuration Options.
Debug Settings (menu; only in expert mode)
Debug interface Settings
PCI Subsystem Settings (menu; only in expert mode)
PCI, PCI-X and PCI Express Settings.
ACPI Table/Features Control (menu)
Configures ACPI Tables/Features setting.
CPU Configuration (menu)
CPU Configuration
Connectivity Configuration (menu; only in expert mode)
Configure Connectivity related options
Power & Performance (menu; only in expert mode)
Power & Performance Options
Functional Safety Configuration (menu)
Functional Safety Configuration options
OverClocking Performance Menu (menu; only in expert mode)
Performance Menu for Processor and Memory.
Memory Configuration (menu; only in expert mode)
Memory Configuration Parameters
System Agent (SA) Configuration (menu; only in expert mode)
System Agent (SA) Parameters
PCIE Configuration (menu; only in expert mode)
PCIE Parameters
PCH-IO Configuration (menu)
PCH Parameters
PCH-FW Configuration (menu)
Configure Management Engine Technology Parameters
Thermal Configuration (menu)
Thermal Configuration Parameters
Platform Settings (menu; only in expert mode)
Platform related settings
ACPI D3Cold settings (menu; only in expert mode)
ACPI D3Cold related settings
BCLK Configuration (menu; only in expert mode)
BCLK Configuration options
Console Redirection (menu)
Console Redirection Settings
OnLogic Feature Configuration (menu)
OnLogic Feature Configuration Menu
SIO NCT5124D (menu)
SIO NCT5124D configuration menu
Expert Mode (default value: Disabled; possible values: Disabled, Enabled)
SCU Expert Mode
The CPU Configuration menu contains the following options:
Efficient-core Information (menu)
Displays the E-core Information
Performance-core Information (menu)
Displays the P-core Information
ID
Displays the Processor ID.
Brand String
Brand String of the Performance Processor
VMX
VMX Supported or Not
SMX/TXT
SMX/TXT Supported or Not
TXT Crash Code
TXT Crash Code Register value
TXT SPAD
TXT SPAD Register value
Boot Guard Status
Boot Guard Status Register value
Boot Guard ACM Policy Status
Boot Guard ACM Policy Status value
Boot Guard SACM Information
Boot Guard SACM Info MSR value
C6DRAM (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable moving of DRAM contents to PRM memory when CPU is in C6 state
CPU Flex Ratio Override (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable CPU Flex Ratio Programming
CPU Flex Ratio Settings (read-only; possible values: numbers between 0 and 63)
This value must be between Max Efficiency Ratio (LFM) and Maximum non-turbo ratio set by Hardware (HFM).
Hardware Prefetcher (default value: Enabled; possible values: Disabled, Enabled)
To turn on/off the MLC streamer prefetcher.
Adjacent Cache Line Prefetch (default value: Enabled; possible values: Disabled, Enabled)
To turn on/off prefetching of adjacent cache lines.
Intel (VMX) Virtualization Technology (default value: Enabled; possible values: Disabled, Enabled)
When enabled, a VMM can utilize the additional hardware capabilities provided by Vanderpool Technology.
PECI (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable PECI
AVX (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable the Avx 2 Instructions. This is applicable for Performance-core only
Active Performance-cores (default value: All; possible values: All)
Number of P-cores to enable in each processor package. Note: Number of Cores and E-cores are looked at together. When both are {0,0}, Pcode will enable all cores.
Active Efficient-cores (default value: All; possible values: All, 0)
Number of E-cores to enable in each processor package. Note: Number of Cores and E-cores are looked at together. When both are {0,0}, Pcode will enable all cores.
Hyper-Threading (default value: Enabled; possible values: Disabled, Enabled)
Enable or Disable Hyper-Threading Technology.
BIST (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable BIST (Built-In Self Test) on reset
AP threads Idle Manner (default value: MWAIT Loop; possible values: HALT Loop, MWAIT Loop, RUN Loop)
AP threads Idle Manner for waiting signal to run
AES (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable AES (Advanced Encryption Standard)
MachineCheck (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Machine Check
MonitorMWait (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable MonitorMWait, if Disable MonitorMwait, the AP threads Idle Manner should not set in MWAIT Loop
Intel Trusted Execution Technology (default value: Disabled; possible values: Disabled, Enabled)
Enables utilization of additional hardware capabilities provided by Intel (R) Trusted Execution Technology.
Changes require a full power cycle to take effect.
Alias Check Request (read-only; possible values: Disabled, Enabled)
Enables Txt Alias Checking capability
Changes require full Txt capability before it will take effect.
It is a one time only change, next reboot will be reset.
DPR Memory Size (MB) (read-only; possible values: numbers between 0 and 255)
Reserve DPR memory size (0-255) MB
Reset AUX Content (read-only; possible values: Yes, No)
Reset TPM Aux content. Txt may not functional after AUX content gets reset.
CPU SMM Enhancement (menu)
CPU SMM Enhancement
Total Memory Encryption (default value: Disabled; possible values: Disabled, Enabled)
Configure Total Memory Encryption (TME) to protect DRAM data from physical attacks.
The Memory Configuration menu contains the following options:
Memory Thermal Configuration (menu)
Memory Thermal Configuration Options
Memory Training Algorithms (menu)
Enable/Disable Memory Training Algorithms.
Memory (menu)
Memory Overclocking Menu
Memory RC Version
Memory RC Version
Memory Frequency
Displays the Frequency of Memory
tCL-tRCD-tRP-tRAS
Memory Timings
MC 0 Ch 0 DIMM 0
Controller Channel Slot Subtitle
MC 0 Ch 0 DIMM 1
Controller Channel Slot Subtitle
Size
Memory Size in the Slot.
Number of Ranks
Number of Ranks in the slot
Manufacturer
DIMM / DRAM Manufacturer Value
MC 1 Ch 0 DIMM 0
Controller Channel Slot Subtitle
MC 1 Ch 0 DIMM 1
Controller Channel Slot Subtitle
Size
Memory Size in the Slot.
Number of Ranks
Number of Ranks in the slot
Manufacturer
DIMM / DRAM Manufacturer Value
Debug Value (default value: 0; possible values: numbers between 0 and 4294967295)
Debug Value
MRC ULT Safe Config (default value: Disabled; possible values: Disabled, Enabled)
MRC ULT Safe Config for PO
LPDDR DqDqs Re-Training (default value: Enabled; possible values: Disabled, Enabled)
Disable/Enable LPDDR DqDqs Re Training
Safe Mode Support (default value: Disabled; possible values: Disabled, Enabled)
Safe Mode enable support. Option will be used for changes/WAs that may affect an stable MRC
Memory Test on Warm Boot (default value: Enabled; possible values: Disabled, Enabled)
Enable Or Disable Base Memory Test Run on Warm Boot
Maximum Memory Frequency (default value: Auto; possible values: Auto, 1067, 1333, 1400, 1600, 1800, 1867, 2000, 2133, 2200, 2400, 2600, 2667, 2800, 2933, 3000, 3200, 3467, 3600, 3733, 4000, 4200, 4267, 4400, 4600, 4800, 5000, 5200, 5400, 5600, 5800, 6000, 6200, 6400, 10000, 12800)
Maximum Memory Frequency Selections in Mhz.
LP5 Bank Mode (default value: Auto; possible values: Auto, LP5 8 Bank Mode, LP5 16 Bank Mode, LP5 BG Mode)
LP5 Bank Mode
Frequency Limit for Mixed 2DPC DDR4 (default value: 0; possible values: numbers between 0 and 65535)
Override the reduced speed in mixed 2DPC config or non-POR 2DPC config. 0=Auto, otherwise speed in MT/s
Frequency Limit for Mixed 2DPC DDR5 1 Rank 8GB and 8GB (default value: 2000; possible values: numbers between 0 and 65535)
Override the reduced speed in mixed 2DPC config or non-POR 2DPC config. 0=Auto, otherwise speed in MT/s
Frequency Limit for Mixed 2DPC DDR5 1 Rank 16GB and 16GB (default value: 2000; possible values: numbers between 0 and 65535)
Override the reduced speed in mixed 2DPC config or non-POR 2DPC config. 0=Auto, otherwise speed in MT/s
Frequency Limit for Mixed 2DPC DDR5 1 Rank 8GB and 16GB (default value: 2000; possible values: numbers between 0 and 65535)
Override the reduced speed in mixed 2DPC config or non-POR 2DPC config. 0=Auto, otherwise speed in MT/s
Frequency Limit for Mixed 2DPC DDR5 2 Rank (default value: 2000; possible values: numbers between 0 and 65535)
Override the reduced speed in mixed 2DPC config or non-POR 2DPC config. 0=Auto, otherwise speed in MT/s
LCT Cmd Eye Width (default value: 96; possible values: numbers between 0 and 65535)
LCT Cmd Eye Width 0= Auto
HOB Buffer Size (default value: Auto; possible values: Auto, 1B, 1KB, Max (assuming 63KB total HOB size))
Size to set HOB Buffer
Max TOLUD (default value: Dynamic; possible values: Dynamic, 1 GB, 1.25 GB, 1.5 GB, 1.75 GB, 2 GB, 2.25 GB, 2.5 GB, 2.75 GB, 3 GB, 3.25 GB, 3.5 GB)
Maximum Value of TOLUD. Dynamic assignment would adjust TOLUD automatically based on largest MMIO length of installed graphic controller
SA GV (default value: Enabled; possible values: Disabled, Enabled, Fixed to 1st Point, Fixed to 2nd Point, Fixed to 3rd Point, Fixed to 4th Point)
System Agent Geyserville. Can disable, fix to a specific point, or enable frequency switching.
First Point Frequency (default value: 0; possible values: numbers between 0 and 65535)
Specify the frequency for the given point. 0 - MRC auto, Else a specific frequency as an integer: 1333
First Point Gear (default value: 0; possible values: numbers between 0 and 4)
Gear ratio for this SAGV point. 0-Auto, 1-G1, 2-G2, 4-G4
Second Point Frequency (default value: 0; possible values: numbers between 0 and 65535)
Specify the frequency for the given point. 0 - MRC auto, Else a specific frequency as an integer: 1333
Second Point Gear (default value: 0; possible values: numbers between 0 and 4)
Gear ratio for this SAGV point. 0-Auto, 1-G1, 2-G2, 4-G4
Third Point Frequency (default value: 0; possible values: numbers between 0 and 65535)
Specify the frequency for the given point. 0 - MRC auto, Else a specific frequency as an integer: 1333
Third Point Gear (default value: 0; possible values: numbers between 0 and 4)
Gear ratio for this SAGV point. 0-Auto, 1-G1, 2-G2, 4-G4
Fourth Point Frequency (default value: 0; possible values: numbers between 0 and 65535)
Specify the frequency for the given point. 0 - MRC auto, Else a specific frequency as an integer: 1333
Fourth Point Gear (default value: 0; possible values: numbers between 0 and 4)
Gear ratio for this SAGV point. 0-Auto, 1-G1, 2-G2, 4-G4
SAGV Switch Factor IA (default value: 30; possible values: numbers between 1 and 50)
SAGV Switch Factor of IA Load Percentage To Trigger Switching Up And Down
SAGV Switch Factor GT (default value: 30; possible values: numbers between 1 and 50)
SAGV Switch Factor of GT Load Percentage To Trigger Switching Up And Down
SAGV Switch Factor IO (default value: 30; possible values: numbers between 1 and 50)
SAGV Switch Factor of IO Load Percentage To Trigger Switching Up And Down
SAGV Switch Factor Stall (default value: 30; possible values: numbers between 1 and 50)
SAGV Switch Factor of IA/GT Stall Percentage To Trigger Switching Up And Down
Threshold For Switch Up (default value: 1; possible values: numbers between 1 and 50)
Duration In MS Of High Activity After Which SAGV Will Switch Up
Threshold For Switch Down (default value: 1; possible values: numbers between 1 and 50)
Duration In MS Of Low Activity After Which SAGV Will Switch Down
Retrain on Fast Fail (default value: Enabled; possible values: Disabled, Enabled)
Restart MRC in Cold mode if SW MemTest fails during Fast flow. Default = Enabled
DDR4_1DPC (default value: Enabled; possible values: Disabled, Enabled on DIMM0 only, Enabled on DIMM1 only, Enabled)
DDR4 1DPC performance feature for 2R DIMMs. Can be enabled on DIMM0 or DIMM1 only, or on both
Row Hammer Mode (default value: RFM; possible values: Disabled, RFM, pTRR)
Row Hammer Prevention Mode. RFM will fall back to pTRR if not available
RH LFSR0 Mask (default value: 1/2^11; possible values: 1/2^1, 1/2^2, 1/2^3, 1/2^4, 1/2^5, 1/2^6, 1/2^7, 1/2^8, 1/2^9, 1/2^10, 1/2^11, 1/2^12, 1/2^13, 1/2^14, 1/2^15)
LFSR0 mask for RH pTRR
RH LFSR1 Mask (default value: 1/2^11; possible values: 1/2^1, 1/2^2, 1/2^3, 1/2^4, 1/2^5, 1/2^6, 1/2^7, 1/2^8, 1/2^9, 1/2^10, 1/2^11, 1/2^12, 1/2^13, 1/2^14, 1/2^15)
LFSR1 mask for RH pTRR
MC Refresh Rate (default value: NORMAL Refresh; possible values: NORMAL Refresh, 2x Refresh, 4x Refresh)
Select refresh rate on the MC
Refresh Watermarks (default value: High; possible values: Low, High)
Sets Refresh Panic Watermark and Refresh High-Priority Watermark to HIGH or LOW values
LPDDR ODT RttWr (default value: 0; possible values: numbers between 0 and 255)
Initial RttWr ODT override for LP4/5 in Ohms. Range 0x01 - 0xFF, default 0 = AUTO
LPDDR ODT RttCa (default value: 0; possible values: numbers between 0 and 255)
Initial RttCa ODT override for LP4/5 in Ohms. Range 0x01 - 0xFF, default 0 = AUTO
Exit On Failure (MRC) (default value: Enabled; possible values: Disabled, Enabled)
Exit On Failure for MRC training steps
New Features 1 - MRC (default value: Disabled; possible values: Disabled, Enabled)
Enabling/Disabling Generic New Features 1
New Features 2 - MRC (default value: Disabled; possible values: Disabled, Enabled)
Enabling/Disabling Generic New Features 2
Ch Hash Override (default value: Disabled; possible values: Disabled, Enabled)
Override Channel Hash settings
Ch Hash Support (read-only; possible values: Disabled, Enabled)
Enable/Disable Channel Hash Support. NOTE: ONLY if Memory interleaved Mode
Ch Hash Mask (read-only; possible values: numbers between 1 and 16383)
Set the BIT(s) to be included in the XOR function. NOTE BIT mask corresponds to BITS [19:6}
Ch Hash Interleaved Bit (read-only; possible values: BIT6, BIT7, BIT8, BIT9, BIT10, BIT11, BIT12, BIT13)
Select the BIT to be used for Channel Interleaved mode. NOTE: BIT7 will interlave the channels at a 2 cacheline granularity, BIT8 at 4 and BIT9 at 8
Extended Bank Hashing (default value: Enabled; possible values: Disabled, Enabled)
Enable/disable Extended Bank Hashing.
