HX310 / HX330

Intel Celeron/Pentium Industrial Edge Computer. This page also applies to the TM260 ThinManager Ready platform.

1- Product Overview

1.1- Introduction

The Helix 300 Series harnesses the enhanced power and capabilities of Intel "Elkhart Lake" Celeron and Pentium processors in a low profile fanless system built for the challenges of the IoT edge. With support for triple independent 4K displays, a 0°C to 50°C operating temperature range, and a wealth of configuration options, the Helix 310 and Helix 330 were engineered with versatility in mind. The systems also feature compliance testing for IT Equipment EMC and Safety and pre-compliance testing for IEC 60601-1-2 (4th edition) medical immunity.

1.2- Safety

Safety Precautions, Safeguards & Information

Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.

Modification of the device may void certifications, warranty and/or cause possible injury to the user.

Safe use and installation instructions

  1. Care must be taken handling the device to prevent injury to self or possibility of damaging the unit.

  2. Read the entire manual before using the product.

  3. Install the device securely per users manual instructions.

  4. To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.

  5. Wall or ceiling mounting device requires use of OnLogic mounting plate or bracket.

  6. Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.

  7. Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or enclosure during operation and 30 minutes after shutdown allowing the unit to cool down.

  8. Ambient operating temperature must be between 0 °C to 40 °C with a non-condensing relative humidity of 10-85%.

  9. The device can be stored at temperatures between -10 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, minimum 3HR.

  10. Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.

  11. Do not clean the device with liquids. The chassis can be cleaned with a dry cloth or duster only. To prevent injury to self and/or damage to the device the unit must be powered down and all connecting power and other peripherals shall be disconnected prior to cleaning.

  12. Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then recommended device orientation is such that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.

  13. This device is intended for indoor operation only.

  14. Caution, Risk of Electric Shock! Unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!

  15. To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC, see specs for details.

  16. Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.

  17. Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.

  18. Install the device only with shielded network cables.

  19. The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.

  20. Radio device is not intended for emergency service use.

  21. Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.

  22. Proper disposal of CMOS battery must comply with local governance.

  23. Product must only be connected to a certified router, switch or similar network equipment

  24. Product is intended for indoor use only.

  25. Product cannot be connected to the public network.

  26. This equipment is not suitable for use in locations where children are likely to be present.

WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion

Précautions et guide d’installation

Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.

La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures à l'utilisateur.

.

  1. Des précautions doivent être prises lors de la manipulation de l'appareil pour éviter de se blesser ou d'endommager l'appareil.

  2. Lisez l'intégralité du manuel avant d'utiliser le produit.

  3. Installez l'appareil en toute sécurité selon les instructions du manuel de l'utilisateur.

  4. Pour vous protéger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes double bande fournies avec un gain de 2 dBi/2 dBi.

  5. Le dispositif de montage mural ou au plafond nécessite l'utilisation d'une plaque ou d'un support de montage. La plaque ou le support doit être en métal et avoir une épaisseur minimale de 1 mm.

  6. Utilisez des vis à tête plate M4x0,5 mm pour fixer la plaque de montage ou les supports de montage aux trous filetés au bas ou à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support au-delà de 1,5 mm.

  7. Attention surface chaude! Il est normal que l'appareil chauffe et soit chaud au toucher. Ne touchez pas la zone du dissipateur thermique ou le boîtier pendant le fonctionnement et 30 minutes après l'arrêt pour permettre à l'unité de refroidir.

  8. La température ambiante de fonctionnement doit être comprise entre 0 °C et 40 °C avec une humidité relative sans condensation de 10 à 85 %.

  9. L'appareil peut être stocké à des températures comprises entre -10 °C et 85 °C. Remarque : L'unité doit être stabilisée à la température de fonctionnement avant utilisation, minimum 3 heures.

  10. Gardez l'appareil à l'écart des liquides et des matériaux inflammables. Ne pas installer dans un environnement dangereux.

