K410 / K430

1- Product Overview

1.1- Introduction

The OnLogic Karbon 400 Series Industrial PC (ADPM) packs the power and advanced IoT capabilities of the latest Intel® Atom® x6000E processors (formerly Elkhart Lake) into low profile, rugged and fanless systems built for the challenges of the IoT Edge.

The OnLogic Karbon 400 Series Industrial PC (ADPM) was designed to be installed anywhere you need ultra-reliable computing power. Sensitive internal components are protected from dust, debris, chemicals, and moisture with OnLogic's integrated Hardshell™ Fanless Technology. Its rugged design, -40° to 70°C operating temperature range, 9~48 V power input, and the absence of any moving parts dramatically improve the lifespan and reliability of the system.

1.2- Safety

1.3- Box Contents & Accessories

Accessories

• Terminal block kit (Power, CAN bus)

• Rubber Feet (4)

If you purchased additional items such as mounting brackets, power supplies, or cables, they will be located in the system box or within the outer shipping carton.

For more information on accessories and additional features, you can visit the product pages here:

Karbon 400 Series Page: https://www.onlogic.com/computers/rugged/karbon-400/

Karbon 410 Page: https://www.onlogic.com/k410/

Karbon 430 Page: https://www.onlogic.com/k430/

1.4- Product Specifications

2- Technical Specifications

2.1- I/O Definitions

Front I/O Definition

Power Button & LED

The front power button can be used to turn on and off the Karbon system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset of the system. The system can be woken by a single press of the power button from any state.

The LED backlight will indicate the system status. A solid blue light indicates that the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.

SIM Card

A 3FF Micro-SIM card slot is present on the front panel of the Karbon 400 platform allowing native support for OnLogic cellular modules. The SIM signals can be connected to either the mPCIe or M.2 B-Key internal expansion slots. This selection is controlled in BIOS with the default BIOS setting being mPCIe. Please refer to the BIOS user manual for more information.

The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card from the front panel of the Karbon platform, please use a small implement to push the card into the slot until it clicks. To remove the card, push with a small implement until the card clicks, then pull on the free end of the card to remove it.

USB 2.0

There are two USB 2.0 Type-A ports on the front panel of the K400 platform. These ports are capable of linking at 480Mbps transfer rates.

USB 3.2

There are two USB 3.2 Gen 2 Type A ports on the front panel of the K400 platform. These ports are capable of linking at 10Gbps transfer rates.

ModBay COM Expansion

The K400 platform supports an optional COM DB9 add-in card (OnLogic MOD109). The serial port mode and voltage between Off/5V/12V on Pin 9 on K400 can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS manual for configuration instructions.

ModBay DIO Expansion

The K410/K430 platform supports an optional Isolated Digital I/O add-in card (OnLogic MOD110).

This option allows for integration of the Karbon 400 Series with existing PLC integrations or other digital logic applications. A complete explanation of features, operating voltages, and safety information, is available in the DIO expansion information in the Add-in Modules section (2.4) of this page.

LED Functionality

Bottom I/O Definition

3-Pin Terminal Power Connector

Mainboard power is applied to the Karbon 400 platform by Dinkle 2EHDRM-03P (Mating part: Dinkle: 2ESDVM-03P or equivalent 5.08mm pitch terminal plug). The system is operational from 9V~48V. The maximum rated current of the connector is 15A per pin. Use a wire gauge that is rated for the operational current. The ignition pin may be used to turn the system on when configured. The timing

is configurable through the OS, similar to K700/K300 configurations. Please see the Power Management section on this page for Ignition and timing configuration. See below for on-board connector pinout.

CAN Bus

Supports CAN 2.0 A/B at 100-1000 kbaud via the Programmable Services Engine. Messages may be sent/received through the HECI (Host Embedded Controller Interface). A command line interface utility for interfacing with the CAN device over HECI is provided, and applications can also interact with the HECI driver directly. For more information, please refer to the Add-in Modules section of this page.

The internal CAN signals are unterminated; the CAN device should be externally terminated.