Per Bank Refresh (default value: Enabled; possible values: Disabled, Enabled)
Enables and Disables the per bank refresh. This only impacts memory technologies that support PBR: LPDDR4, LPDDR5 and DDR5
VC1 Read Metering (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable VC1 Read Metering Feature (RdMeter)
Strong Weak Leaker (default value: 7; possible values: numbers between 1 and 7)
Value for StrongWkLeaker
Power Down Mode (default value: Auto; possible values: Auto, No Power Down, APD, PPD-DLLoff)
CKE Power Down Mode Control
Pwr Down Idle Timer (default value: 0; possible values: numbers between 0 and 255)
The minimum value should = to the worst case Roundtrip delay + Burst_Length. 0 means AUTO: 64 for ULX/ULT, 128 for DT/Halo
Page Close Idle Timeout (default value: Enabled; possible values: Enabled, Disabled)
Page Close Idle Timeout Control
Memory Scrambler (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Memory Scrambler support.
Force ColdReset (default value: Disabled; possible values: Enabled, Disabled)
Force ColdReset OR Choose MrcColdBoot mode, when Coldboot is required during MRC execution. Note: If ME 5.0MB is present, ForceColdReset is required!
Controller 0, Channel 0 Control (default value: Enabled; possible values: Enabled, Disabled)
Controller 0, Channel 0 Control - Enable or Disable Controller 0, Channel 0.
Controller 0, Channel 1 Control (default value: Enabled; possible values: Enabled, Disabled)
Controller 0, Channel 1 Control - Enable or Disable Controller 0, Channel 1.
Controller 0, Channel 2 Control (default value: Enabled; possible values: Enabled, Disabled)
Controller 0, Channel 2 Control - Enable or Disable Controller 0, Channel 2.
Controller 0, Channel 3 Control (default value: Enabled; possible values: Enabled, Disabled)
Controller 0, Channel 3 Control - Enable or Disable Controller 0, Channel 3.
Controller 1, Channel 0 Control (default value: Enabled; possible values: Enabled, Disabled)
Controller 1, Channel 0 Control - Enable or Disable Controller 1, Channel 0.
Controller 1, Channel 1 Control (default value: Enabled; possible values: Enabled, Disabled)
Controller 1, Channel 1 Control - Enable or Disable Controller 1, Channel 1.
Controller 1, Channel 2 Control (default value: Enabled; possible values: Enabled, Disabled)
Controller 1, Channel 2 Control - Enable or Disable Controller 1, Channel 2.
Controller 1, Channel 3 Control (default value: Enabled; possible values: Enabled, Disabled)
Controller 1, Channel 3 Control - Enable or Disable Controller 1, Channel 3.
Force Single Rank (default value: Disabled; possible values: Disabled, Enabled)
When enabled, only Rank 0 will be used in each DIMM
Memory Remap (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable Memory Remap above 4GB
Time Measure (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable printing of the time it takes to execute MRC.
Fast Boot (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable fast path thru the MRC
Rank Margin Tool Per Task (default value: Disabled; possible values: Disabled, Enabled)
Enables/Disables RMT running at every major training step
Training Tracing (default value: Disabled; possible values: Disabled, Enabled)
Enables/Disables printing of the current trained state at every major training step.
Lpddr Mem WL Set (default value: Set B; possible values: Set A, Set B)
Only applicable to LPDDR, Memory Write Latency Set selection (A is default, B will be used if memory devices support it)
BDAT Memory Test Type (read-only; possible values: Rank Margin Tool Rank, Rank Margin Tool Bit, Margin 2D)
Indicates the type of Memory Training data to populate into the BDAT ACPI table.
Rank Margin Tool Loop Count (default value: 0; possible values: numbers between 0 and 32)
Specifies the Loop Count to be used during Rank Margin Tool Testing. 0 - AUTO
ECC DFT (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable ECC DFT feature
Write0 (default value: Disabled; possible values: Disabled, Enabled)
Write0 feature for LP5/DDR5
Periodic DCC (default value: Disabled; possible values: Disabled, Enabled)
Enable / Disable Periodic DCC
LPMode (default value: Auto; possible values: Auto, Enabled, Disabled)
Control LPMode feature
PPR Enable (default value: Disabled; possible values: Disabled, Hard PPR)
PPR permanently repairs failed rows (if possible).
SAM Overlaoding (default value: Disabled; possible values: Disabled, Enabled)
Enable: copy the sagv frequency point. Disable: not copy.
The Chipset Configuration menu contains the following options:
Platform Trust Technology (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable Platform Trust Technology.
The System Agent (SA) Configuration menu contains the following options:
VT-d
VT-d capability
Graphics Configuration (menu)
Graphics Configuration
DMI/OPI Configuration (menu)
Control various DMI functions.
TCSS setup menu (menu)
TCSS Configuration settings
VMD setup menu (menu)
VMD Configuration settings
Display setup menu (menu)
Display Configuration settings
PCI Express Configuration (menu)
PCI Express Configuration settings
Stop Grant Configuration (default value: Auto; possible values: Auto, Manual)
Automatic/Manual stop grant configuration
VT-d (default value: Enabled; possible values: Disabled, Enabled)
VT-d capability
Control Iommu Pre-boot Behavior (default value: Enable IOMMU during boot; possible values: Disable IOMMU, Enable IOMMU during boot)
Enable IOMMU in Pre-boot environment (If DMAR table is installed in DXE and If VTD_INFO_PPI is installed in PEI.)
X2APIC Opt Out (default value: Disabled; possible values: Enabled, Disabled)
Enable/Disable X2APIC_OPT_OUT bit
DMA Control Guarantee (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable DMA_CONTROL_GUARANTEE bit
Thermal Device (B0:D4:F0) (default value: Disabled; possible values: Enabled, Disabled)
Enable/Disable SA Thermal Device. Always enabled for ICL A0 stepping.
Cpu CrashLog (Device 10) (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable Cpu CrashLog Device.
GNA Device (B0:D8:F0) (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable SA GNA Device.
CRID Support (default value: Disabled; possible values: Enabled, Disabled)
Enable/Disable SA CRID and TCSS CRID control for Intel SIPP
Above 4GB MMIO BIOS assignment (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable above 4GB MemoryMappedIO BIOS assignment
This is enabled automatically when Aperture Size is set to 2048MB.
IPU Device (B0:D5:F0) (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable SA IPU Device.
IPU 1181 Dash Camera (default value: Disabled; possible values: Enabled, Disabled)
Enable/Disable SA IPU 1181 Dash Camera support.
MIPI Camera Configuration (menu)
MIPI Camera Configuration
The PCH-IO Configuration menu contains the following options:
PCI Express Configuration (menu)
PCI Express Configuration settings
SATA Configuration (menu)
SATA Device Options Settings
USB Configuration (menu)
USB Configuration settings
Security Configuration (menu)
Security Configuration settings
HD Audio Configuration (menu)
HD Audio Subsystem Configuration Settings
THC Configuration (menu; disabled)
Touch Host Controller Configuration Settings
SerialIo Configuration (menu)
SerialIo Configuration Settings
ISH Configuration (menu)
Integrated Sensor Hub (ISH) Configuration
Pch Thermal Throttling Control (menu)
Pch Thermal Throttling Control
Skip VCCIN_AUX Configuration (default value: Disabled; possible values: Disabled, Enabled)
Skips VCCIN_AUX Configuration if enabled
FIVR Configuration (menu)
Menu for changing FIVR configuration parameters
PMC Configuration (menu)
Power management controller configuration
EFI Network (default value: Disabled; possible values: Onboard NIC, WiFi, Onboard NIC & WiFi, Disabled)
Enable/Disable EFI Network support for onboard LAN or WiFi module.
DeepSx Power Policies (default value: Disabled; possible values: Disabled, Enabled in S4-S5-Battery, Enabled in S5-Battery, Enabled in S4-S5, Enabled in S5)
configure the DeepSx Mode configuration.
Wake on WLAN and BT Enable (only in expert mode; default value: Disabled; possible values: Enabled, Disabled)
Enable/Disable PCI Express Wireless LAN and Bluetooth to wake the system.
Disable DSX ACPRESENT PullDown (only in expert mode; default value: Disabled; possible values: Enabled, Disabled)
Disable PCH internal ACPRESENT PullDown when DeepSx or G3 exit.
State After G3 (default value: S0 State; possible values: S0 State, S5 State, Last)
Specify what state to go to when power is re-applied after a power failure (G3 state).
Port 80h Redirection (default value: LPC Bus; possible values: LPC Bus, PCIE Bus)
Control where the Port 80h cycles are sent.
Enhance Port 80h LPC Decoding (default value: Enabled; possible values: Disabled, Enabled)
Support the word/dword decoding of port 80h behind LPC
Compatible Revision ID (read-only; possible values: Disabled, Enabled)
Enable/Disable the PCH Compatible Revision ID feature
Legacy IO Low Latency (default value: Disabled; possible values: Disabled, Enabled)
Set to enable low latency of legacy IO. Some systems require lower IO latency irrespective of power. This is a tradeoff between power and IO latency.
PCH Cross Throttling (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable the PCH Cross Throttling feature. Only ULT support this feature.
PCH Energy Reporting (default value: Enabled; possible values: Disabled, Enabled)
Enable Energy Report. MUST set it as ENABLED. This is only for test purpose.
LPM S0i2.0 (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable S0ix sub-state. This setting is for test purpose. S0ix sub-states should be enabled for production.
LPM S0i3.0 (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable S0ix sub-state. This setting is for test purpose. S0ix sub-states should be enabled for production.
C10 Dynamic threshold adjustment (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable C10 dynamic threshold adjustment
IEH Mode (default value: Bypass Mode; possible values: Bypass Mode, Enabled)
Enable/Bypass IEH Mode
Enable TCO Timer (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable TCO timer. When disabled, it disables PCH ACPI timer, stops TCO timer, and ACPI WDAT table will not be published.
Enable Timed GPIO0 (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Timed GPIO0. When disabled, it disables cross time stamp time-synchronization as extension of Hammock Harbor time synchronization.
Enable Timed GPIO1 (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Timed GPIO1. When disabled, it disables cross time stamp time-synchronization as extension of Hammock Harbor time synchronization.
Pcie Pll SSC (default value: Auto; possible values: Auto, 0.0%, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1.0%, 1.1%, 1.2%, 1.3%, 1.4%, 1.5%, 1.6%, 1.7%, 1.8%, 1.9%, 2.0%, Disable)
Pcie Pll SSC percentage.AUTO - Keep hw default, no BIOS override. Range is 0.0%-2.0%.
IOTG PLL SSCEN (CPU Side SSC) (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable IOTG PLL SSCEN
Enable 8254 Clock Gate (default value: Enabled; possible values: Disabled, Enabled, Enabled In Runtime and S3 Resume)
Enables/Disables 8254 clock gate in early phase. Set 8254CGE is necessary for SLP_S0 support. Platform is albe to disable this policy and set 8254CGE in late phase.
Lock PCH Sideband Access (default value: Enabled; possible values: Disabled, Enabled)
Lock PCH Sideband access, include SideBand interface lock and SideBand PortID mask for certain end point (e.g. PSFx). The option is invalid if POSTBOOT SAI is set.
Flash Protection Range Registers (FPRR) (default value: Enabled; possible values: Disabled, Enabled)
Enable Flash Protection Range Registers
SPD Write Disable (default value: TRUE; possible values: TRUE, FALSE)
Enable/Disable setting SPD Write Disable. For security recommendations, SPD write disable bit must be set.
LGMR (default value: Disabled; possible values: Enabled, Disabled)
64KB memory block for LGMR (LPC Memory Range Decode)
HOST_C10 reporting to Target (default value: Disabled; possible values: Disabled, Enabled)
This option enables HOST_C10 reporting to Target via eSPI Virtual Wire
OS IDLE Mode (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable OS Idle Mode Feature
S0ix Auto Demotion (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable Host Low Power Mode S0ix Auto-Demotion
Latch Events C10 Exit (default value: Disabled; possible values: Enabled, Disabled)
Enable/Disable Latch Events on C10 Exit
Extended BIOS Range Decode (default value: Disabled; possible values: Disabled, Enabled)
Enabling this will make memory cycles falling in a specific area to be redirected to SPI flash controller
ACPI L6D PME Handling (default value: Disabled; possible values: Enabled, Disabled)
BIOS through ACPI code can associate specific method to a particular GPE. In this case _L6D for Level-triggered Event, BIOS-ACPI can verify PMEENABLE and PMESTATUS of each device that requires GPE related wake.
The PCH-FW Configuration menu contains the following options:
ME Firmware Version
ME Firmware Version
ME Firmware Mode
ME Firmware Mode
ME Firmware SKU
ME Firmware SKU
ME Firmware Status 1
ME Firmware Status 1
ME Firmware Status 2
ME Firmware Status 2
ME Firmware Status 3
ME Firmware Status 3
ME Firmware Status 4
ME Firmware Status 4
ME Firmware Status 5
ME Firmware Status 5
ME Firmware Status 6
ME Firmware Status 6
ME State (default value: Enabled; possible values: Disabled, Enabled)
When Disabled ME will be put into ME Temporarily Disabled Mode.
Manageability Features State (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Intel(R) Manageability features.
NOTE:
This option disables/enables Manageability Features support in FW.
To disable support platform must be in an unprovisioned state first.
AMT BIOS Features (default value: Enabled; possible values: Disabled, Enabled)
When disabled AMT BIOS Features are no longer supported and user is no longer able to access MEBx Setup.
Note:
This option does not disable Manageability Features in FW.
AMT Configuration (menu)
Configure Intel(R) Active Management Technology Parameters
ME Unconfig on RTC Clear (default value: Enabled; possible values: Disabled, Enabled)
When Disabled ME will not be unconfigured on RTC Clear
Comms Hub Support (default value: Disabled; possible values: Disabled, Enabled)
Enables/Disables support for Comms Hub.