  11. Ne nettoyez pas l'appareil avec des liquides. Le châssis peut être nettoyé uniquement avec un chiffon sec ou un plumeau. Pour éviter de se blesser et/ou d'endommager l'appareil, l'appareil doit être éteint et toutes les alimentations et autres périphériques doivent être déconnectés avant le nettoyage.

  12. Prévoyez un espace suffisant autour de tous les côtés de l'appareil pour un refroidissement correct et pour ne pas dépasser sa limite de température de fonctionnement maximale. Si l'appareil est monté sur une surface verticale, l'orientation recommandée de l'appareil est telle que les ailettes du dissipateur thermique permettent à l'air de monter sans obstruction. Des orientations alternatives peuvent entraîner une plage de températures de fonctionnement réduite.

  13. Cet appareil est destiné à une utilisation en intérieur uniquement.

  14. Attention, risque de choc électrique ! L'unité est alimentée uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) à l'appareil !

  15. Pour alimenter l'appareil, utilisez uniquement des alimentations externes répertoriées UL ITE avec une sortie CC de 12-24 VCC, voir les spécifications pour plus de détails.

  16. Les méthodes de câblage utilisées pour le raccordement de l'équipement à l'alimentation secteur doivent être conformes au Code national de l'électricité, NFPA 70, et au Code canadien de l'électricité, Partie I, CSA C22.1.

  17. Prévoyez suffisamment d'espace pour les connexions de câblage du bornier afin que les fils ne se plient pas et soient protégés contre les dommages accidentels.

  18. Installez l'appareil uniquement avec des câbles réseau blindés.

  19. L'installateur doit avoir de l'expérience dans l'installation de pièces de rechange et être familiarisé avec les pratiques générales d'installation de composants électroniques.

  20. L'appareil radio n'est pas destiné aux services d'urgence.

  21. L'entretien et la réparation de l'appareil doivent être effectués par un personnel qualifié. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être du même type que celle d'origine.

  22. L'élimination appropriée de la batterie CMOS doit être conforme à la gouvernance locale.

  23. Le produit doit uniquement être connecté à un routeur, un commutateur ou un équipement réseau similaire certifié

  24. Le produit est destiné à une utilisation en intérieur uniquement.

  25. Le produit ne peut pas être connecté au réseau public.

  26. Cet équipement n'est pas adapté à une utilisation dans des endroits où des enfants sont susceptibles d'être présents.

ATTENTION: Il existe un risque d'explosion si la pile CMOS n'est pas remplacée correctement. L'élimination de la batterie dans le feu ou dans un four chaud, ou l'écrasement ou le découpage mécanique d'une batterie peut entraîner une explosion.

1.3- Box Contents & Accessories

  • 4x Rubber Feet

  • Power cable retention clip

If you purchased additional items such as mounting brackets, power supplies or terminal block connectors, they will be located in the system box or within the outer shipping carton. All drivers and product guides can be found on the corresponding product page. For more information on accessories and additional features, visit the Helix Product pages.

1.4- Product Specifications

Radio Specifications when equipped with INT-9260 Wifi/BT (device for indoor use)

*Note: Limited RS422/485 capability. See Appendix H for details.

2- Technical Specifications

2.1- External Features

Front I/O

HX310 with COM option
HX310 with Antenna option
HX310 with DIO option
HX330 with additional LAN option

Rear I/O

HX310 (HX330 has the same connector orientations and locations on the motherboard)

2.2- I/O Definitions

Front I/O Definition

Power Button / Power LED

The front power button can be used to turn on and off the Helix system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset of the system. The system can be woken by a single press of the power button from any state. The LED backlight will indicate the system status. A solid blue light indicates that the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.