• 3-pin CAN Bus

• Dinkle EC350V-03P terminal block

LAN 1 & 2

There are two LAN Ports on the K400 platform that support up to 1 Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by the two LEDs embedded within the port. The description is included below.

The PoE add-on card option enables Power over Ethernet for both LAN ports. Both ports are configured for 802.3atcapabilities. A total power budget of 36W is provided for both ports, such that two 802.3af devices may be used, with a single port connected to a 802.3at device as an additional supported configuration.

DisplayPort

The Karbon 400 platform utilizes Intel’s Integrated processor graphics that power the onboard

DisplayPort with support for resolutions up to 4096x2304 at 60Hz. The port also supports Multi-Stream Transport (MST) which allows for triple independent display output using a certified MST hub.

Front I/O Definition

Antenna SMA Ports

The Karbon 410 and 430 both have four SMA ports for antennas on the top of the system. The Karbon 430 includes two additional SMA ports on the front of the system.

Expansion Port Pinout

M.2 B-Key

M.2 E-Key

mPCIe

2.2- Motherboard Connectors

The motherboard is the same for K410 and K430.

M.2 B-Key

An M.2 B-Key slot on the Karbon 400 motherboard provides support for B-Key form-factor expansion cards. Supported cards include 3042, 2242, 2260, 2280 form-factors. The B-Key connector supports PCIe Gen 3 x2, USB 3.2 5Gbps, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.

The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Please refer to the BIOS user manual (Appendix B) for more information.

A full pinout table for this expansion slot is provided in Appendix D.

M.2 E-Key

An M.2 E-Key slot on the Karbon 400 motherboard provides support for E-Key form-factor expansion cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is provided in Appendix D.

mPCIe

A mPCIe slot is present on the Karbon 400 motherboard to allow support for mini-PCIe form-factor expansion cards. Full length cards and half-length cards (with an adapter) are supported. The mPCIe connector supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is provided in Appendix D.

The 3FF Micro-SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slot. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Please refer to the BIOS user manual (Appendix B) for more information.

SO-DIMM1 & SO-DIMM2

Karbon 400 has two onboard DDR4 SO-DIMM slots:

• Maximum Capacity: 32GB DDR4-3200 total using two 16GB SO-DIMM modules

• Channel configuration: 1 DIMM Per Channel (DPC) - 2 Channels

• In Band ECC Support (IBECC)

RTC RESET

The snap dome tact switch behind the power button on the Karbon 400 motherboard may be used to clear the CMOS settings in the BIOS. Remove external power to the system before clearing the CMOS. Removing the RTC battery is not an accepted method for clearing BIOS settings.

BIOS EEPROM

If the BIOS needs to be updated, please refer to Appendix B for reflashing instructions.

Power Switch Header

The on-board power switch header can be used to control the power state of the Karbon 400 platform in parallel with the front panel power button. Mating power switch cables should be a twisted-pair wire with floating shield to assure proper immunity to EMI/RFI. The mating connector is a standard 2.54mm female header. It is recommended to keep wires at less than 3 meters in length. Switches must be momentary contact type only.

RTC Battery Header

The RTC battery on the Karbon 400 platform is used to retain BIOS CMOS settings and maintain the real-time clock for the system. If the RTC battery is low, CMOS settings will not be retained and you may receive an alert in the operating system. Replacement batteries should be a UL listed type CR2032 3V cell.

TPM header

Karbon 400 features an onboard TPM (Trusted Platform Module) header. It supports OnLogic’s wide-temperature TPM 2.0 module (OnLogic TPM01). This gives the option to have a dedicated secure module to secure the system through cryptographic keys.

Onboard Power Header

An onboard connector is provided for power to internal expansion cards. The connector is a JST 2.0mm PH series connector (pn: B4B-PH-K-S). A suitable mating connector from the same series should be used. The Pinout is provided below. The maximum operating current per pin is 2A. The header is only powered while the system is in the S0 operating state.

High Speed Daughter Board

The Karbon 430 system supports an additional daughter board for additional high speed storage and connectivity options. The daughter board is pictured below.