JHI Support (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable Intel(R) DAL Host Interface Service (JHI)
Core Bios Done Message (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Core Bios Done message sent to ME
Firmware Update Configuration (menu)
Configure Management Engine Technology Parameters
PTT Configuration (menu)
Configure PTT
FIPS Configuration (menu)
FIPS Mode help
Unique Platform Id Configuration (menu; disabled)
Configure Unique Platform Id Feature
ME Debug Configuration (menu)
Configure ME debug options
NOTE:
This menu is provided for testing purposes. It is recommended to leave the options in their default states
Anti-Rollback SVN Configuration (menu)
Configure Anti-Rollback SVN
OEM Key Revocation Configuration (menu)
Configure OEM Key Revocation
Extend CSME Measurement to TPM-PCR (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable Extend CSME Measurement to TPM-PCR[0] and AMT Config to TPM-PCR[1]
The Peripheral Configuration menu contains the following options:
Serial Port A (default value: Disabled; possible values: Disabled, Auto, Enabled)
Configure Serial port A using options : [Disable] No Configuration [Enable] User Configuration [Auto] EFI/OS chooses configuration
Infrared Port (default value: Disabled; possible values: Disabled, Auto, Enabled)
Configure Infrared port using options : [Disable] No Configuration [Enable] User Configuration [Auto] EFI/OS chooses configuration
The USB Configuration menu contains the following options:
USB BIOS Support (default value: Enabled; possible values: Disabled, Enabled, UEFI Only)
USB keyboard/mouse/storage support under UEFI and DOS environment. It will supporting UEFI environment only if set to UEFI Only
Usb Legacy SMI bit Clean (default value: Disabled; possible values: Disabled, Enabled)
Clean Usb Legacy SMI bit for xHCI and EHCI
The SATA Configuration menu contains the following options:
Serial ATA Port 0 (menu; disabled)
Serial ATA Port 0 Device configuration
Serial ATA Port 1 (menu; disabled)
Serial ATA Port 1 Device configuration
The PCI Subsystem Settings menu contains the following options:
PCI Bus Driver Version
PCI, PCI-X and PCI Express Settings.
PCI ROM Priority (default value: EFI Compatible ROM; possible values: Legacy ROM, EFI Compatible ROM)
In case of multiple Option ROMs (Legacy and EFI Compatible), specifies what PCI Option rom to launch.
External DMA Allowed On Boot (default value: No; possible values: No, Yes)
External DMA Allowed On Boot for devices such as 1394, PCMCIA, & CardBus
Install Ext OpRom Before BIOS Setup (default value: Disabled; possible values: Disabled, Ext PCIE Storage OpRom, Ext PCIE Other OpRom, Ext PCIE Both Storage and Other OpRom)
Install Ext OpRom for Storage or Other device before BIOS Setup, That we can get the Ext PCIE Card OpRom Setup Menu and have chance to enter into it
PCI Latency Timer (default value: 32 PCI Bus Clocks; possible values: 32 PCI Bus Clocks, 64 PCI Bus Clocks, 96 PCI Bus Clocks, 128 PCI Bus Clocks, 160 PCI Bus Clocks, 192 PCI Bus Clocks, 224 PCI Bus Clocks, 248 PCI Bus Clocks)
Value to be programmed into PCI Latency Timer Register.
The SIO NCT5124D menu contains the following options:
UART Port 1 Configuration (menu)
UART Configuration
UART Port 2 Configuration (menu)
UART Configuration
UART Port 3 Configuration (menu)
UART Configuration
UART Port 4 Configuration (menu)
UART Configuration
The PCIE Configuration menu contains the following options:
IMR Configuration (menu)
IMR Configuration
The Power & Performance menu contains the following options:
CPU - Power Management Control (menu)
CPU - Power Management Control Options
GT - Power Management Control (menu)
GT - Power Management Control Options
Intel(R) Speed Shift Technology Interrupt Control (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Intel(R) Speed Shift Technology Interrupts
The OverClocking Performance Menu menu contains the following options:
OverClocking Feature (read-only; possible values: Disabled, Enabled)
Performance Menu for Processor and Memory.
WDT Enable (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable WatchDog Timer. Note: This option is ignored on debug BIOS.
BCLK Frequency
The BCLK Configuration menu contains the following options:
BCLK Source Config (default value: CPU BCLK; possible values: CPU BCLK)
CPU BCLK is only BCLK Source for ADL.
BCLK Frequency
The Thermal Configuration menu contains the following options:
Enable All Thermal Functions (default value: Enabled; possible values: Disabled, Enabled)
Enable All Thermal Functions" is Enabled it Enables 'Memory Thermal Management','Active Trip Points', 'Critical Trip Points'.Set to disabled for Manual Configuration
CPU Thermal Configuration (menu)
CPU Thermal Configuration options
Platform Thermal Configuration (menu)
Platform Thermal Configuration options
Intel(R) Dynamic Tuning Technology Configuration (menu)
Intel(R) Dynamic Tuning Technology Configuration options
Hardware Health Monitor (menu)
Monitor the Hardware Health.
The ACPI D3Cold settings menu contains the following options:
ACPI D3Cold Support (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable ACPI D3Cold support to be executed on D3 entry and exit
Note: Disable it would affect the Storage D3 setting
The ACPI Table/Features Control menu contains the following options:
ACPI Settings (menu)
System ACPI Parameters
FACP - RTC S4 Wakeup (default value: Enabled; possible values: Disabled, Enabled)
Value only for ACPI. Enable/Disable for S4 Wakeup from RTC
APIC - IO APIC Mode (default value: Enabled; possible values: Disabled, Enabled)
This item is valid only for WIN2k and WINXP.Also,a fresh install of the OS must occur when APIC Mode is desired.Test the IO ACPI by setting item to Enable.The APIC Table will then be pointed to by the RSDT,the Local APIC will be initialized,and the proper enable bits will be set in ICH4M
The Boot Configuration menu contains the following options:
Numlock (default value: Off; possible values: Off, On)
Selects Power-on state for Numlock
The Platform Settings menu contains the following options:
Charging Method (default value: Normal Charging; possible values: Normal Charging, Fast Charging)
Select charging method as Normal Charging or Fast Charging.
Scan Matrix Keyboard Support (default value: Enabled; possible values: Enabled, Disabled)
Enable Scan Matrix Keyboard Support
EC PECI Mode (default value: Legacy PECI mode; possible values: Legacy PECI mode, PECI over eSPI mode)
Switch eSPI PECI Mode or Legacy PECI mode
Power Loss Notification Feature (default value: Default; possible values: Disabled, Enabled, Default)
Enable/Disable Power Loss Notification Feature
Pmic Vcc IO Level (default value: Disable; possible values: Disable, 1.05V, 1.071V, 1.023V, 0.997V, 0.850V, 0.900V, 0.950V)
Select the Pmic Vcc IO Voltage Level
Pmic Vddq Level (default value: Disable; possible values: Disable, 0, 1, 2, 3, 4, 5, 6, 7)
Select the Pmic Vddq Voltage Level
CSC Pmic NVM Update Support (default value: Disabled; possible values: Enabled, Disabled)
Enable/Disable CastroCove Pmic Nvm Update
Pmic NVM Write Lock Support (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable WarrenCove/CastroCove Pmic Nvm Write Lock
Pmic SlpS0 VM Support (default value: Disabled; possible values: Disabled, Enabled)
Support to auto check Primium PMIC and disable SlpS0 voltage.
Power Sharing Manager (default value: Disabled; possible values: Disabled, Enabled)
Configure the PSM ACPI objects.
Enable FFU Support (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable FFU Support.
HID Event Filter Driver (default value: Enabled; possible values: Disabled, Enabled)
Enables/Disables HID Event Filter Driver interface to OS.
System Time and Alarm Source (default value: ACPI Time and Alarm Device; possible values: ACPI Time and Alarm Device, Legacy RTC)
Select source of system time and alarm functions. ACPI Time and Alarm (default, legacy RTC disabled) or Legacy RTC support only
DG Platform Support (default value: Add In Card; possible values: Add In Card, MB Down)
DG is supported as MotherBoard Down OR Add In Card
Enable PowerMeter
Intel Trusted Device Setup Boot (default value: Disabled; possible values: Enabled, Disabled)
Enables/Disables a Intel Trusted Device Setup Boot on the next boot
MPDT Support (default value: Disabled; possible values: Disabled, Sensor_BOM1, Sensor_BOM2, Sensor_BOM1 with Companion Chip)
Enable(Sensor_BOM1,Sensor_BOM2 and Sensor_BOM1 with Companion Chip)/Disable MPDT Support in BIOS
Closed Lid WoV LED Lighting Support (default value: Disabled; possible values: Disabled, Enabled)
Disables/Enables Closed Lid WoV LED Lighting Support.
System Firmware Update Config (menu)
Config settings for System Firmware Update (Capsule Update)
VTIO (menu)
Configure settings for VTIO
TCSS Platform Setting (menu)
Configure TCSS Platform Setting
The Connectivity Configuration menu contains the following options:
RFI Mitigation (default value: Enabled; possible values: Enabled, Disabled)
This is an option intended to Enable/Disable DDR-RFIM feature for Connectivity
This RFI mitigation feature may result in temporary slowdown of the DDR speed.
CoExistence Manager (read-only; possible values: Disabled, Enabled)
CoEx Manager mitigates radio coexistence issues between Intel WWAN (modem) and Intel WLAN (WiFi/BT).
This should be enabled only if both WWAN and WLAN solutions are based on Intel components
Preboot BLE (default value: Disabled; possible values: Disabled, Enabled)
This will be used to enable Preboot Bluetooth function
Discrete Bluetooth Interface (default value: USB; possible values: Disabled, USB)
SerialIo UART0 needs to be enabled to select BT interface
BT Tile Mode (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable Tile
Advanced settings (default value: Disabled; possible values: Disabled, Enabled)
Configure ACPI objects for wireless devices
WWAN Configuration (menu)
Configure WWAN related options
The OnLogic Feature Configuration menu contains the following options:
I225 LAN Controller (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable I225 LAN controller.
Wake on Lan (default value: Enabled; possible values: Enabled, Disabled)
Enable/Disable Wake on Lan
Pseudo G3 (default value: Disabled; possible values: Enabled, Disabled)
Enable/Disable Pseudo G3.
If Pseudo G3 is enabled, "Advanced > PCH-IO Configuration > DeepSx Power Policies" will be set to "Enabled in S4/S5" in the next boot automatically.
The Console Redirection menu contains the following options:
Console Serial Redirect (default value: Enabled; possible values: Enabled, Disabled)
Enable Console Redirection Function
The Debug Settings menu contains the following options:
Kernel Debug Serial Port (default value: Legacy UART; possible values: Legacy UART, SERIALIO UART0)
Select Kernel Debug Port and report in ACPI DBG2 table
Kernel Debug Patch (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable Kernel Debug Patch
Debug Token is present
Debug Token is present
Platform Debug Consent (default value: Disabled; possible values: Disabled, Enabled (All Probes+TraceHub), Enabled (Low Power), Manual)
Enabled(All Probes+TraceHub) supports all probes with TraceHub enabled and blocks s0ix
Enabled(Low Power) Tracehub is powergated by default, s0ix is viable
Manual:user needs to configure Advanced Debug Settings manually, aimed at advanced users
VT-d Debug Settings (menu)
Vt-d Debug Settings
Advanced Debug Settings (menu)
Advanced Debug Settings
The Functional Safety Configuration menu contains the following options:
Fusa Enable (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable all Functional Safety (FUSA) feature
Enable Startup Array BIST (default value: Disabled; possible values: Disabled, Enabled)
Enabling this will execute startup array test during boot
Enable Startup Scan BIST (default value: Disabled; possible values: Disabled, Enabled)
Enabling this will execute startup scan test during boot
Enable Periodic Scan BIST (default value: Disabled; possible values: Disabled, Enabled)
Enabling this will execute periodic scan test during boot
Core Lockstep Configuration (default value: Disable lockstep; possible values: Disable lockstep, Enable lockstep for Core 0 with Core 1, Core 2 with Core 3, Enable lockstep for Core 0 with Core 1, Enable lockstep for Core 2 with Core 3)
Enable/Disable Lockstep for Efficient-core module, which has 4 cores each
Core Lockstep Configuration (default value: Disable lockstep; possible values: Disable lockstep, Enable lockstep for Core 0 with Core 1, Core 2 with Core 3, Enable lockstep for Core 0 with Core 1, Enable lockstep for Core 2 with Core 3)
Enable/Disable Lockstep for Efficient-core module, which has 4 cores each
Display Fusa Configuration (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Functional Safety (FUSA) on Display
Graphics Fusa Configuration (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Functional Safety (FUSA) on Graphics
Opio Fusa Configuration (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Functional Safety (FUSA) on Opio
Psf Fusa Configuration (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable Functional Safety (FUSA) on Psf
Iop Fusa Configuration (default value: Enabled; possible values: Disabled, Enabled)
Enable/Disable Functional Safety (FUSA) on Iop
The Security menu contains the following options:
Current TPM Device (read-only; possible values: Not Detected, TPM 1.2, TPM 2.0)
Current TPM Device: TPM1.2, or TPM2.0.
TPM Active PCR Hash Algorithm (read-only)
TPM Active PCR Hash Algorithm: SHA1, SHA256, SHA384, SHA512, SM3_256
TPM Hardware Supported Hash Algorithm (read-only)
TPM Hardware Supported Hash Algorithm: SHA1, SHA256, SHA384, SHA512, SM3_256
BIOS Supported Hash Algorithm (read-only)
BIOS Supported Hash Algorithm: SHA1, SHA256, SHA384, SHA512, SM3_256
TrEE Protocol Version (default value: 1.1; possible values: 1.0, 1.1)
TrEE Protocol Version: 1.0 or 1.1
TPM Availability (default value: Available; possible values: Available, Hidden)
When Hidden, don’t exposes TPM to OS
Supervisor Password (read-only)
The Power menu contains the following options:
Wake on PME (default value: Enabled; possible values: Disabled, Enabled)
Determines the action taken when the system power is off and a PCI Power Management Enable wake up event occurs.
Auto Wake on S5 (default value: Disabled; possible values: Disabled, By Every Day, By Day of Month)
Auto wake on S5, By Day of Month or Fixed time of every day
The Boot menu contains the following options:
Boot Type (default value: UEFI Boot Type; possible values: Dual Boot Type, Legacy Boot Type, UEFI Boot Type)
Select boot type to Dual type, Legacy type or UEFI type
Quick Boot (default value: Enabled; possible values: Enabled, Disabled)
Allows InsydeH2O to skip certain tests while booting. This will decrease the time needed to boot the system.
Quiet Boot (default value: Enabled; possible values: Enabled, Disabled)
Disables or enables booting in Text Mode.
Network Stack (default value: Disabled; possible values: Disabled, Enabled)
Network Stack Support:
Windows 8 BitLocker Unlock
UEFI IPv4/IPv6 PXE
Legacy PXE OPROM
PXE Boot capability (default value: Disabled; possible values: Disabled)
Disabled : Support Network Stack
UEFI PXE : IPv4/IPv6
Legacy : Legacy PXE OPROM only
Power Up In Standby Support (default value: Disabled; possible values: Enabled, Disabled)
Disable or enable Power Up In Standby Support.
The PUIS feature set allows devices to be powered-up into the Standby power management state to minimize inrush current at power-up and to allow the host to sequence the spin-up of devices.
USB Boot (default value: Enabled; possible values: Enabled, Disabled)
Disables or enables booting to USB boot devices.
EFI Device First (default value: Enabled; possible values: Disabled, Enabled)
Determine EFI device first or legacy device first. If enable, it is EFI device first. If disable, it is Legacy device first.
UEFI OS Fast Boot (default value: Enabled; possible values: Enabled, Disabled)
If enabled the system firmware does not initialize keyboard and check for firmware menu key.