SIM Card

A 3FF Subscriber Identity Module (SIM) card slot is present on the front panel of the Helix platform allowing native support for OnLogic cellular modules. The SIM signals are connected to the M.2 B-Key internal expansion slot. In order to access the SIM Slot, the Modbay panel and bottom plate must first be removed. The Modbay panel is secured by two screws on either side, pictured above in the “Front I/O Definition” section. The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card from the front panel of the Helix platform, please use a small implement to push the card into the slot until it clicks. To remove the card, push with a small implement until the card clicks, then pull on the free end of the card to remove it.

COM DB9 Option The serial port mode on Helix can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-85 configurations. Refer to the BIOS manual for configuration instructions.

COM DB9 Option

The serial port mode on Helix can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-85 configurations. Refer to the BIOS manual for configuration instructions.

COM DB9 pinout

CAN DB9 Option

The CAN port on Helix supports CAN2.0 A/B at baud rates from 100-100 kbaud. The system CAN port is not internally terminated, and a properly terminated (120 Ohms, typical) cable should be used. CAN messages may be sent and received through the sideband Programmable Services Engine, via the Host Embedded Controller Interface (HECI). Windows drivers are available for this interface, and a command line tool is available for download.

CAN DB9 pinout

USB 3.2

There is one USB 3.2 Gen 2 port on the front panel of the Helix platform. This port is capable of linking at 10Gb/s transfer rates.

USB 2.0

There is one USB 2.0 port on the front panel of the Helix platform. This port is capable of linking at 480 Mb/s transfer rates.

DIO Option

The Helix platform supports an optional Isolated Digital I/O add-in card through a 10-pin terminal block (Mating connector: Phoenix Contact pn: #1840447 or similar). This option allows for integration of the Helix platform with existing PLC integrations or other digital logic applications. The Digital IO may be managed through the sideband Programmable Services Engine, via the Host Embedded Controller Interface (HECI). Windows drivers are available for this interface, and a command line tool is available for download from our support website. For a complete explanation of features, operating voltages, and safety information, please refer to the DIO expansion manual on the OnLogic support site.

Pin 10
Pin 9
Pin 8
Pin 7
Pin 6
Pin 5
Pin 4
Pin 3
Pin 2
Pin 1

GND

In 4

In 3

In 2

In 1

Out 4

Out 3

Out 2

Out 1

Power

Dual LAN Option (HX330)

The HX330 supports up to two additional LAN ports on the front Modbay slot of the system. Both ports are Intel I210 network controllers.

Rear I/O Definition

Barrel Jack Power Connector

Mainboard power is applied to the Helix platform by way of a female barrel jack connector (OD: 5.5mm ID: 2.5mm. 12mm length ). The system is operational from 9V~24V at 5 amps, 12V only operation is at 3A. The maximum rated current of the connector is 7A. Use a wire gauge that is rated for the operational current.

Barrel Jack power pinout

DisplayPort 1, 2, &3

Helix utilizes Intel’s Integrated Gen 11 processor graphics that power the onboard DisplayPorts. This means resolutions up to 4096x2160 @ 60Hz are supported on all three outputs simultaneously. All ports support Multi-Stream Transport (MST).

LAN1 - MaxLinear GPY115 PHY

Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. This is done using the Integrated MAC and the MaxLinear GPY115 PHY. The connector is the industry standard RJ45 connector. The LAN link state and activity is shown by the two LEDs enclosed in the port. The description is included below.

LAN2 - MaxLinear GPY115 PHY

The second LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state and activity is shown by the two LEDs enclosed in the port. The description is included below. The second LAN port is available only with the Pentium J6426 CPU option.

USB 3.2

The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2 ports, capable of linking at 10Gb/s transfer rates.

Terminal block power option

If the terminal block power option is selected, mainboard power is applied to the Helix platform through a 4-pin terminal block connector (Mating part: Phoenix Contact #1840382 or equivalent).

The system is operational from 9V~24V at 5 amps, 12V operation is at 3A. The maximum rated current of the connector is 6A per pin. Use a wire gauge that is rated for the operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal block with tinned wire ends or solid core wire. Always follow the part number tightening torque and wire sizing specifications to prevent damage to connector systems and PC. See below for connector pinout.