M.2 B-Key 1

The upper B-Key slot is provided to allow support for B-Key form-factor PCIe and USB expansion cards. Supported cards include 3042, 3052, 2260, 2280 form-factors. The B-Key connector on the Karbon expansion card supports PCIe Gen 3 x1, USB 3.2 5Gbps, USB 2.0 devices. B-Key SATA drives are not electrically compatible with this slot.

There are two 3FF SIM slots on the daughter board to support networking capabilities. One SIM slot is externally accessible, with the other accessed on the bottom of the HSIO card.

M.2 B-Key 2

The lower B-Key slot is provided to allow support for B-Key form-factor PCIe and USB expansion cards. Supported cards include 2042, 2260, and 2280 form-factors. The B-Key connector on the Karbon 400 expansion card supports PCIe Gen 3 x1, USB 3.2 5Gbps, USB 2.0 devices. B-Key SATA drives are not electrically compatible with this port.

SIM 1

The externally accessible 3FF SIM 1 slot is provided for networking capabilities on the B-Key 1 slot.

SIM 2

The internally accessible 3FF SIM 2 slot is provided for networking capabilities on the B-Key 1 slot. This slot is on the bottom side of the Expansion card and is only accessible by removing the daughterboard from the chassis.

RTC Battery

The RTC battery on the Karbon 400 expansion card is provided for redundancy with the main CMOS battery to retain BIOS CMOS settings and maintain the real-time clock for the system. If the RTC battery is low, CMOS settings will not be retained and you may receive an alert in the operating system. Replacement batteries should be a UL listed type CR2032 3V cell.

2.3- Power Management

Average Power Consumption

The power consumption of the K410 and K430 was measured for various system configurations, workloads, and power states at both 9V and 48V system input voltages. Tests were performed using Burnintest v9.0 build 1012 to stress system components with and without graphics enabled. The build configurations and power consumption are listed in the tables below.

The configurations below are using representative samples of internal devices, the specific components mentioned below may vary from the devices provided by OnLogic. The power consumption for each system configuration is recorded below.

Protection Circuitry

The specified DC levels are the absolute maximum values for function and safety of the system. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.

The Karbon 400 platform enables a unique low power state for use in automotive or battery powered applications. When enabled, the total power draw for the system is less than 10mA, making this solution ideal for systems requiring ultra-low quiescent power draw. This setting must be enabled from the OS similar to ignition settings. The system may be woken by either the power button or the ignition pin.

Wake-Up Events

The Karbon 400 platform supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters.

Auto Power On

The system can be configured to turn on automatically when DC power is connected. This is useful for power outage recovery or if the unit is mounted in a hard to reach location. You can enable Auto Power On by following the steps listed below.

• Power on the system and immediately press the Del key a few times until you see the “Front Page” menu

• Arrow down and choose “Setup Utility” by pressing enter

• Under the advanced tab, open the “RC Advanced Menu”

• Open the “PCH-IO Configuration” menu

• The auto power on setting is called “State After G3”.

• Set it to S0 State to enable auto power on

• Set it to S5 State to disable auto power on

• Press F10 to save and exit. Then you are all set.

2.4- Thermal Results

The thermal performance of the Karbon 400 platform was validated by loading the system to simulate workloads in excess of expected workloads. That is to say, the system was loaded to run at its full rated TDP (12W) while also simultaneously stressing memory and storage at different set points across the system's rated operating temperature range for hours on end. System performance was reviewed to look for any indication of performance issues or for components operating outside of their rated temperature range. Samples of data collected during one of these thermal evaluations for this platform are shown below. The sample data was collected during a test of the K410 chassis with the x6425E processor, 64 GB of DDR4 RAM and an NVMe storage drive. Of note in these results is the fact that no significant drops (10% or more) were observed in core frequency or package power.

There were no indications of any throttling in the system throughout the entirety of the test.

2.5- Block Diagram

3- Installation & Mechanical

3.1- Dimensions

All dimensions are shown in millimeters.

Karbon 410 Dimensions

Karbon 430 Dimensions

3.2- Mounting

Wall Mounting (MTW101)

Step 1: Attach wall mounting brackets to the chassis using the provided screws. To assemble, locate the four holes in the chassis that line up to the two countersunk holes in each wall mount bracket.