USB Hot Key Support (default value: Disabled; possible values: Disabled, Enabled)
Enable/Disable to support USB hot key while booting. This will decrease the time needed to boot the system.
Timeout (default value: 3; possible values: numbers between 0 and 10)
The number of seconds that the firmware will wait before booting the original default boot selection.
Automatic Failover (default value: Enabled; possible values: Disabled, Enabled)
Enable: if boot to default device fail, it will directly try to boot next device.
Disable: if boot to default device fail, it will pop warning message then go into firmware UI.
The exit screen provides options to leave the setup utility and to load and save settings.
Exit Saving Changes: saves the current configuration and restarts the system to apply it
Save Change Without Exit: saves the current configuration but does not restart the system
Exit Discarding Changes: returns to the front page without saving or applying the current configuration
The Intel AMT configuration utility is password-protected. By default, the password is “admin”, but it must be changed immediately. A strong password using upper- and lower-case letters, symbols, and numbers is required.
F5/F6 change the selected option to its previous or next value
Esc returns to the previous menu
F9 restores all options to their factory default values
F10 saves all options and restarts the system
Administer Secure Boot: opens a menu which manages the Secure Boot configuration of the system
Setup Utility: opens the BIOS setup utility
MEBx: opens the Intel AMT configuration utility
Load Custom Defaults: loads a previously saved custom configuration
Save Custom Defaults: saves the current configuration so it can be loaded later
Discard Changes: restores the current configuration to its original state
Revision History
Date
Version 1.20
1/17/2023








The OnLogic HX511 expands on the Helix product range, and leverages Intel® 12th generation Alder Lake PS processing into a powerful fanless system.
The HX511 offers increased compute power and visual processing capabilities, encased in Hardshell™ Fanless Technology. Additionally, it offers optional expansion options via reliable, cableless add-on cards. With quad video output, a wide power range, and high processing power, the HX511 is equipped to handle a wide variety of applications.
Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.
Modification of the device may void certifications, warranty and/or cause possible injury to the user.
Care must be taken handling the device to prevent injury to self or possibility of damaging the unit.
Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.
La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures à l'utilisateur.
Des précautions doivent être prises lors de la manipulation de l'appareil pour éviter de se blesser ou d'endommager l'appareil.
4x Rubber Feet
If you purchased additional items such as mounting brackets, power supplies or terminal block connectors, they will be located in the system box or within the outer shipping carton.
All drivers and product guides can be found on the corresponding product page. For more information on accessories and additional features, visit the HX511 product page at .
The front power button can be used to turn on and off the Helix system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset of the system. The system can be woken by a single press of the power button from any state.
The LED backlight will indicate the system status. A solid blue light indicates that the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.
A 3FF Subscriber Identity Module (SIM) card slot is present on the front panel of the Helix platform allowing native support for OnLogic 4G LTE modules. The SIM signals are connected to the M.2 B-Key internal expansion slot.
The SIM slot is a Push-Push type receptacle. To insert the SIM card into the front panel of the Helix platform, please use a small implement to push the card into the slot until it clicks. To remove the card, push with a small implement until the card clicks, then pull on the free end of the card to remove it.
There are four USB 3.2 Gen 2 ports on the front panel of the Helix platform. These ports are capable of linking at 10Gb/s transfer rates.
Thunderbolt™ 4
There are two Thunderbolt 4 ports on the front panel of the HX511. These ports are capable of linking at up to 40Gb/s transfer rates.
Power output up to 5V/3A for the first port and 5V/1.5A for the second port. Power will be allocated on a first-come first-serve basis between the first and second ports.
Up to 40 Gb/s data transfer rate in Thunderbolt Alt Mode
DisplayPort 1.4 compliant in DisplayPort Alt Mode
Note: Type-C power sink mode is not supported on Helix 511.
The Helix 511 platform supports an optional Isolated Digital I/O add-in card (OnLogic HX511-DIO). This option allows for interfacing of the Helix 511 with existing PLC integrations or other digital logic applications. For a complete explanation of features, operating voltages, and safety information, please refer to the DIO expansion manual on the OnLogic support site.
Each port’s serial mode and voltage between Off/5V/12V on Pin “9” is individually selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the for configuration instructions.
Power and Reset switch connectors are provided for use with momentary-contact switches making a connection between each signal and ground. Power and disk activity LED connections are provided to directly or indirectly drive indicator LEDs. Both provided signals are 5V sourced through a 330Ω resistor.
Helix utilizes Intel® Integrated processor graphics that power the onboard DisplayPorts. This means resolutions up to 4096x2304 @ 60Hz are supported on both outputs simultaneously. All ports support Multi-Stream Transport (MST).
The first LAN Port on Helix 511 supports up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by the two LEDs enclosed in the port. The description is included below.
The second Intel I225 LAN Port on Helix supports up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. This port also features Intel’s vPro® technology enabling remote out-of-band management and security features (requires Intel Core™ i5 or higher). The LAN link state is shown by the two LEDs enclosed in the port. The description is included below.
LAN activity light description
The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2 ports, capable of linking at 10Gb/s transfer rates.
The serial port mode and voltage between Off/5V/12V on Pin 9 on Helix can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the for configuration instructions.
The CAN port on Helix 511 supports CAN2.0 A/B at baud rates from 100-1000 kbaud. The system CAN port is not internally terminated, and a properly terminated (120 Ohms, typical) cable should be used. CAN messages may be sent and received via a virtual serial port over USB. Windows and Linux drivers are in-box for this interface.
Mainboard power is applied to the Helix 511 through a 4-pin terminal block connector (Mating part: Dinkle 2ESDAM-04P, OnLogic CBPW159, or equivalent).
The system is operational from 12V~24V. [see section 2.4 for input voltage qualifications]. The maximum rated current of the connector is 15A per pin. Use a wire gauge that is rated for the operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal block with tinned wire ends or solid core wire. See below for connector pinout.
When using the remote switch connections with the terminal block option, mating power switch cables should be a twisted-pair wire with floating shield to assure proper immunity to EMI/RFI. It is recommended to keep wires at less than 3 meters in length. Switches should be momentary contact type only.
For pinout details, reference the located within I/O Definitions.
An M.2 B-Key port is present on the Helix 511 motherboard to allow support for B-Key form-factor expansion cards. Supported cards include 3042, 3052, 2280 form-factors. The B-Key connector supports PCIe Gen 4 x2, USB 3.2 10Gb/s, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.
The 3FF Micro SIM card slot is connected to the M.2 B-Key.
An M.2 E-Key port is present on the Helix 511 motherboard to allow support for E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe Gen 3 x1 and USB 2.0.
An M.2 M-Key port is present on the Helix 511 motherboard to allow support for M-Key form-factor expansion cards. Only 2280 form-factor cards are supported. The M-Key connector includes support for PCIe Gen 3 x4, PCIe Gen 3 x2, PCIe Gen 4 x4, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.
The Helix 511 has two onboard DDR5 SO-DIMM slots with the following specifications:
Maximum Capacity: DDR5-4800 64GB with two 32GB SO-DIMM Modules
Channel configuration: 1 DIMM Per Channel (DPC) - 2 Channels
No ECC Support
If the BIOS needs to be updated, please refer to the for reflashing instructions.
A board mounted button is used to clear the BIOS settings of the Helix 511.
The RTC (Real Time Clock) battery on the Helix 511 is used to retain BIOS CMOS settings and maintain the real-time clock for the system. If the RTC battery is low, BIOS settings will not be retained and you may receive an alert in the operating system. The cabled RTC battery should be replaced with a Maxell CR2032-WK11 (or UL listed equivalent). An equivalent battery shall use a Hirose DF13-2S-1.25c connector to mate with the on-board connector.
The Helix 511 has a power header that can support up to 2A of 5V and 12V power. This header is designed for internal expansion cards that require additional power above what is provided by the expansion slots. This header is a 2.5mm Pitch 4-pin JST XH Connector, with the pinout shown below.
The LGA1700 CPU socket on the Helix 511 supports all 12th Gen Intel PS-series processors up to 45W TDP.
The power consumption of the Helix 511 was measured for various system configurations, workloads, and power states at both 12V and 24V system input voltages. Tests were performed using Prime 95, Furmark, and Burnintest v9.0 build 1012 to stress system components. These tests were performed with Intel Turbo Boost Enabled. The build configurations and power consumption are listed in the tables below. The power consumption listed below is the average power draw over a 5 minute window from the test starting. This includes a brief period of PL2 power consumption (previously Intel turbo Boost) where the power consumption is much larger than the listed average. The highest power consumption seen during the period of turbo PL2 is shown at the bottom of each table.
*The configurations below are using representative samples of internal devices, the specific components mentioned below may vary from the devices provided by OnLogic.
The power consumption for each system configuration is recorded below.
The Helix platform supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters.
These DC levels specified are the absolute max values for the pins for function and safety of the system. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.
An optional CAN add-in card is available. The add-in card has an NXP i.MX1050-series microcontroller that can communicate with the host processor over USB. The card provides an interactive shell for configuration on a virtual COM port, and two CAN interfaces accessible through two additional virtual COM ports.
The add-in card is configured interactively through its shell using a serial terminal emulator program. The shell is accessed differently depending on operating system.
Open Device Manager by pressing Win+X M. Open the “Ports (COM & LPT)” menu.
Note the “COM#” numbers on each port listed. The shell is typically the lowest-numbered “USB Serial Device” port. The first and second CAN interfaces typically have higher port numbers.
Download and install PuTTY from the link above.
Install picocom, e.g. “sudo apt install picocom” on Ubuntu.
Open the shell’s virtual COM port with picocom by running “picocom /dev/serial/by-id/usb-OnLogic_USB-CAN-*-if00”.
Some Linux distributions may not configure udev to produce by-id links. If those links are missing, try /dev/ttyACM0 and similar devices.
Once the shell is open, type “help” for usage information. A description of available shell commands can also be found .
On Linux, the slcand utility can configure the add-in card’s interfaces as a regular SocketCAN network interface. Make sure the interface is configured for slcan usage by entering “set can-mode VCAN1 slcan” (and similar for “VCAN2”) in the shell.
On most Linux distributions, slcand is part of a package called can-utils; on Ubuntu, it can be installed with “sudo apt install can-utils”. Once installed, start the utility by running e.g. “slcand -oc -s6 /dev/serial/by-id/usb-OnLogic_USB-CAN-*-if02 slcan0” to create a SocketCAN interface named slcan0 running at 500k (“-s6”) from the first CAN interface’s virtual COM port.
The slcan message format is widely supported. High-quality libraries are available for most programming languages that handle the details of the protocol. It can also be implemented manually if needed.
The slcan protocol is stateful; each interface needs to be configured and opened before it can be used, and must be closed before it can be reconfigured. Make sure the interface is configured for slcan usage by entering “set can-mode VCAN1 slcan” (and similar for “VCAN2”) in the shell.
Each CAN interface has a corresponding virtual COM port. Commands are sent on that port to configure the interface and send frames. Each command consists of an ASCII letter, optionally followed by other ASCII text, ending with a newline (“\n”) character.
The interface baudrate is set with the “S” command. Nine baudrates are supported:
Once the baudrate is set, the interface should be opened by sending the open command (“O\n”). Once open, frames can be sent to the microcontoller in the format documented in . As frames arrive, the microcontroller will send messages back on the virtual COM port. To stop it, close the interface with the close (“C\n”) command.
The legacy “std” message format is supported for backwards compatibility with other devices, but is not recommended for new development. The standard slcan format should be used instead due to the availability of high-quality tools and libraries for working with that message format in most programming languages.
An optional DIO add-in card is available. The add-in card has an NXP i.MX1050-series microcontroller that can communicate with the host processor over USB. The card provides an interactive shell for configuration on a virtual COM port.
Supported VIN/Input/Output Voltage: 5-48V
The DIO is optically isolated, meaning that the terminal is separated from other motherboard features for protection. The DIO terminal requires external power from a 5~48V DC source through Pin 20 with GND to Pin 19 in order to function.
The Isolated Power Supply (ISO PSU) can be a voltage source from 5~48V to interface with external digital IO. The maximum power draw from the supply should not exceed 0.6A under normal operating conditions. Individual DOut pins will be damaged by loads in excess of 150mA. The ISO PSU must be a DC Limited Power Source (LPS) power supply.
Open Device Manager by pressing Win+X M. Open the “Ports (COM & LPT)” menu.
Note the “COM#” numbers on each port listed.
Download and install PuTTY from the link above.
Open PuTTY. When prompted, enter the COM port number in the “Serial line” text box, then click “Open”.
Install picocom, e.g. “sudo apt install picocom” on Ubuntu.
Open the shell’s virtual COM port with picocom by running “picocom /dev/serial/by-id/usb-OnLogic_DIO-*-if00”.
Some Linux distributions may not configure udev to produce by-id links. If those links are missing, try /dev/ttyACM0 and similar devices.
Once the shell is open, type “help” for usage information. A description of available shell commands can also be found .
While the microcontroller shell is intended for human interaction, it can be used to programmatically control the MCU. To avoid a number of pitfalls when doing so, observe the following best practices:
On Linux, use the symlinked device nodes inside /dev/serial/by-id instead of hardcoding /dev/ttyACMx device names. /dev/ttyACMx numbering is
unstable; /dev/serial/by-id/usb-OnLogic_<device>-if00 will reliably point to the terminal interface.
Connection Diagrams
● Temperature Range: 0ºC to 50°C
● Step size: 10°C
● i7 Processor loaded @80% PTAT, 1TB SSD, and 64GB DDR5 RAM loaded @ 80% with
BurnInTest 9.2
Thermal testing of the Helix 511 was completed using a thermal chamber to control ambient environmental temperature across the rated temperature range of the system. Throughout testing, the system and its components were being stressed by various softwares to simulate a rigorous constant workload. Stress testing occurred for two hours in each temperature range. Components were monitored during testing via their internal sensors. Some components were monitored externally via thermocouples.
The Helix 511 with i7-12800HL processor saturated upwards of its rated base clock speeds on performance and efficiency cores while sustaining significant processor, memory and storage stress loads through an ambient temperature range of 0-50C.
The Helix 511 has optional Wall Mount brackets (SKU : MTW101) and DIN Rail mounting brackets (SKU : MTW101-K) available for purchase.
For Wall Mounting, follow steps below :
Step 1: Align the four screw holes on the bottom of the system with the respective holes on the mounting brackets.
Step 2: Attach wall mounting brackets (MTW101) to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).
Step 3 : Install system to surface using keyhole slots on wall mount brackets and appropriate hardware for the surface (not provided).
For DIN Rail Mounting, follow the below steps:
Step 1: Follow steps 1-2 from the Wall Mounting section.
Step 2: Align the mounting holes of the din clip bracket to the three mounting holes on the wall mount bracket.
Step 3: Install the din clips to the wall mount brackets using supplied screws and a Phillips head screwdriver (tighten gently as screws are threading into plastic).