When using the remote switch connections with the terminal block option, mating power switch cables should be a twisted-pair wire with floating shield to assure proper immunity to EMI/RFI. It is recommended to keep wires at less than 3 meters in length. Switches should be momentary contact type only.

Expansion Port Pinout

M.2 B-Key

M.2 E-Key

M.2 M-Key

2.3- Motherboard Connectors

The motherboard is the same for HX310 and HX330. The second LAN port is only available for configurations with the Pentium J6426 CPU option.

Motherboard bottom view (Heatsink side)

M.2 B-Key

An M.2 B-Key port is present on the Helix motherboard to allow support for B-Key form-factor expansion cards. Supported cards include 3042, 2242, 2260, 2280 form-factors. The B-Key connector on the Helix platform supports PCIe Gen 3 x1, USB 3.2 5Gb/s, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.

The 3FF Micro SIM card slot is available for OnLogic 4G Extrovert modules.

M.2 E-Key

An M.2 E-Key port is present on the Helix motherboard to allow support for E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector on the Helix platform supports PCIe Gen 3 x1 and USB 2.0.

M.2 M-Key

An M.2 M-Key port is present on the Helix motherboard to allow support for M-Key form-factor expansion cards. Only 2280 form-factor cards are supported. The M-Key connector on the Helix platform includes support for PCIe Gen 3 x2, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.

SO-DIMM1 & SO-DIMM2

The Helix platform has two onboard DDR4 SO-DIMM Slots. Below find the specifications of the two SO-DIMM Slots:

  • Maximum Capacity: DDR4-3200 32GB with two 16GB SO-DIMM Modules

  • Channel configuration: 1DIMM Per Channel (DPC) - 2 Channels

  • No ECC Support

COM1 & COM2

The two on-board COM headers utilize standard 9-pin 2.54mm pitch male pin headers with the pin configuration in the chart below. These serial ports support RS-232, RS-422 Full-Duplex, and RS-485 half-Duplex configurations. The serial port communication mode can be selected in the BIOS configuration. Refer to the BIOS manual (Appendix C) for configuration instructions.

CAN

The on-board CAN transceiver headers utilize standard 9-pin 2.54mm pitch male pin headers with the pin configuration in the chart below. Refer to the CAN user guide for configuration instructions.

Power Switch Header

The on-board power switch header can be used to control the power state of the Helix platform in parallel with the front panel power button. Mating power switch cables should be a twisted-pair wire with floating shield to assure proper immunity to EMI/RFI. Mating connector is a standard 2.54mm female header. It is recommended to keep wires at less than 3 meters in length. Switches must be momentary contact type only.

ATX/CMOS Jumper Header

A 2mm pin header and jumpers are used to clear the CMOS settings and select the hardware auto power-on behavior of the Helix platform.

ATX mode can be selected by moving the pin jumper to connect pins 3 and 5 will select ATX power mode. The system power-on will be controlled by the system power button or other supported wake events. When the pin jumper is moved to connect pins 1 and 3, the system will operate in AT mode, where the system will power on when system power is first applied. The default selection is ATX mode.

The system CMOS settings can be cleared with the second pin jumper. To clear the CMOS the following steps shall be followed:

  1. Disconnect system power.

  2. Place jumper in the “clear” position.

  3. Wait 10 seconds.

  4. Remove jumper from the “clear” position and return to default position

RTC Battery Header

The RTC battery on the Helix platform is used to retain BIOS CMOS settings and maintain the real-time clock for the system. If the RTC battery is low, CMOS settings will not be retained and you may receive an alert in the operating system. The cabled RTC battery should be replaced with a Maxell CR2032-WK11 (or UL listed equivalent). An equivalent battery shall use a Hirose DF13-2S-1.25c connector to mate with the on-board connector.