Screw type: M3x0.5 FH 120 Degree

Length: 4 mm

Step 2: Take care to ensure that the brackets are oriented correctly and that the part of the brackets in contact with the mounting surface is positioned away from the system to ensure a small air gap is maintained between the mounting surface and the system. Install the four supplied screws.

Step 3: Fasten system to the mounting surface (hardware not provided). The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.

DIN Rail Mounting - Edge (MTD103)

Step 1: Attach DIN Clip to the back of the chassis using the provided screws. To assemble, locate the two holes in the back of the chassis that line up to the two countersunk holes on the DIN clip.

Screw type: M3x0.5 FH 120 Degree

Length: 6 mm

Step 2: The orientation of the DIN clip is interchangeable between the two options. Determine the preferred orientation of the system and install the screws to the DIN clip accordingly.

Step 3: Install the system onto a DIN rail in the desired location.

DIN Rail Mounting - Bottom (MTD102)

Step 1: Attach wall mounting brackets to the chassis using the provided screws. To assemble, locate the four holes in the chassis that line up to the two countersunk holes in each wall mount bracket.

Screw type: M3x0.5 FH 120 Degree

Length: 4 mm

Step 2: Take care to ensure that the brackets are oriented correctly and that the part of the brackets in contact with the mounting surface is positioned away from the system to ensure a small air gap is maintained between the mounting surface and the system. Install the four supplied screws.

Step 3: Take the two plastic DIN clips and align the two outer holes with the two outer holes in the middle of each of the wall mount brackets.

Screw type: M3x0.5 PH

Length: 6 mm

Step 4: The orientation of the DIN clips is interchangeable between the two options. Determine the preferred orientation of the system and install the screws to the DIN clips accordingly.

VESA Mounting (VMPL-1056)

Step 1: Attach VESA mounting plate to the chassis using the provided screws. Align the four holes on the VESA mounting plate with the corresponding holes on the chassis bottom.

Screw type: M3x0.5 FH 120 Degree

Length: 4 mm

Step 2: Attach system to a corresponding VESA MIS-D 75 or MIS-D 100 mounting pattern using the supplied M4x0.7 slotted standoffs

3.3- Internal Access

Opening the system does not void the warranty, however, some precautions are necessary to avoid damaging the unit. Any damaged caused will not be covered by warranty.

• Perform this disassembly in an area free of static discharge

• Before beginning, touch a grounded metal surface to discharge your body of static electricity

• Remove the 4 Torx T8 screws from the bottom of the chassis

• Use a small flathead screwdriver to pry the bottom plate off using the notch.

• If the unit has one of the K430 expansion modules, remove the 4 screws from the midplate and lift it straight out.

• If the system has the optional x2 LAN expansion board, remove the x2 additional screws as well.

• The internals of the system are now accessible.

4- Software & Firmware

4.1- BIOS

See the full BIOS Manual here.

BIOS Updates

Changelog

4.2- Drivers & Downloads

Drivers

Hardware Control Application (HWC)

4.3- Features & Configuration

Installing the PSE Driver on Windows 10

To make the PSE on the K400 system work, we will need to install the PSE driver on the system. The PSE driver is included in the K400 driver package, you can download the package from our Drivers & Downloads section above.

If the PSE driver is not installed, you will find a “Base SystemDevice” with exclamation mark in Device Manager

• Click the “Update Driver” button in Driver tab,

• Then follow the instructions on screen to install the driver.

• Select “Browse my computer for drivers”

• Click on the “Browse” button and navigate to the extracted drivers folder

• Select the top level folder

After clicking on the “OK” button, the driver will be installed.

Then the PSE driver is installed now.

Installing the build tool

We will need to install the VS2022 build tools to compile the PSE sample code. You can install the build tool from https://visualstudio.microsoft.com/downloads/?q=build+tools#build-tools-for-visual-studio-2022

After downloading the installer, install the “Desktop development with C++” option. Then you can build the PSE sample project using cmake from the Visual Studio developer command prompt.