Step 6: Mount system onto the DIN rail.
Note: The mounting brackets are required to support 3x the hanging weight of the system (14.82lbs / 6.72 kgs). The mating surface and hardware must be capable of supporting the same load.
The Helix 511 has an optional VESA mounting bracket (SKU : VMPL-2022-K) available for purchase. Follow the steps below for mounting.
Step 1: Align the four screw holes on the bottom of the system with the respective holes on the mounting bracket.
Step 2: Attach VESA Mount Plate, to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long)
Step 3: Install the system to VESA 75 or VESA 100 mounting pattern using provided VESA Mount screws.
The mounting bracket systems are required to secure 3x the hanging weight of the computer system (14.82lbs / 6.72 kgs). The mating substrate must be capable of maintaining the same rating.
Properly opening OnLogic systems does not void the warranty in most cases, however, some precautions are necessary to avoid damaging the system.
Perform this disassembly in an area free of static discharge.
Disconnect power, video, and any other connections to the system. It should be fully unplugged.
Ideally, wear a grounding strap. If that is not available, regularly touch a grounded metal surface to discharge your body of static electricity.
Begin by removing the 4x Phillips P2 screws circled in orange. * You will need to remove any mounting hardware from the bottom of the system
Remove the bottom plate. You can use a thin tool such as a flathead screwdriver to help with this.
You now have access to the motherboard.
For complete details on all configurable firmware settings, please reference the .
Reference our guide for installation instructions.
Drivers are available in INF formats, which can be installed via a Windows deployment server, or through the Device Manager. Reference our guide for Installing via Device Manager.
Intel AMT is supported on select processor SKUs that meet requirements for vPro support:
i7-12800HL
i5-12600HL
AMT Configuration is managed from outside the BIOS setup menu by pressing DELETE at the system boot screen and selecting “MEBx Configuration”
For detailed configuration options, see the HX511 .
Intel VMD may be used to configure software RAID for supported Windows operating systems.
VMD is supported on all processor SKUs. VMD must be enabled from the BIOS setup menu, and then may be configured from the RST setup menu by pressing DELETE at the system boot screen and choosing “Device Management.”
For detailed configuration options, see the HX511 .
RAID volumes can be configured and created via the BIOS or from an operating system (OS).
If an operating system is to be installed on to a RAID volume, the processes outlined in this section must be followed in order to appropriately enable RAID and create the RAID volume where the OS will be deployed.
This section will outline the process for creating RAID volumes outside of the OS via the BIOS.
Enabling VMD Configuration
Prior to configuring or creating any RAID volumes using Intel® Rapid Storage Technology, Intel® Volume Management Device (VMD) must be appropriately configured/enabled.
From UEFI System Setup, navigate to Advanced → VMD Configuration → and set Enable VMD Controller to Enabled.
Next, configure the VMD Enabled devices to be enabled:
For SATA RAID: Above the “Root Port BDF Details value” of SATA Controller, set the “Map this Root Port under VMD” to Enabled
For NVMe RAID: Above the “Root Port BDF Details value” of XX/YY/ZZ, set the “Map this Root Port under VMD” to Enabled (each root port corresponds to an NVMe drive)
Alternatively, “Enable VMD Global Mapping” can be set to Enabled for all attached storage devices.
Press F10 to Save and Exit. The system will then reboot.
Creating a RAID Volume in BIOS
After enabling VMD, reboot and enter UEFI System Setup Front Page (F2 or DEL).
Navigate to Device Management -> Intel Rapid Storage Technology.
The available Physical Disks should be listed under Non-RAID Physical Disks:
Select Create RAID Volume
Assign a Name and select the RAID Level (e.g., RAID 0, 1, 5, 10).
Select the disks to include in the volume by marking them with an X.
Select Create Volume.
Reboot the system and verify that the RAID array has been detected by the operating system or OS installation media.
If the system fails to power on or otherwise function, clearing the CMOS may help restore it to a working state.
Unplug the system from all power and peripherals and perform the disassembly steps above.
Locate the CMOS CLEAR button located near the power button
Depress the button with a flathead screwdriver, fingernail, or similar object for at least 30 seconds
The CMOS is now clear. Reassemble and power the unit back on. It may reboot multiple times before resuming normal operation.
Overview
Description
Audio output over DisplayPort for HX511 products running Ubuntu 22.04 is currently unsupported due to kernel driver incompatibility.
There is no line-out or headphone jack present on this product. Customers who require audio support on the HX511 may consider an external USB-audio adapter.
Resolution
OnLogic is working with upstream partners to enable. New software will be available when enablement is complete.
The computer system was evaluated for medical, IT equipment, automotive, and maritime EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing includes: EN 55032, EN 55035, IEC 60601-1, EN 62368-1, EN 60950-1, and IEC 60945. Product safety was evaluated to IEC 62368-1 and IEC 60950-1.
This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
CAN ICES-003(A) / NMB-003(A)
The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.
This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI). If this equipment is used in a domestic environment, radio interference may occur, in which case the user may be required to take corrective actions.
For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information.
Board Dimensions
8.7" x 6.1"
221 x 156 mm
CPU (on solder side of board)
Socket LGA 1700 - Alder Lake PS
PCH
PS Integrated
Memory
2 x SO-DIMM DDR5 (2 x 32GB max Dual Channel) 64 GB Total
LAN Controller
1x Intel i225-LM -with AMT
1x Intel I225-IT
Expansion
1x M.2 2280/3042/3052 B-Key (PCIe x2, USB 3.2 5Gb/s, SATA III)
1x M.2 2230 E-key (Wi-Fi) (PCIe / USB 2.0)
1x M.2 2280 M-key (PCIe x 4, SATA III)
Back I/O
2x Full size DisplayPort 1.4 2x Gb LAN (2 x Intel)
2x USB 3.2 10 Gb/s
4-pin Terminal Block (12 ~ 24 V input)
Optional dual CAN card
Optional single COM (RS-232/422/485) card
Front I/O
1x Power button with LED indicator
1x 3FF-Sim slot (Mapped to the B-Key)
4x USB 3.2 10Gb/s
Optional 3 COM (RS-232/422/485) add-in card
Optional DIO add-in card
2x Thunderbolt 4 (40 Gb/s) USB Type C
Onboard Headers & Connectors
1x Battery on a cable
1x internal power header (5V, 12V)
Voltage Input
12~24V
Power Input
4-pin Terminal Block (supports remote switch)
BIOS
Insyde
Operating Systems
Windows 10 IOT 2021 LTSC, Ubuntu 22.04 LTS, Yocto, Window 11
Special Features
Watchdog timer
RTC
PTT in BIOS
On-board TPM 2.0
Support for Vision Processing Units
Support for 4G LTE and GPS expansion cards
TPM (Infineon SLB9672)
Thermal Standards (Subject to change through RFI and RFQ steps)
System Operating Temperature: 0-50C
Storage Temperature: -10-85C
Operating Humidity: 0% - 90% (non-condensing)
Extra Chassis Features
6 Antenna holes
Wall Mount
DIN Rail Mount
VESA Mount
Regulatory Certifications
FCC 47 CFR Part 15 Subpart B (Class A)
EN 60950-1 & EN 63268-1
CISPR 32/EN 55032
CISPR 35/EN 55035
Radio Equipment Directive (2014/53/EU)
WEEE Directive (2012/19/EU)
RoHS 3 (2015/863/EU)
IEC 60601-1-2, 4th ed. - EMC Ready
EN 60945, 4th ed.
IEC/UL/EN 62368-1
RF output power
20 dBm (2400-2485 MHz) IEEE 802.11b/g/n & BT
10 dBm (2400-2485 MHz) BLE
23 dBm (5150-5725 MHz) IEEE 802.11a/n/ac
13.98 dBm (5725-5875 MHz) IEEE 802.11a/n/ac
Type of Modulation
2.4 GHz: DSSS/OFDM/FHSS
5 GHz: OFDM
Type of Antenna
Reference antenna is PIFA type (2 dBi/2 dBi gain)
Modes of operation
Duplex (Tx/Rx)
Duty cycle (access protocol)
As In: IEEE 802.11a/b/g/n/ac
Galileao Receiver
Operating frequency range: 1559 - 1610 MHz
QZSS Receiver
Operating frequency range: 1559 - 1610 MHz
GSM 900
Operating frequency range: 880 - 915 MHz, 925 - 960 MHz Maximum output power: 33dBm rated
GSM 1800
Operating frequency range: 1710 - 1785 MHz, 1805 - 1880 MHz Maximum output power: 30dBm rated
WCDMA Band 1
Operating frequency range: 1920 - 1980 MHz, 2110 - 2170 MHz Maximum output power: 24dBm rated
WCDMA Band 8
Operating frequency range: 880 - 915 MHz, 925 - 960 MHz Maximum output power: 24dBm rated
LTE FDD Band 1
Operating frequency range: 1920 - 1980 MHz, 2110 - 2170 MHz Maximum output power: 23dBm rated
LTE FDD Band 3
Operating frequency range: 1710 - 1785 MHz, 1805 - 1880 MHz
Maximum output power: 23dBm rated
LTE FDD Band 7
Operating frequency range: 2500 - 2570 MHz, 2620 - 2690 MHz Maximum output power: 23dBm rated
LTE FDD Band 8
Operating frequency range: 880 - 915 MHz, 925 - 960 MHz
Maximum output power: 23dBm rated
LTE FDD Band 20
Operating frequency range: 832 - 862 MHz, 791 - 821 MHz Maximum output power: 23dBm rated
LTE FDD Band 28A
Operating frequency range: 703 - 733 MHz, 758 - 788 MHz
Maximum output power: 23dBm rated
LTE FDD Band 38
Operating frequency range: 2570 - 2620 MHz Maximum output power: 23dBm rated
LTE FDD Band 40
Operating frequency range: 2300 - 2400 MHz Maximum output power: 23dBm rated
E-GSM
Operating frequency range: 880 - 915 MHz Maximum output power: 33dBm rated
DCS
Operating frequency range: 1710 - 1785 MHz Maximum output power: 30dBm rated
1 x 8GB DDR5 SO-DIMM 4800MT/S
Transcend TS1GSA64V8G
2 x 16GB DDR5 SO-DIMM 4800MT/S
Transcent TS2GSA64V8E
2 x 32GB DDR5 SO-DIMM 4800MT/S
Transcend TS4GSA64V8E
LAN
[1 port linked at full speed]
[1 port linked at full speed]
[2 port linked at full speed]
Storage #1 M.2 M-Key
Samsung 980 Pro
1000GB Gen4
NVMe SSD
Samsung 980 Pro
1000GB Gen4
NVMe SSD
Samsung 980 Pro
1000GB Gen4
NVMe SSD
M.2 B-Key
Transcend TS512GMTS952T2
500GB
SATA Gen3 SSD
M.2 E key
Intel 9260NGW
Intel 9260NGW
Intel 9260NGW
Serial port
3xCOM
Expansion Port 1
DIO
DIO
Expansion Port 2
COM
COM
USB
Port 1: N/A
Port 2 : N/A
Port 3 : N/A
Port 4: Mouse & Keyboard
Port 1: N/A
Port 2 : N/A
Port 3 : N/A
Port 4: Wireless
Mouse & Keyboard
Port 1: N/A
Port 2 : N/A
Port 3 : N/A
Port 4: Wireless
Mouse & Keyboard
Thunderbolt
Port 1: N/A
Port 2: N/A
Port 1: N/A
Port 2: N/A
Port 1: TBT 4 dock connected (idle)
Port 2: N/A
Display
One Monitor
One Monitor
One Monitor
OS
WIndows 11 Pro 64 Bit
WIndows 11 Pro 64 Bit
WIndows 11 Pro 64 Bit
OS Power Plan
Balanced
Balanced
Balanced
BIOS Version
1.18
1.18
1.18
Deep S5
0.11
0.26
S5
1.6
2
S3
2.7
3.1
OS Idle
6.7
8.7
CPU / System stress
27.3
28
CPU + GPU / System stress
27.8
29.9
Max turbo draw
79.7
85.7
Medium Config Measurements
Power Consumption
12V Avg [W]
24V Avg [W]
Pseudo G3
0.05
0.135
Deep S5
0.11
0.26
S5
1.6
2
S3
3.2
3.6
OS Idle
7.9
10.2
CPU / System stress
65.7
70.7
CPU + GPU / System stress
66.1
67.8
Max turbo draw
123
121
High Config Measurements
Power Consumption
12V Avg [W]
24V Avg [W]
Pseudo G3
0.05
0.135
Deep S5
0.11
0.26
S5
2.4
2.9
S3
4.2
4.5
OS Idle
12.4
12.9
CPU / System stress
70
74
CPU + GPU / System stress
68.6
72
Max turbo draw
139.7
140
USB
S3
RTC Wake set by BIOS
Deep S5, S5, S3
Must be enabled in BIOS
RTC Wake set by OS
S3
If the port number was correct, a “uart:~$” prompt should appear. If not, try a different port.
If the port number was correct, a “uart:~$” prompt should appear. If not, try a different port.
stty -F /dev/serial/by-id/<device> -echo beforeinteracting with the shell. Most serial libraries (pyserial, serialport-rs, etc.) will automatically disable this flag.
When sending a command, precede it with a ‘\x03’ byte to clear the terminal’s line buffer and ensure that the command is interpreted correctly. Follow the command with a ‘\r’ or ‘\n’ character to execute the command.
Send less than 64 bytes at a time. To send longer commands, explicitly flush the port’s output buffer in between each block of 64 bytes.
Severity:
Low
Updated LAN numbering
03/25/2025
Read the entire manual before using the product.
Install the device securely per users manual instructions.
To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.
Wall or ceiling mounting device requires use of OnLogic mounting plate or bracket.
Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom or rear of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.
Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or enclosure during operation and 30 minutes after shutdown allowing the unit to cool down.
Ambient operating temperature must be between 0 °C to 50 °C with a non-condensing relative humidity of 10-85%.
The device can be stored at temperatures between -10 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, minimum 3HR.
Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.
Do not clean the device with liquids. The chassis can be cleaned with a dry cloth or duster only. To prevent injury to self and/or damage to the device the unit must be powered down and all connecting power and other peripherals shall be disconnected prior to cleaning.
Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then recommended device orientation is such that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.
This device is intended for indoor operation only.
Caution, Risk of Electric Shock! Unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!
To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC, see specs for details.
Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.
Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.
Install the device only with shielded network cables.
The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.
Radio device is not intended for emergency service use.
Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.
Proper disposal of CMOS battery must comply with local governance.
Product must only be connected to a certified router, switch or similar network equipment
Product is intended for indoor use only.
Product cannot be connected to the public network.
This equipment is not suitable for use in locations where children are likely to be present.
WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.
Lisez l'intégralité du manuel avant d'utiliser le produit.
Installez l'appareil en toute sécurité selon les instructions du manuel de l'utilisateur.
Pour vous protéger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes double bande fournies avec un gain de 2 dBi/2 dBi.