TPM Header

Helix features an onboard TPM (Trusted Platform Module) header. Helix supports OnLogic’s module (OnLogic part TPM01) featuring TPM 2.0. This gives the option to have a dedicated secure module to secure Helix through cryptographic keys.

Fan Header

The on-board fan header can power and control any five volt three or four-wire fan (including variable-speed PWM fans) using the standard pin configuration in the chart below. Three-wire fans will only connect to pins 1-3. This header utilizes a standard 4-pin 2.54mm pitch fan connector with a small retention tab. Any mating connector with the standard form factor, such as Molex part number 0470541000, can be used to connect a fan. Most CPU and case fans utilize this connector and pinout. The 5V pin on this connector can provide up to 1A of current.

USB 2.0 Header

The on-board USB 2.0 header provides a single USB 2.0 signal. It utilizes a standard 4-pin 2.54mm pitch male pin connector with the pin configuration in the chart below. The 5V power pin (Pin 1) can provide up to 1A of current.

Power Input Header

Mainboard power can be applied to the Helix platform by way of the 4-pin JST XH-4 connector (Mating part: JST XHP-4 or equivalent). The system is operational from 8V~24V. The maximum rated current of the connector is 3A per pin. Use a wire gauge that is rated for the operational current. See below for connector pinout.

Supplemental 5V Power Output

Additional 5V power can be supplied (to internal devices only) by use of the 2-pin header on the motherboard. The maximum rated current of the connector is 2A per pin. Use a wire gauge that is rated for the operational current. See below for connector pinout.

2.4- Processor

Two CPU options are available for both the HX310 and HX330 models:

  • Celeron N6211: 2-core processor.

  • Pentium J6426: 4-core processor.

The second onboard LAN port is standard on configurations with the Pentium J6426 processor.

2.5- Power Management

Average Power Consumption

The power consumption of the HX310 system was measured for various system configurations, workloads, and power states at both 12V and 24V system input voltages. Tests were performed using Burnintest v9.0 build 1012 to stress system components with and without graphics enabled. The build configurations and power consumption are listed in the tables below.

*The configurations below are using representative samples of internal devices, the specific components mentioned below may vary from the devices provided by OnLogic. The power consumption for each system configuration is record below.

Protection Circuitry

These DC levels specified are the absolute max values for the pins for function and safety of the system. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.

Wake-Up Events

The Helix platform supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters. Low power shutdown is an additional option in the BIOS.

Auto Power On

The system can be configured to turn on automatically when DC power is connected. This is useful for power outage recovery or if the unit is mounted in a hard to reach location. You can enable Auto Power On by following the steps listed below.

  • Follow the Internal Access instructions.

  • Locate the jumper shown in purple

  • The bottom jumper in the below image (closest to the outside of the system) controls auto power on. It is called the AT/ATX jumper.

  • Use needlenose pliers or your fingernails to grab the jumper and remove it from the pins.

  • Reinstall the jumper as shown, Auto power on is now enabled (AT Mode)

2.6- Add-in Modules

  • Isolated DIO: Additional information for the Isolated DIO can be found here.

  • CAN Bus: An optional CAN DB9 port is available, supporting CAN2.0 A/B.

  • Cellular: OnLogic 4G modules are supported via the M.2 B-Key slot and the front-panel SIM slot.

  • Dual LAN: The HX330 supports two additional Intel I210 LAN ports in the front Modbay.

2.7- Thermal Results

The thermal performance of the Helix platform was validated by fully loading system components while the test system was exposed to the limits of its rated environment (0C-50C). CPU clock speeds and core temperatures were measured for the duration of the test. The results were analyzed by comparing the average clock speed over the duration of the test to the rated base clock speed. A passing result was defined by an average clock speed no less than 20% of the rated base clock and operation below the CPU Max temperature limit.