Building

We are ready to compile the PSE sample code. The PSE sample code is available below. Please download it and unzip to the local driver, then run “x86 Native Tools Command Prompt for VS 2022” as Administrator from the start menu.

In the command prompt, navigate to the PSE source code folder and run the following command to build,

mkdir build && cd build

cmake -A Win32 ..

cmake --build .

After build finished, you can find the executable file in <work directory>\build\src\Debug\

The PSE sample code provides examples to use the DIO, CAN, and Automotive features on the system.

Using the PSE

Sample C Code

This PSE sample code demonstrates how to manipulate the DIO interface from C language in Windows 10 environment. You can download the sample C code from here:

Download Sample C Code

Integration

To integrate the PSE function in your own application, you will need to add pse.c (located under /pse_examples/src/win) in your project. Then include pse.h in your source code.

pse.c provides APIs to connect and help to communicate to the PSE engine. The basic work flow is very simple as following diagram,

Using the K400 PSE with Ubuntu for Intel IoT

See our PSE Configuration (Ubuntu) How-To

4.4- MCU Documentation

Automotive Ignition Timings

Feature Overview

The ignition sense feature can be used to turn the Karbon unit on and off with a vehicle’s ignition. It can also be used in non-automotive applications using a switch instead.

An example configuration is shown below for Windows. The switch connects positive DC power to the IGN pin. The unit will turn on when power is applied to the IGN pin, and turn off when power is removed. These events have configurable delays.

Enabling and controlling ignition sense

• Download the control application from the link above

• Run Command Prompt as administrator

• Navigate to the directory where you put the control application.

• Example: In this picture, the HWC file is saved to the Desktop. Navigating there allows access to the file.

• Once you have navigated to the directory that the HWC file is located, execute the following commands in order:

hwc ign set ignition-sense -v 1
hwc ign set low-power-mode -v 1
hwc ign set shutdown-timer -v 10
hwc ign set startup-timer -v 10
hwc ign set hard-off-timer -v 3000

Change Windows Settings

• Ignition sensing simulates a power button press. In Windows, the default behavior of the power button press is to put the system into Sleep mode. You will want to change that to “Shut Down” instead.

• Windows “fast startup” will interfere with ignition sensing, so this should be disabled.

• Power down the system and you can turn it back on by connecting positive power to the IGN pin. This will give you a basic ignition timings setup with 10 second delays. Reference the table below for customizations.

Ignition Sensing Commands

hwc ign set command -v value

hwc ign get command

DIO and CAN

The Karbon K410 and K430 series systems offer CAN bus and (optionally) isolated DIO (Digital Input/Output) support. This functionality is through the processor’s supporting ARM microcontroller, known as the Programmable Services Engine (PSE).

The PSE is isolated from the core processor, runs its own OS (Zephyr RTOS), but can be sent messages over the system’s Host Embedded Controller Interface (or HECI). The Zephyr OS is transparent to the user. This interface may be used to send and receive CAN messages alongside setting and reading the Digital IO. Note: Packages such as SocketCAN are not supported.

Quickstart

Requirements: A K410 or K430 with Windows and the latest HECI driver. The HECI Windows driver is provided and supported by Intel, and will be preinstalled on K410 units purchased with Windows. If Windows is installed by the user, the driver is included with our driver package linked at the top of this page.

Note: We recommend you update to the latest BIOS version for the best compatibility with this application.

1. Download the K410’s hardware control command line application.

2. Open a command window, and navigate to the location of the downloaded file.

   1. Press the Windows Key + R

   2. Type cmd.exe and hit Enter

   3. In the window that opens navigate to the download location:

      1. e.g. cd C:\User\Username\Downloads

3. Display the built-in help text:

   1. hwc.exe --help

DIO Examples

The (optional) MOD110 digital input/output (DIO) expansion adds up to eight digital inputs and outputs to the system, and an additional CAN port. It also optionally provides support for pulse width modulation (PWM) on three of the eight digital output pins, and support for using a quadrature encoder peripheral (QEP) in place of the first and/or second group of three digital inputs.