Le dispositif de montage mural ou au plafond nécessite l'utilisation d'une plaque ou d'un support de montage. La plaque ou le support doit être en métal et avoir une épaisseur minimale de 1 mm.
Utilisez des vis à tête plate M4x0,5 mm pour fixer la plaque de montage ou les supports de montage aux trous filetés au bas ou à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support au-delà de 1,5 mm.
Attention surface chaude! Il est normal que l'appareil chauffe et soit chaud au toucher. Ne touchez pas la zone du dissipateur thermique ou le boîtier pendant le fonctionnement et 30 minutes après l'arrêt pour permettre à l'unité de refroidir.
La température ambiante de fonctionnement doit être comprise entre 0 °C et 50 °C avec une humidité relative sans condensation de 10 à 85 %.
L'appareil peut être stocké à des températures comprises entre -10 °C et 85 °C. Remarque : L'unité doit être stabilisée à la température de fonctionnement avant utilisation, minimum 3 heures.
Gardez l'appareil à l'écart des liquides et des matériaux inflammables. Ne pas installer dans un environnement dangereux.
Ne nettoyez pas l'appareil avec des liquides. Le châssis peut être nettoyé uniquement avec un chiffon sec ou un plumeau. Pour éviter de se blesser et/ou d'endommager l'appareil, l'appareil doit être éteint et toutes les alimentations et autres périphériques doivent être déconnectés avant le nettoyage.
Prévoyez un espace suffisant autour de tous les côtés de l'appareil pour un refroidissement correct et pour ne pas dépasser sa limite de température de fonctionnement maximale. Si l'appareil est monté sur une surface verticale, l'orientation recommandée de l'appareil est telle que les ailettes du dissipateur thermique permettent à l'air de monter sans obstruction. Des orientations alternatives peuvent entraîner une plage de températures de fonctionnement réduite.
Cet appareil est destiné à une utilisation en intérieur uniquement.
Attention, risque de choc électrique ! L'unité est alimentée uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) à l'appareil !
Pour alimenter l'appareil, utilisez uniquement des alimentations externes répertoriées UL ITE avec une sortie CC de 12-24 VCC, voir les spécifications pour plus de détails.
Les méthodes de câblage utilisées pour le raccordement de l'équipement à l'alimentation secteur doivent être conformes au Code national de l'électricité, NFPA 70, et au Code canadien de l'électricité, Partie I, CSA C22.1.
Prévoyez suffisamment d'espace pour les connexions de câblage du bornier afin que les fils ne se plient pas et soient protégés contre les dommages accidentels.
Installez l'appareil uniquement avec des câbles réseau blindés.
L'installateur doit avoir de l'expérience dans l'installation de pièces de rechange et être familiarisé avec les pratiques générales d'installation de composants électroniques.
L'appareil radio n'est pas destiné aux services d'urgence.
L'entretien et la réparation de l'appareil doivent être effectués par un personnel qualifié. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être du même type que celle d'origine.
L'élimination appropriée de la batterie CMOS doit être conforme à la gouvernance locale.
Le produit doit uniquement être connecté à un routeur, un commutateur ou un équipement réseau similaire certifié
Le produit est destiné à une utilisation en intérieur uniquement.
Le produit ne peut pas être connecté au réseau public.
Cet équipement n'est pas adapté à une utilisation dans des endroits où des enfants sont susceptibles d'être présents.
ATTENTION: Il existe un risque d'explosion si la pile CMOS n'est pas remplacée correctement. L'élimination de la batterie dans le feu ou dans un four chaud, ou l'écrasement ou le découpage mécanique d'une batterie peut entraîner une explosion.
Model
HX511
System Dimensions
8.86" x 2" x 6.97"
225 x 50.8 x 177 mm
System Weight
4.94 lbs
2.24 kgs
Radio Specifications when equipped with Intel AC 9260 Wi-Fi (device for indoor use)
Frequency Bands
2.4 GHz and 5 GHz bands
Operating Frequency
2400 - 2485 MHz
5150 - 5250 MHz, 5250 - 5350 MHz
5470 - 5725 MHz, 5725 - 5878 MHz
Channel spacing / Bandwidth
2.4GHz: 802.11b/g/n; 5 MHz / BT: 1MHz
Bandwidth: 20 MHz / 40 MHz
5 GHz: 802.11a/n/ac: 20, 40, 80, 160 MHz
Radio Specifications when equipped with Amit MDG100 (EU)
GPS Receiver
Operating frequency range: 1559 - 1610 MHz
GLONASS Receiver
Operating frequency range: 1559 - 1610 MHz
BDS Receiver
Operating frequency range: 1559 - 1610 MHz
System Component
Config 1 Low
Config 3 Medium
Config 4 High
CPU
Intel Core i7-1265UL Processor
Intel Core i5-12600HL Processor
Intel Core i7-12800HL Processor
Low Config Measurements
Power Consumption
12V Avg [W]
24V Avg [W]
Pseudo G3
0.05
Wake-Up Event
From ACPI State
Comments
Power Button
Deep S5, S5, S3
LAN
S5, S3
Parameter
Value
Nominal operating voltage (Rated DC value of input)
12~24V
Undervoltage protection trip DC level (system turns off)
6.5V
Maximum safe DC voltage (system not damaged)
28.4V
A025
02/25/2025
A024
04/24/2024
Category:
Software
SKU(s) Affected:
HX511
Revision(s) Affected:
All
Revision Resolved:
Unresolved
Revision History
Date
First release of HX11 manual
06/06/2023
Updated Errata and feature list
06/12/2023
Minor update to vPro list
02/09/2024
The system can be powered with a 4-pin terminal block by matching the Negative (-) and Positive (+). From left-to-right, the pinout is: (SW) (SW) ( – ) ( + )
The (SW) pins can be used for remote power switch operation. This can be connected with a momentary button/switch.


































Memory
0.135
Must be enabled in BIOS









HX500 / HX600 BIOS Manual
NOTE: To enter the BIOS on Helix systems, hold the ‘Delete’ key on your keyboard during boot.
Boot Manager
Type
Device Management
Boot From File
Administer Secure Boot
Setup Utility
Intel(R) Management Engine BIOS Extension
InsydeH2O Version
BIOS Version
Build Date
Processor Type
CPU Speed
Number of Processors
PCH SKU
Total Memory
Channel A
Channel B
Memory Speed
Language
System Time
System Date
Numlock
Serial ATA Port X
Platform Trust Technology
Enable Hibernation
ACPI S3 Support
Native PCIE Enable
Native ASPM
Low Power S0 Idle Capability
Type
ID
Speed
L1 Data Cache
L1 Instruction Cache
L2 Data Cache
L3 Data Cache
L4 Data Cache
VMX
SMX/TXT
Intel (VMX) Virtualization Technology
Active Processor Cores
Hyper-Threading
AES
Boot Performance Mode
Intel(R) SpeedStep(tm)
Intel(R) Speed Shift Technology
Turbo Mode
HOB Buffer Size
ECC Support
Max TOLUD
SA PCIe Code Version
VT-d
Graphics Configuration
Stop Grant Configuration
PCIe Spread Spectrum Clocking
VT-d
CHAP Device (B0:D7:F0)
Thermal Device (B0:D4:F0)
GNA Device (B0:D8:F0)
CRID Support
Above 4GB MMIO BIOS assignment
X2APIC Opt Out
IPU Device (B0:D5:F0)
Skip Scanning of External Gfx Card
Primary Display
Internal Graphics
GTT Size
Aperture Size
DVMT Pre-Allocated
DVMT Total Gfx Mem
PCI Express Configuration
SATA and RST Configuration
HD Audio
PCH LAN Controller
Wake on LAN Enable
SLP_LAN# Low on DC Power
EFI Network
Wake on WLAN and BT Enable
PXE ROM
Auto Power-On
PCI Express Clock Gating
PCI Express Root Port <n>
►PCI Express Root Port <n>
PCI Express Root Port Settings
PCI Express Root Port
ASPM
PCIE Speed
Detect Timeout
SATA Controllers
SATA Mode Selection
Serial ATA Port <n>
Software Preserve
Port <n>
Hot Plug
Configured as eSATA
External
Spin Up Device
SATA Device Type
Topology
HD Audio
ME Firmware Version
ME Firmware Mode
ME Firmware SKU
ME Firmware Status 1
ME Firmware Status 2
ME State
Manageability Features State
AMT BIOS Features
AMT Configuration
ME Unconfig on RTC Clear
Comms Hub Support
JHI Support
Core BIOS Done Message
Firmware Update Configuration
PTT Configuration
ASF Support
USB Provisioning of AMT
CIRA Configuration
ASF Configuration
Secure Erase Configuration
MEBx Resolution Settings
CIRA Configuration
Activate Remote Assistance Process
CIRA Timeout
ASF Configuration
PET Progress
WatchDog
OS Timer
BIOS Timer
ASF Sensors Table
Secure Erase Configuration
Secure Erase Mode
Force Secure Erase
MEBx Resolution Settings
Non-UI Mode Resolution
UI Mode Resolution
Graphics Mode Resolution
ME Firmware Re-Flash
PTT Capability / State
Automatic Thermal Reporting
Critical Trip Point
Active Trip Point 0
Active Trip Point 0 Fan Speed
Active Trip Point 1
Active Trip Point 1 Fan Speed
Passive Trip Point
Passive TC1 Value
Passive TC2 Value
Passive TSP Value
Active Trip Points
Passive Trip Points
Critical Trip Points
Active Trip Points
PCH Temp Read
CPU Energy Read
CPU Temp Read
Alert Enable Lock
CPU Temp
CPU Fan Speed
UART Port 1 Configuration
UART Port 2 Configuration
Fan Control
Hardware Monitor
UART Port <n>
Power Over Cable
Mode Select
CPUFANIN
CPUTIN
Mode
PWM/DC Output
Output Buffer Type
PWM Duty Cycle (%)
PWM Duty Cycle (%)
Fan Control (Thermal Cruise Mode)
The following settings are only available if the Mode option above is set to Thermal Cruise.
Target Temperature (°C)
Tolerance (°C)
Fan Control (Speed Cruise Mode)
Target Fan Speed
Tolerance
Fan Control (Smart Fan IV Mode)
Boundary 0 (°C)
Output 0 (%)
Boundary 1 (°C)
Output 1 (%)
Boundary 2 (°C)
Output 2 (%)
Boundary 3 (°C)
Output 3 (%)
Refresh Cycle
Current TPM Device
TPM State
TPM Active PCR Hash Algorithm
TPM Hardware Supported Hash Algorithm
BIOS Supported Hash Algorithm
TrEE Protocol Version
TPM Availability
TPM Operation
Clear TPM
Set Supervisor Password
Boot Type
Network Stack
PXE Boot Capability
Add Boot Options
USB Boot
UEFI OS Fast Boot
EFI
Note: The EFI boot order configuration in this menu can only be changed if the Add Boot Options option above is set to First or Last.
In this menu, you set which devices the system can boot to, as well as change the order in which it attempts to boot. Highlight a boot device and press Enter to enable or disable booting to it. Use the F5 and F6 keys to move the boot device up and down the list.
Exit Saving Changes
Save Change Without Exit
Exit Discarding Changes
Load Optimal Defaults
Load Custom Defaults
Save Custom Defaults
Discard Changes
RAID (Redundant Array of Independent Disks) is a technology used to stitch multiple storage drives together into a single volume for a variety of purposes. The Intel Q470 chipset on the Helix platform features Intel Rapid Storage Technology (RST), an integrated firmware-level RAID utility for SATA disks. Intel RST on Comet Lake chipsets is only supported in Windows; Linux users will need to use a dedicated hardware RAID solution or a software-level RAID utility such as mdadm.
Because the RAID volumes are maintained at the firmware level, the disks in an array do not need to match perfectly. However, the timing parameters of all disks in a certain array, such as write speed, will be limited by the chipset to the lowest value among those disks.
On the Helix platform, the M.2 B-Key, M.2 M-Key, and both cabled SATA connectors can be configured in RAID arrays.
Different types of RAID arrays are referred to as “levels”. Intel RST on the Helix platform supports four RAID levels:
RAID 0 (Striped): In a RAID 0 array, data written to the volume is split between two or more disks. Each disk’s storage space is divided into blocks, the size of which can be set by the user. When writing data to the volume, the SATA controller will rotate block-by-block between the disks. This methodology can provide noticeable improvements to read and write speeds; however, if one disk in a RAID 0 array fails, the data on the entire volume will be lost.
RAID 1 (Mirrored): In a RAID 1 array, the SATA controller mirrors all data between two or more disks. The primary benefit of this methodology is that if a drive in the array is disconnected or fails altogether, the volume will continue to function as normal. If an OS is installed on the volume, it will not be interrupted by a failing drive. A drive can then be reconnected or replaced, at which time the SATA controller will rebuild the volume (note that the rebuild process can take several hours or even days for larger volumes). This RAID configuration has no noticeable effect on write speeds but typically improves read speeds, as the system can read from multiple disks simultaneously.
RAID 5 (Striped with Parity): A RAID 5 array functions similarly to a RAID 0 array in that it stripes data across multiple disks; however, for each set of blocks, it also writes a block of parity data that can be used to recover a block on another disk if it loses that data. Thus, you can achieve some of the performance gains of a RAID 0 array while being able to withstand a single disk failure. This methodology requires at least three disks.
RAID 10 (Striped and Mirrored): A RAID 10 array combines two RAID 1 arrays in a RAID 0 array. This allows you to achieve the performance gains of a RAID 0 array while still maintaining the fault tolerance of a RAID 1 array. Data is striped between the two RAID 1 volumes, which are able to withstand and rebuild after a failed disk. This methodology requires at least four disks. This RAID level is also sometimes referred to as RAID 1+0.
Recovery: Intel Rapid Recovery Technology creates a special RAID 1 array where instead of two equivalent disks, one disk is designated the “primary” and the other the “secondary”. Data is written to the primary drive, then copied to the secondary drive as a backup. This allows you to decide if you would like the mirroring to occur continuously or only on request; in addition, the time it takes to rebuild the array after a disk failure is decreased. However, the read speed improvements of a typical RAID 1 array are not seen here, as the SATA controller will typically only read from the primary drive.
Note: Creating a new RAID array will erase all filesystems and data on all the disks used.
From the main menu, select “Device Management”. You will be greeted with the Device Manager options pictured below. Select “Intel(R) Rapid Storage Technology” to continue.
Note: The Intel(R) Rapid Storage Technology menu will only appear if you have set the SATA Mode Selection option to Intel RST Premium With Intel Optane System Acceleration. This option is located in the main BIOS setup under Advanced > PCH-IO Configuration > SATA And RST Configuration.
This menu will list all existing RAID arrays, as well as all SATA disks that are not currently in an array. Select “Create RAID Volume” to continue.
The following menu will give you the option to specify the name of your RAID volume, the RAID level of the configuration, and which disks will become part of the array. Begin by specifying the name of the volume if desired and selecting a RAID Level.