HX300 -Elkhart Lake SKU 3 1800mhz base clock 50C-0C Thermal Testing Graph - The image below shows the thermal test results from an HX300 in a thermal chamber over the course of 20 hours at a workload of 100%. After 17 Hours the 50C thermal chamber was brought down to 0C.

50°C Ambient Performance

Item Tested
Pass Condition
Test Result
Delta

CPU Temp.

<100°C

95°C

5°C

Restarted

<1 times

0 Times

100%

Avg. CPU Freq.

>1400 MHz

1648 MHz

+9%

0°C Ambient Performance

Item Tested
Pass Condition
Test Result
Delta

CPU Temp.

<100°C

49.9°C

50.1°C

Restarted

<1 times

0 Times

100%

Avg. CPU Freq.

>1400 MHz

1596 MHz

+11.1%

2.8- Block Diagram


3- Installation & Mechanical

3.1- Dimensions

Helix 300 Dimensions (HX310/HX330)

3.2- Mounting

Wall Mount & DIN Rail Mounting

Step 1: Attach wall mounting brackets MTW101 (no DIN), MTW101-K (DIN), MTW107 (Vertical DIN), VMPL-1041 (VESA) to the chassis using the supplied screws. Specifications can be found below:

Screw type: M3X0.5 FH 120 Degree Screw

Length: 4 mm

Step 2: Locate the 4 holes that line up accordingly to the bracket as shown below.

Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.

Step 4 (for DIN Bracket): Using the outer 2 holes of the 3 hole set on the wall mount bracket, line up the DIN bracket.

Step 5 (for DIN Bracket): Using the supplied screws, using a Phillips head screwdriver, mount the DIN bracket to the bracket.

Step 6 (for DIN Bracket): Mount system onto the DIN rail.

VESA Mounting

Step 1: Attach wall mounting brackets to the chassis using:

Screw type: M3X0.5 FH 120 Degree Screw

Length: 4 mm

Step 2: Locate the 4 holes that line up accordingly to the bracket as shown

Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.

3.3- Internal Access

Opening the system does not void the warranty, however, some precautions are necessary to avoid damaging the unit. Any damaged caused will not be covered by warranty.

  • Perform this disassembly in an area free of static discharge

  • Before beginning, touch a grounded metal surface to discharge your body of static electricity

4- Software & Firmware

4.1- BIOS

BIOS manual

For the full BIOS manual, please click here.

Update the BIOS with the file(s) below. You can follow this how-to guide for installation instructions.

4.2- Drivers & Downloads

BIOS Updates

BIOS Version
Release Date
Changelog
Link

A076P154

2025-03-18

Resolved Iris LAN port connection dropping issue.

A075P154

2024-03-27

Resolved issues with accessing and using the PSE feature. Includes routine stability updates.

Drivers

Version
Release Date
Release Date
Notes

Hardware Control Application (HWC)

Version
Link
Link
Release Notes

v1.2.1

10/11/2023

Download HWC Program must run as administrator in CMD

Fixes issue with Version-Check warning. * Note that the CAN baudrate is fixed at 1M. Please see our C-Based PSE-Examples for setting the baudrate programmatically.

Make sure your system’s drivers are installed and up-to-date.

Linux Support

This model uses the new Intel GPY115/EC1000S Ethernet controller provided by the Elkhart Lake platform. Some operating systems are not compatible, or require additional setup by the user for this Ethernet controller. *For systems purchased before March 1st 2023, Ubuntu can be installed after the Ethernet firmware has been updated. Customers interested in this can contact OnLogic Tech Support to RMA the system for this update.

4.3- Features & Configuration

Digital IO & CAN

The Helix 300 and 310 systems offer optional CAN bus and isolated Digital IO support. This functionality is through the processor’s supporting ARM microcontroller, known as the Programmable Services Engine (PSE).

The PSE is isolated from the core processor, runs its own OS (Zephyr RTOS), but can be sent messages over the system’s Host Embedded Controller Interface (or HECI). The OS is transparent to the user. This interface may be used to send and receive CAN messages alongside setting and reading the Digital IO.