Application Integration

See Using the K400 PSE with Ubuntu for information about C sample code and a reference on command packing and communication.

The HECI interface uses packed structures to send data between the host and PSE. Specific type structures are provided in the sample code, but an outline of the message format is available below:

5- Support & Compliance

5.1- Troubleshooting & FAQ

Motherboard Reset (Clear CMOS)

If the system fails to power on or output video, clearing the CMOS can often help. To clear the CMOS, the system needs to be opened and an internal switch needs to be pressed.

Opening the system does not void the warranty, however, some precautions are necessary to avoid damaging the unit. Any damaged caused will not be covered by warranty.

• Perform this disassembly in an area free of static discharge

• Before beginning, touch a grounded metal surface to discharge your body of static electricity

• Power off and unplug the system. Disconnect all ports.

• Remove the 4 Torx T8 screws from the bottom of the chassis

• Use a small flathead screwdriver to pry the bottom plate off using the notch.

• Locate the golden clear CMOS button

• Hold down the clear button for 30 seconds.

• Re-assemble the system. Do not over tighten the screws.

• Re-connect the system and power it on.

• Do not touch it for 2 minutes. Wait and see if it outputs video.

• If not, contact OnLogic tech support for an RMA using the button on the right sidebar. >

Windows Bluescreen after BIOS update

After updating to BIOS version A074 or later, Windows may display a Bluescreen error with message “SYSTEM_THREAD_EXCEPTION_NOT_HANDLED”. You will need to adjust the BIOS settings to make it work. Go into the BIOS and change the following x2 options

1. Advanced -> Expert mode -> Enabled

2. Advanced -> RC advanced menu -> PCH-IO Configuration -> PinCntrl Driver GPIO Scheme -> Disabled

Press F10 to save the BIOS settings and reboot. If the OS is able to recover, it should boot up. If not, you may need to reinstall the Windows OS.

Ubuntu boots up slowly / doesn’t turn off completely

If you are having issues with Ubuntu randomly crashing, taking several minutes to boot up, or an issue with not fully turning off, try Enabling the PinCntrl Driver GPIO Scheme:

1. Access the BIOS by pressing DEL while the system is booting up

2. Enable Expert Mode under Advanced

3. Enable Pin Control Driver GPIO Scheme: Advanced/ RC AdvancedMenu/ PCH-IO Configuration/ PinCntrl Driver GPIO Scheme -> Enable

4. Press F10 to Save & Exit

RS422 and RS485 Require SerCx2

Overview

Description

Configuring the system to use RS422 or RS485 serial modes on Windows requires using the SerCx2.sys driver framework. Most existing serial utilities only support the Serial.sys driver framework, requiring the use of Windows APIs to use the RS422/485 serial device.

RS232 serial mode uses the Serial.sys driver framework.

Workaround

A UART Sub-Device driver is available for download, and provides a mapping layer to the Serial.sys driver framework. This driver does not support setting the DTR/DTS hardware lines, which may result in compatibility issues with some software packages, including PuTTy.

Resolution

There are no planned changes to the serial framework.

Digital and Chassis Ground Not Isolated

Overview

Description

For all PCB revisions (5R1-5R5), the SIM slot connects the digital and chassis ground planes, removing isolation between the two. Under normal operating conditions, the function of the motherboard should not be affected.

Customers who rely on chassis ground isolation are recommended to isolate the chassis from earth ground externally.

Resolution

Steps to mitigate the issue will be taken in PCB B01-00005R6 by eliminating the short. The changes are present in F01-x0005R6.

5.2- Regulatory

CE

The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing included: EN 55032, EN 55035, EN 60601-1, EN 62368-1, EN 50121-3-2, and UN Regulation No. 10 ISO 17650-2.

FCC Statement

This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

ISED (Innovation, Science and Economic Development Canada)

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. CAN ICES-003(A) / NMB-003(A)

UKCA

The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.

VCCI

This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI). If this equipment is used in a domestic environment, radio interference may occur, in which case the user may be required to take corrective actions.

Download Documents

5.3- Security Advisory

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories

5.3- Appendices

Revision History