Then, select which SATA disks will be used to create the array. Note that any disks being used in a different RAID array will not be selectable. If you are creating an array with the RAID level “Recovery”, you will need to select which drive is the primary (M) and which is the secondary (R).
For RAID 0, 5, and 10 configurations, you can specify the strip size if desired. The strip size options vary depending on the RAID level of the configuration. In addition, you can set the capacity of the volume if you would like it smaller than the maximum available. If you are creating a “Recovery” array, you can also select if the slave drive is synchronized with the master continuously or only on request.
Select “Create Volume” to return to the Device Manager menu. You should now see your new volume listed in the menu; hit F10 to save your new settings and Escape to return to the main BIOS menu.
Your RAID array is now created and ready for use.
The latest BIOS updates are available within Software & Firmware section of the HX500 / HX600 Product Documentation space.
Revision History
Default Value
Auto
Default Value
Max Non-Turbo Performance
Default Value
Auto
Default Value
Dynamic
Default Value
Auto
Default Value
Auto
Default Value
Auto
Default Value
8MB
Default Value
256MB
Default Value
32M
Default Value
256M
Default Value
Disabled
Default Value
Disabled
Default Value
Auto
Default Value
Auto
Default Value
AHCI
Default Value
Hard Disk Drive
Default Value
Unknown
Default Value
Enabled
Default Value
Enabled
Default Values
Enabled
Default Value
0
Default Value
Simulated
Default Value
Auto
Default Value
Auto
Default Value
Auto
Default Value
Disabled
Default Value
119 C (POR)
Default Value
71 C
Default Value
100
Default Value
55 C
Default Value
75
Default Value
95 C
Default Value
1
Default Value
5
Default Value
10
Default Value
65%
Default Value
Pure RS-232
Default Value
Smart Fan IV
Default Value
PWM Duty Cycle (%)
Default Value
Open-Drain
Default Value
50
Default Value
50
Default Value
25
Default Value
50
Default Value
75
Default Value
100
Default Value
1
Default Value
1.1
Default Value
Available
Default Value
No Operation
Default Value
UEFI Boot Type
Default Value
Disabled
Default Value
Auto
Menu
BIOS Page
Front Page
Description
Opens the list of detected bootable devices, allowing you to manually select a device to boot, such as an OS or PXE
Type
Menu
BIOS Page
Front Page
Description
Opens the Device Manager menu which includes a configuration menu for Intel Rapid Storage Technology and a Network Device List (if RST and Network Stack are enabled)
Type
Menu
BIOS Page
Front Page
Description
Allows you to boot from a UEFI bootable file
Type
Menu
BIOS Page
Front Page
Description
Opens the Secure Boot configuration menu
Type
Menu
BIOS Page
Front Page
Description
Opens the primary BIOS configuration menu referenced in sections 2 through 6 of this manual
Type
Menu
BIOS Page
Front Page
Description
Opens the Intel Management Engine BIOS Extension (MEBx) configuration interface
Type
Information
BIOS Page
Main Page
Description
Displays current InsydeH2O BIOS Framework version
Type
Information
BIOS Page
Main Page
Description
Displays current BIOS version
Type
Information
BIOS Page
Main Page
Description
Displays the BIOS build date in MM/DD/YYYY
Type
Information
BIOS Page
Main Page
Description
Displays model number of installed CPU
Type
Information
BIOS Page
Main Page
Description
Displays base frequency of installed CPU
Type
Information
BIOS Page
Main Page
Description
Displays core and thread count of installed CPU
Type
Information
BIOS Page
Main Page
Description
Displays model number of PCH
Type
Information
BIOS Page
Main Page
Description
Displays total capacity of all memory installed in system
Type
Information
BIOS Page
Main Page
Description
Displays capacity of memory installed in Channel A
Type
Information
BIOS Page
Main Page
Description
Displays capacity of memory installed in Channel B
Type
Information
BIOS Page
Main Page
Description
Displays base frequency of installed memory
Type
Information
BIOS Page
Main Page
Description
Selects the current default language used by the BIOS
Type
Information
BIOS Page
Main Page
Description
Displays the time in HH:MM:SS. Valid range is from 0 to 23, 0 to 59, 0 to 59. Use +/- to increase/decrease
Type
Information
BIOS Page
Main Page
Description
Displays the date in MM:DD:YYYY. Valid range is from 1 to 12, 1 to 31, 2000 to 2099. Use +/- to increase/decrease
Type
Configurable Setting
BIOS Page
Advanced Page > Boot Configuration
Description
Sets state of Num Lock key when system is booted
Default Value
Off
Type
Information
BIOS Page
Advanced Page > SATA Configuration
Description
Displays model number of device installed in each SATA Port
Type
Information
BIOS Page
Advanced Page > Chipset Configuration (Intel PTT)
Description
Enables or Disables Intel Platform Trust Technology (PTT).
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > ACPI Table/Features Control
Description
Enables or Disables hibernation state (ACPI Sleep State S4) support. This option may not be effective with some OSes
Default Value
[X] (enabled)
Type
Configurable Setting
BIOS Page
Advanced Page > ACPI Table/Features Control
Description
Enables or Disables ACPI Sleep State S3 support
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > ACPI Table/Features Control
Description
Enables or Disables Native PCIe, allowing the OS to control PCIe configuration
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > ACPI Table/Features Control
Description
Enables or Disables Native Active State Power Management (ASPM)
Possible Values
Auto
Enabled - OS Controlled ASPM
Disabled - BIOS Controlled ASPM
Type
Configurable Setting
BIOS Page
Advanced Page > ACPI Table/Features Control
Description
Enable or Disable ACPI Lower Power S0 Idle Capability (mutually exclusive with Smart Connect). While this is enabled, it also disables 8254 timer for SLP_S0 support.
Default Value
Disabled
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays model number of installed CPU
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays ID of installed CPU
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays base frequency of installed CPU
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays capacity of L1 data cache
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays capacity of L1 instruction cache
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays capacity of L2 data cache
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays capacity of L3 Data Cache
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays capacity of L4 Data Cache
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays whether or not Virtual Machine Extensions (VMX) instruction set is supported
Type
Information
BIOS Page
Advanced Page > CPU Configuration
Description
Displays whether or not Safer Mode Extensions (SMX) and Trusted Execution Technology (TXT) are supported
Type
Configurable Setting
BIOS Page
Advanced Page > CPU Configuration
Description
Enables or Disables Intel Virtual Machine Extensions (VMX). When enabled, a VMM can utilize the additional hardware capabilities provided by Vanderpool Technology
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > CPU Configuration
Description
Sets number of cores to enable in each processor package
Type
Configurable Setting
BIOS Page
Advanced Page > CPU Configuration
Description
Enables or Disables Hyper-Threading
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > CPU Configuration
Description
Enables or Disables Advanced Encryption Standard (AES) instruction set
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Power & Performance
Description
Sets the performance state that the BIOS will set starting from the reset vector
Possible Values
Max Non-Turbo Performance, Max Battery, Turbo Performance
Type
Configurable Setting
BIOS Page
Advanced Page > Power & Performance
Description
Enables or Disables support for more than two CPU frequency ranges
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Power & Performance
Description
Enables or Disables Intel(R) Speed Shift Technology support. Enabling will expose the CPPC v2 interface to allow for hardware controlled P-states
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Power & Performance
Description
Enables or Disables processor Turbo Mode (requires Intel SpeedStep or Intel Speed Shift to be supported and enabled)
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Memory Configuration
Description
Sets HOB buffer size
Possible Values
Auto, 1B, 1KB, Max (assuming 63KB total HOB size)
Type
Configurable Setting
BIOS Page
Advanced Page > Memory Configuration
Description
Enables or Disables Error-Correcting Code memory (ECC) support
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Memory Configuration
Description
Sets maximum value of TOLUD. Dynamic assignment would adjust TOLUD automatically based on the largest MMIO length of the installed graphic controller
Possible Values
Dynamic, 1, 1.25, 1.5, 1.75, 2, 2.25, 2.5, 2.75, 3, 3.25, 3.5 (GB)
Type
Information
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Displays SA PCIe Code Version
Type
Information
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Displays whether or not Virtualization Technology for Directed I/O (VT-d) is supported
Type
Sub-Menu
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Opens Graphics Configuration sub-menu (see section 3.8.1 below)
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Sets stop grant configuration to automatic or manual
Possible Values
Auto, Manual
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables PCI Express Spread Spectrum Clocking (SSC) for compliance testing
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables Virtualization Technology for Directed I/O (VT-d) capability
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables SA CHAP Device
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables SA Thermal Device
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables SA GNA Device
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables CRID control for Intel Stabled IT Platform Program (SIPP)
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables above 4GB MemoryMappedIO (MMIO) BIOS assignment. This is enabled automatically when Aperture Size is set to 2048MB
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables X2APIC_OPT_OUT bit
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration
Description
Enables or Disables SA IPU Device. Default value: Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration > Graphics Configuration
Description
Sets whether or not the system will skip scanning for external GPUs on all PEG and PCH PCIe ports on boot
Default Value
Disabled (system will scan for external GPUs on boot)
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration > Graphics Configuration
Description
Sets which iGFX/PEG/PCI graphics device should be used for the primary display output. Select SG for Switchable Graphics
Possible Values
Auto, IGFX, PEG, PCI, SG
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration > Graphics Configuration
Description
Enables or Disables Integrated Graphics (iGFX). Auto mode will enable or disable based on graphics settings above
Possible Values
Auto, Enabled, Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration > Graphics Configuration
Description
Sets size of the Graphics Translation Table (GTT)
Possible Values
2MB, 4MB, 8MB
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration > Graphics Configuration
Description
Sets the Graphics Aperture Size. The Above 4GB MMIO BIOS assignment is automatically enabled when selecting 2048MB aperture. To use this feature, please disable CSM support
Possible Values
128MB, 256MB, 512MB, 1024MB, 2048MB
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration > Graphics Configuration
Description
Sets DVMT 5.0 Pre-Allocated (Fixed) graphics memory size used by the Integrated Graphics (iGFX)
Possible Values
0, 64, 4, 8, 12, 16, 20, 24, 28, 32/F7, 36, 40, 44, 48, 52, 56, 60 (M)
Type
Configurable Setting
BIOS Page
Advanced Page > System Agent (SA) Configuration > Graphics Configuration
Description
Select DVMT 5.0 Total Graphic Memory size used by the Integrated Graphics (iGFX)
Possible Values
256M, 128M
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Opens the PCI Express Configuration sub-menu (see section 3.9.1 below)
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Opens the SATA Device Options Configuration sub-menu (see section 3.9.2 below)
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Opens the HD Audio Subsystem Configuration sub-menu (see section 3.9.3 below)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Enables or Disables UEFI initialization of onboard NICs
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Enables or Disables the ability of onboard NICs to wake the system from non-DeepSx states.
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Enables or Disables SLP_LAN# Low on DC Power
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Enables or Disables EFI Network support for onboard NICs and/or WiFi module
Possible Values
Disabled, Onboard NIC, WiFi, Onboard NIC & WiFi
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Enables or Disables ability of PCI Express Wireless LAN and Bluetooth to wake the system
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Enables or Disables PXE Option ROM execution
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Sets resume state when the system is restored after a mechanical power-off (ACPI G3 state)
Possible Values
Enabled (System will boot directly as soon as power is applied)
Disabled (System will remain in power-off state until the power button is pressed)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration
Description
Enables or Disables PCI Express Clock Gating
Default Value
Enabled
Type
Information
BIOS Page
Advanced Page > PCH-IO Configuration > PCI Express Configuration
Description
Displays configuration of specified PCI Express Root Port
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-IO Configuration > PCI Express Configuration
Description
Opens the PCI Express Root Port configuration sub-menu for the selected port (see section 3.9.1.1 below)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > PCI Express Configuration > PCI Express Root Port Settings
Description
Enables or disables the selected PCI Express Root Port
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > PCI Express Configuration > PCI Express Root Port Settings
Description
Sets the PCI Express Active State Power Management mode
Possible Values
Auto, Disabled, L0s, L1, L0sL1
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > PCI Express Configuration > PCI Express Root Port Settings
Description
Sets the PCIe Speed of the selected port
Possible Values
Auto, Gen1, Gen2, Gen3
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > PCI Express Configuration > PCI Express Root Port Settings
Description
Sets the number of milliseconds reference code will wait for the link to exit detect state for enabled ports before assuming there is no device and potentially disabling the port
Default Value
0
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Enables or Disables the SATA controller and all SATA devices
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Sets the mode of operation of the SATA controller. Setting this to Intel RST Premium With Intel Optane System Acceleration will enabled integrated firmware RAID (see chapter 7 for details)
Note: Setting this to Intel RST Premium will prevent the Linux kernel from properly interacting with SATA disks
Possible Values
AHCI, Intel RST Premium With Intel Optane System Acceleration
Type
Information
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Displays the model number of the installed device using the specified port, or “Empty” if no device is detected
Type
Information
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Displays whether or not Software Preserve is supported on the specified port
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Enables or Disables the specified SATA Port
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Enables or Disables SATA Hot Plug support for the specified port
Default Value
Disabled
Type
Information
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Displays whether or not the specified port is configured as eSATA
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Sets whether or not the specified port is external
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Enables or Disables Staggered Spin Up. If enabled for any port, Staggered Spin Up will be performed and only the drives which have this option enabled will spin up at boot
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Sets the type of disk is connected to the specified SATA port. Certain configuration settings are only applied when this is set to Hard Disk Drive
Possible Values
Hard Disk Drive, Solid State Drive
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > SATA and RST Configuration
Description
Sets the SATA topology type of the installed device
Possible Values
Unknown, ISATA, Direct Connect, Flex, M2
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-IO Configuration > HD Audio
Description
Enables or Disables the integrated HD Audio device
Default value: Enabled
Possible Values
Disabled (HDA will be unconditionally disabled)
Enabled (HDA will be unconditionally enabled)
Type
Information
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Displays Management Engine firmware version
Type
Information
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Displays Management Engine firmware mode
Type
Information
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Displays Management Engine firmware SKU
Type
Information
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Displays Management Engine firmware status 1
Type
Information
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Displays Management Engine firmware status 2
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration
Description
When Disabled ME will be put into ME Temporarily Disabled Mode. Default value: Enabled
Possible Values
Enabled (Management Engine will act normally)
Disabled (Management Engine will be put into ME Temporarily Disabled Mode)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Enables or Disables Intel Manageability features
Note: This option disables/enables Manageability Features support in FW. Platform must be in an unprovisioned state before disabling ME support
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Enables or Disables Active Management Technology (AMT) BIOS Features. Disabling this prevents the user from accessing the MEBx configuration
Note: This option does not disable Manageability Features in the firmware
Default Value
Enabled
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Opens the Intel Active Management Technology (AMT) configuration sub-menu (see section 3.10.1 below)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Enables or Disables clearing of Management Engine configuration on CMOS clear
Possible Values
Enabled (ME settings will be cleared on CMOS clear)
Disabled (ME settings will be retained on CMOS clear)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Enables or Disables support for Comms Hub
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Enables or Disables Intel DAL Host Interface Service (JHI)
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Enable or Disable sending Core BIOS Done Message to ME
Default Value
Enabled
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Opens the Management Engine Firmware Update configuration sub-menu (see section 3.10.2 below)
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-FW Configuration
Description
Opens the Platform Trust Technology (PTT) configuration sub-menu (see section 3.10.3 below)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration
Description
Enables or Disables Alert Standard Format support
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration
Description
Enables or Disables Active Management Technology (AMT) USB Provisioning
Default Value
Disabled
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration
Description
Opens the Client Initiated Remote Assistance (CIRA_ configuration sub-menu (see section 3.10.1.1 below)
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration
Description
Opens the Alert Standard Format (ASF) configuration sub-menu (see section 3.10.1.2 below)
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration
Description
Opens the Secure Erase configuration sub-menu (see section 3.10.1.3 below)
Type
Sub-Menu
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration
Description
Opens the Management Engine BIOS Extension (MEBx) configuration sub-menu (see section 3.10.1.4 below)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > CIRA Configuration
Description
Enables or Disables the Client Initiated Remote Assistance boot process
Default Value
[ ] (disabled)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > CIRA Configuration
Description
Sets the timeout for the CIRA remote assistance connection to be established
Note: This setting is only available if the Activate Remote Assistance Process setting is enabled
Possible Values
0 to 255 (0 for default timeout of 60 seconds, 255 for no timeout)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > ASF Configuration
Description
Enables or Disables the ability to receive Platform Event Trap (PET) events
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > ASF Configuration
Description
Enables or Disables the Watchdog Timer
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > ASF Configuration
Description
Sets the WatchDog Timer duration in seconds so that an OS can interact with it
Note: This setting is only available if the WatchDog setting is enabled
Default Value
0
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > ASF Configuration
Description
Sets the WatchDog Timer duration in seconds at the BIOS level. This timer will reset the system if it fails to POST within the duration
Note: This setting is only available if the WatchDog setting is enabled
Default Value
0
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > ASF Configuration
Description
Enables or Disables adding the ASF Sensor Table to the ASF ACPI Table
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > Secure Erase Configuration
Description
Sets the behavior of the Secure Erase module
Possible Values
- Simulated (performs the Secure Erase process without erasing disks)
- Real (performs the Secure Erase process, erasing disks)
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > Secure Erase Configuration
Description
Enables or Disables forcing the Secure Erase process to occur on next boot
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > MEBx Resolution Settings
Description
Sets the resolution for the non-UI text-based MEBx mode
Possible Values
Auto, 80x25, 100x31
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > MEBx Resolution Settings
Description
Sets the resolution for the UI text-based MEBx mode
Possible Values
Auto, 80x25, 100x31
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > AMT Configuration > MEBx Resolution Settings
Description
Sets the resolution for the Graphical MEBx mode
Possible Values
Auto, 640x480, 800x600, 1024x768
Type
Configurable Setting
BIOS Page
Advanced Page > PCH-FW Configuration > Firmware Update Configuration
Description
Enables or Disables Management Engine Firmware Image Re-Flash function
Default Value
Disabled
Type
Information
BIOS Page
Advanced Page > PCH-FW Configuration > PTT Configuration
Description
Displays Platform Trust Technology (PTT) Capability / Enablement State
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables automatic configuration of _CRT, _PSV and _AC0 based on values recommended in BWG’s Thermal Reporting for Thermal Management settings
Possible Values
Enabled (automatic configuration)
Disabled (manual configuration)
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the temperature value of the ACPI Critical Trip Point (the point at which the system will shut off.)