Quickstart

Requirements: An HX300 or HX310 with Windows and the latest HECI driver. The HECI Windows driver is provided and supported by Intel, and will be preinstalled on HX300 units purchased with Windows. If Windows is installed by the user, the driver is included with our driver package linked at the top of this page.

  1. Download the HX300’s Hardware Control Application (HWC).

  2. Open a command window, and navigate to the location of the downloaded file.

    1. Press the Windows Key + R

    2. Type cmd.exe and hit Enter

    3. In the window that opens navigate to the download location:

      1. e.g. cd C:\User\Username\Downloads

  3. Display the built-in help text:

    1. hwc.exe --help

DIO Examples

The (optional) MOD110 digital input/output (DIO) expansion adds up to eight digital inputs and outputs to the system, and an additional CAN port. It also optionally provides support for pulse width modulation (PWM) on three of the eight digital output pins, and support for using a quadrature encoder peripheral (QEP) in place of the first and/or second group of three digital inputs.

See our dedicated DIO article on how to get started with the MOD110 expansion module. The HX300 series utilizes the MOD106 DIO, however the PSE controls are the same for both parts and both are opto-isolated modules so this guide can be used for both.

Application Integration

The HECI interface uses packed structures to send data between the host and PSE. Specific type structures are provided in the sample code, but an outline of the message format is available below:

Bits

Description

0 – 7

HECI Command Identifier: 0x01: System Information: 0x02: Digital IO 0x04: Can Bus

8

Set as ‘1’ if this message is a response from the PSE

9

Set as ‘1’ if this message contains a valid data body

10 – 25

Packed ‘argument’ for a given command. Format depends on the command identifier.

26 – 31

Status of last command

32 – 39

Data format of body: 0: Raw data 1: Version information 2: CAN message 4: DIO message 7: ASCII String

40 – 168

Body of message data, usually in the form of another packed structure.

Input Impedance

Each digital input has a 10K internal pullup and a 10K series resistor.

TM260 ThinManager Firmware

The TM260 (the HX330 with ThinManager Ready firmware) is compatible with ThinManager 11 or higher. Customers interested in the ThinManager WiFi Boot option should use ThinManager 13.2 to enable this feature. Checkout our OnLogic Blog with more info about ThinManager WiFi Boot.

The TM260 requires version 14 of the Terminal Capability Database (TermCap) in order to properly download the firmware it needs to function. Customers can follow this Installation Guide to perform this update for their systems.

Using the TPM 2.0 Module

As with other newer model systems, this model includes a firmware TPM by default. It functions similarly to a TPM 2.0 module. If the optional dedicated TPM 2.0 module is added to the system, the firmware TPM will need to be disabled to allow it to function.

The firmware TPM can be disabled in the BIOS:

  1. Power on the system and press Del to enter the Front Page menu.

  2. Select Setup Utility.

  3. Navigate to the Advanced tab and open Chipset Configuration.

  4. Disable Platform Trust Technology.

  5. Press F10 to save and exit.

The dedicated TPM should now be functional and detectable in TPM.MSC or Device Manager.

5- Support & Compliance

5.1- Troubleshooting & FAQ

Clear CMOS

If your unit fails to boot or power on, a CMOS reset may help. You will need to open the unit to perform the reset. This does not void your warranty, however, any damage caused by doing so will not be covered. Ensure your body is discharged of any static electricity by touching a grounded metal surface.

  • Follow the Internal Access guidance.

  • Locate the jumper shown below.

  • The top jumper will clear the CMOS

  • Use needlenose pliers or your fingernails to grab the jumper and remove it from the pins.

  • Reinstall the jumper as shown and leave in place for 30 seconds.

  • Restore the jumper to its original position.

Replacing the CMOS battery

  • Follow the Internal Access guidance

  • The CMOS battery is held in by a light adhesive. Pull the battery off the board and take care not to damage any components on the board.

  • Pull the wire straight up to unplug the battery from the board.

  • Plug the new battery into the board.

  • Peel off the adhesive and stick in place to eliminate movement.

  • The BIOS settings and time will be reset when the unit is powered back on.

Ubuntu boots up slowly/Doesn't turn off completely

If you are having issues with Ubuntu randomly crashing, taking several minutes to boot up, or an issue with not fully turning off, try Enabling the PinCntrl Driver GPIO Scheme:

  1. Access the BIOS by pressing DEL while the system is booting up.

  2. Enable Expert Mode under Advanced

  1. Enable Pin Control Driver GPIO Scheme: Advanced/ RC AdvancedMenu/ PCH-IO Configuration/ PinCntrl Driver GPIO Scheme / Enabled

  2. Press F10 to Save & Exit

Preparing for Ubuntu Installation

While Ubuntu Linux is supported on the HX3XX series platform, in order to enable the on-board Programmable Services Engine (PSE) , the following BIOS update must take place.

Step 1: Enter the BIOS and Enable Expert Mode

Step 2: Enable Pin Control Driver GPIO Scheme

Advanced/RC Advanced Menu/PCH-IO Configuration/PinCntrl Driver GPIO Scheme = Enabled

Step 3: (Optional) Re-Disable Expert Mode

Advanced/Expert Mode = Disabled

For further support on Ubuntu Linux please refer to this resource: Ubuntu Linux - first login and reinstallation

PXE Boot Issue

To support PXE (network boot), update your system to the latest BIOS revision available. Note that any operating system booted over PXE will also need Ethernet drivers in order to function.

Frequently Asked Questions (FAQ)

How much power does the system draw?

The system draws approximately 26 watts at full load. We recommend a 36 watt or higher power supply.

What are the electrical limits on the optional DIO expansion?

The operating voltage is 5-48v with isolation. The amperage limit is 150mA.

Where can I find the mating connector for my terminal block power port?

You can find a replacement online here.

Errata (Known Issues)

  • IP-1: RS422 and RS485 Require SerCx2:

    • Description: On Windows, RS422/485 modes require the SerCx2.sys driver framework, which is not supported by all serial utilities.

    • Workaround: A UART Sub-Device driver is available for download to map to the Serial.sys framework, though it has limitations (e.g., no DTR/DTS line support).

  • IP-2: System May Power On After Power Interruption:

    • Description: The system may power on unexpectedly after an input power brownout or glitch.

    • Resolution: Investigating.

  • IP-3: Wake-On-LAN Does Not Function:

    • Description: The Wake-On-LAN feature does not wake the system from any power state.

    • Resolution: Investigating.

5.2- Regulatory

CE

This device has been tested to the relevant EMC and Safety standards. Modifications by the user may invalidate certifications. Testing included EN 55032, EN 55035, EN 60601-1, EN 62368-1, and IEC 60945 Ed. 4.

FCC Statement

This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.

ISED (Innovation, Science and Economic Development Canada)

This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

CAN ICES-003(A) / NMB-003(A)

UKCA

The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.

VCCI

This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI). If this equipment is used in a domestic environment, radio interference may occur, in which case the user may be required to take corrective actions.

Download Documents

5.3- Security Advisory

For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories

5.4- Appendices

Revision History

Revision History

Date

First release of HX300 manual

8/4/2021

Update errata list

8/12/2021

Update including radio transmitter info, VCCI, RF, Safety info, and power supply info

1/25/2022

CEC Module Removal

04/21/2022

Updated Drawings

05/13/2022

Update Graphs & Appendices

07/28/2022

Updating SIM Slot Info

09/15/2022

Update errata list

01/10/2023

Serial Port Clarification

4/27/2023

VESA Wall Mount Correction

6/7/2023

IO Clarification

7/3/2023

COM and CAN Pin Update

12/02/2024

Last updated