Note: 119C is the Plan Of Record (POR) for all Intel processors.
Possible Values
15, 23, 31, 39, 47, 55, 63, 71, 79, 87, 95, 100, 103, 111, 119, 127 (C)
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the temperature value of the ACPI Active Trip Point 0 (the point at which the OS will set the processor fan to Active Trip Point 0 Fan Speed)
Possible Values
15, 23, 31, 39, 47, 55, 63, 71, 79, 87, 95, 100, 111, 127 (C)
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets Active Trip Point 0 Fan Speed percentage (the percentage of maximum speed at which the fan will run when Active Trip Point 0 is crossed)
Possible Values
0 to 100
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the temperature value of the ACPI Active Trip Point 1 (the point at which the OS will set the processor fan to Active Trip Point 1 Fan Speed)
Possible Values
15, 23, 31, 39, 47, 55, 63, 71, 79, 87, 95, 100, 111, 127 (C)
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets Active Trip Point 1 Fan Speed percentage (the percentage of maximum speed at which the fan will run when Active Trip Point 1 is crossed)
Possible Values
0 to 100
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the temperature value of the ACPI Passive Trip Point (the point in which the OS will begin throttling the processor frequency)
Possible Values
15, 23, 31, 39, 47, 55, 63, 71, 79, 87, 100, 103, 111, 119 (POR), 127 (C)
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the TC1 value for the ACPI Passive Cooling Formula
Possible Values
1 to 16
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the TC2 value for the ACPI Passive Cooling Formula
Possible Values
1 to 16
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the TSP value for the ACPI Passive Cooling Formula. This value represents how often (in tenths of a second) the OS will read the temperature when passive cooling is enabled
Possible Values
2 to 32
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables Active Trip Points
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables Passive Trip Points
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables Critical Trip Points
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables Active Trip Points
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables reading of PCH temperature
Default Value
[X] (enabled)
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables reading of CPU power draw
Default Value
[X] (enabled)
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables reading of CPU temperatures
Default Value
[X] (enabled)
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Enables or Disables locking of all Alert Enable settings
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the Fail Safe temperature that the embedded controller will use if the OS is hung
Default Value
75
Type
Configurable Setting
BIOS Page
Advanced Page > Thermal Configuration
Description
Sets the fan speed that the embedded controller will use if the OS is hung
Possible Values
0-100%
Type
Sub-Menu
BIOS Page
Advanced Page > SIO NCT5524D Chip
Description
Opens the UART Port 1 (COM1) configuration sub-menu (see section 3.12.1 below)
Type
Sub-Menu
BIOS Page
Advanced Page > SIO NCT5524D Chip
Description
Opens the UART Port 2 (COM2) configuration sub-menu (see section 3.12.1 below)
Type
Sub-Menu
BIOS Page
Advanced Page > SIO NCT5524D Chip
Description
Opens the Fan Control configuration sub-menu (see section 3.12.2 below)
Type
Sub-Menu
BIOS Page
Advanced Page > SIO NCT5524D Chip
Description
Opens the Hardware Monitor sub-menu to display hardware monitoring values (see section 3.12.6 below)
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > UART Port X Configuration
Description
Enables or Disables selected COM port
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > UART Port X Configuration
Description
Enables or Disables DC power on pin 9 of selected COM port
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > UART Port X Configuration
Description
Sets the communication protocol of the selected COM port
Possible Values
- Pure RS-232
- RS-422 Full Duplex
- RS-485 Half Duplex (TX ENABLE Low Active)
- RS-422 Full Duplex (with termination resistor and bias resistor)
- Pure RS-232 (co-exists with RS485)
- RS-485 Half Duplex (with termination resistor and bias resistor)
- Low Power Shutdown*
*This option puts the transceiver into a low-power mode, deactivating the serial communications to minimize power draw. When selected, the serial ports will not be usable
Type
Information
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control
Description
Displays current CPU Fan RPM
Type
Information
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control
Description
Displays current CPU package temperature
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control
Description
Sets fan control mode. Certain modes will add or remove settings that only pertain to that mode; see sections 3.12.2.1 through 3.12.2.3 for mode-specific configuration options
Possible Values
Manual, Thermal Cruise, Speed Cruise, Smart Fan IV
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control
Description
Sets the type of fan control signal
Possible Values
PWM Duty Cycle (%), DC Voltage (%)
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control
Description
Sets the characteristics of the output buffer
Note: This setting is only available if the PWM/DC Output option is set to PWM Duty Cycle (%)
Possible Values
Open-Drain, Push-Pull
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control
Description
Sets the duty cycle percentage for the fan control PWM signal
Note: This setting is only available if the PWM/DC Output option is set to PWM Duty Cycle (%)
Possible Values
0 to 100
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control (with Mode option set to Manual)
Description
Sets the DC voltage percentage for the fan control signal
Note: This setting is only available if the Mode option is set to Manual and the PWM/DC Output option is set to DC Voltage (%)
Possible Values
0 to 100
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control (with Mode option set to Thermal Cruise)
Description
Sets the target CPU temperature in degrees Celsius that the fan control will adjust to maintain
Default Value
0
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control (with Mode option set to Thermal Cruise)
Description
Sets the temperature tolerance in degrees Celsius for the Target Temperature set above
Default Value
0
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control (with Mode option set to Speed Cruise)
Description
Sets the target fan speed that the fan control will adjust to maintain
Default Value
0
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D > Fan Control (with Mode option set to Thermal Cruise)
Description
Sets the tolerance for the target fan speed set above
Default Value
0
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Fan Control (with Mode option set to Smart Fan IV)
Description
Sets the temperature at which the fan speed will be set to the value specified in the Output 0 option
Default Value
30
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Fan Control (with Mode option set to Smart Fan IV)
Description
Sets the fan speed percentage that will be used when the temperature hits the threshold specified in the Boundary 0 option
Possible Values
0 to 100
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Fan Control (with Mode option set to Smart Fan IV)
Description
Sets the temperature in degrees Celsius at which the fan speed will be set to the value specified in the Output 1 option
Default Value
40
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Fan Control (with Mode option set to Smart Fan IV)
Description
Sets the fan speed percentage that will be used when the temperature hits the threshold specified in the Boundary 1 option
Possible Values
0 to 100
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Fan Control (with Mode option set to Smart Fan IV)
Description
Sets the temperature in degrees Celsius at which the fan speed will be set to the value specified in the Output 2 option
Default Value
50
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Fan Control (with Mode option set to Smart Fan IV)
Description
Sets the fan speed percentage that will be used when the temperature hits the threshold specified in the Boundary 2 option
Possible Values
0 to 100
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Fan Control (with Mode option set to Smart Fan IV)
Description
Sets the temperature in degrees Celsius at which the fan speed will be set to the value specified in the Output 3 option
Default Value
60
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Fan Control (with Mode option set to Smart Fan IV)
Description
Sets the fan speed percentage that will be used when the temperature hits the threshold specified in the Boundary 3 option
Possible Values
0 to 100
Type
Configurable Setting
BIOS Page
Advanced Page > SIO NCT5524D Chip > Hardware Monitor
Description
Sets the interval in seconds at which the monitor updates values
Possible Values
0 to 15 (setting to 0 stops the monitor from updating values)
Type
Information
BIOS Page
Security Page
Description
Displays current TPM device
Type
Information
BIOS Page
Security Page
Description
Displays current TPM state
Type
Information
BIOS Page
Security Page
Description
Displays active PCR hash algorithm
Type
Information
BIOS Page
Security Page
Description
Displays hardware supported hash algorithm
Type
Information
BIOS Page
Security Page
Description
Displays BIOS supported hash algorithm
Type
Configurable Setting
BIOS Page
Security Page
Description
Sets the TrEE Protocol Version: 1.0 or 1.1. Possible values: 1.1, 1.0. Default value: 1.1
Possible Values
1.1, 1.0
Type
Configurable Setting
BIOS Page
Security Page
Description
Enables or Disables the TPM hardware
Possible Values
Available (enabled), Hidden (disabled)
Type
Configurable Setting
BIOS Page
Security Page
Description
Sets the TPM2 operation state
Possible Values
- No Operation
- Enable
- SetPCRBanks(Algorithm)
- LogAllDigests
- SetPPRequiredForClear_True
- SetPPRequiredForClear_False
- SetPPRequiredForTurnOn_False
- SetPPRequiredForTurnOn_True
- SetPPRequiredForTurnOff_False
- SetPPRequiredForTurnOff_True
- SetPPRequiredForChangePCRs_False
- SetPPRequriedForChangePCRs_True
- SetPPRequiredForChangeEPS_False
- SetPPRequiredForChangeEPS_True
- ChangeEPS
Type
Configurable Setting
BIOS Page
Security Page
Description
Enables or Disables clearing TPM user data such as passwords, certificates, and keys
Default Value
[ ] (disabled)
Type
Configurable Setting
BIOS Page
Security Page
Description
Sets or Changes the supervisor password
Note: The password must be more than one character in length
Type
Configurable Setting
BIOS Page
Boot Page
Description
Sets the boot mode
Possible Values
UEFI Boot Type, Legacy Boot Type, Dual Boot Type
Type
Configurable Setting
BIOS Page
Boot Page
Description
Enables or Disables the onboard NICs before UEFI handoff
Default value: Disabled
Default Value
Disabled
Type
Configurable Setting
BIOS Page
Boot Page
Description
Sets the PXE Boot mode
Note: This setting is unavailable unless Network Stack is Enabled
Possible Values
- Disabled
- UEFI: IPv4
- UEFI: IPv6
- UEFI: IPv4/IPv6
Type
Configurable Setting
BIOS Page
Boot Page
Description
Sets which device in the boot order list the system will attempt to boot first and the direction it will move through the list (see section 5.1 below)
Possible Values
- Auto (boot order is not configurable, uses the system default)
- First (system moves through the boot order list top to bottom)
- Last (system moves through the boot order list bottom to top)
Type
Configurable Setting
BIOS Page
Boot Page
Description
Enables or Disables booting from USB devices
Default Value
Enabled
Type
Configurable Setting
BIOS Page
Boot Page
Description
Enables or Disables Fast Boot mode. When enabled, the BIOS will not initialize the keyboard during boot or watch for the BIOS menu keypress
Default Value
Disabled
Type
Sub-Menu
BIOS Page
Boot Page
Description
Opens the EFI Boot Order sub-menu (see section 5.1 below)
Type
Exit Mode
BIOS Page
Exit Page
Description
Saves your changes and exits the BIOS setup menu
Type
Exit Mode
BIOS Page
Exit Page
Description
Saves your changes, but does not exit the BIOS setup menu
Type
Selectable
BIOS Page
Exit Page
Description
Exits the BIOS setup menu without saving your changes
Type
Selectable
BIOS Page
Exit Page
Description
Loads the firmware’s optimal default settings
Type
Selectable
BIOS Page
Exit Page
Description
Loads user-specified set of default settings
Type
Selectable
BIOS Page
Exit Page
Description
Saves current settings as user-specified set
Type
Selectable
BIOS Page
Exit Page
Description
Discards all changes, but does not exit the BIOS setup menu
Revision History
Date
First release of HX500/HX600 BIOS Manual
07/16/2020
Add link to BIOS Updates support page
12/15/2020





















