HX511
1- Product Overview
1.1- Introduction
The OnLogic HX511 expands on the Helix product range, and leverages Intel® 12th generation Alder Lake PS processing into a powerful fanless system.
The HX511 offers increased compute power and visual processing capabilities, encased in Hardshell™ Fanless Technology. Additionally, it offers optional expansion options via reliable, cableless add-on cards. With quad video output, a wide power range, and high processing power, the HX511 is equipped to handle a wide variety of applications.
1.2- Safety
Safety Precautions, Safeguards & Information
Do not open and modify the device! The device complies with various national and international Safety, EMC and Environmental requirements per various standards.
Modification of the device may void certifications, warranty and/or cause possible injury to the user.
Safe use and installation instructions
Care must be taken handling the device to prevent injury to self or possibility of damaging the unit.
Read the entire manual before using the product.
Install the device securely per users manual instructions.
To protect against excessive RF exposure, maintain at least 20cm from any user and the RF antennas. Only use provided dual band antennas of 2dBi/2dBi gain.
Wall or ceiling mounting device requires use of OnLogic mounting plate or bracket.
Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom or rear of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.
Caution, Hot Surface! It is normal for the unit to heat up and be hot to touch. Do not touch the heatsink area or enclosure during operation and 30 minutes after shutdown allowing the unit to cool down.Ambient operating temperature must be between 0 °C to 50 °C with a non-condensing relative humidity of 10-85%.
The device can be stored at temperatures between -10 °C to 85 °C. Note: Unit must be stabilized within operating temperature before use, minimum 3HR.
Keep the device away from liquids and flammable materials. Not to be installed in a hazardous environment.
Do not clean the device with liquids. The chassis can be cleaned with a dry cloth or duster only. To prevent injury to self and/or damage to the device the unit must be powered down and all connecting power and other peripherals shall be disconnected prior to cleaning.
Allow adequate space around all sides of the device for proper cooling and to not exceed its maximum operating temperature limit. If the device is mounted to a vertical surface then recommended device orientation is such that heatsink fins allow air to rise unobstructed. Alternative orientations may result in reduced operational temperature range.
This device is intended for indoor operation only.
Caution, Risk of Electric Shock! Unit is powered by low voltage DC (Direct Current) only! Do not connect AC (Alternating Current) into the device!To power the device use only UL ITE Listed external power supplies with DC output of 12-24VDC, see specs for details.
Wiring methods used for the connection of the equipment to the mains supply shall be in accordance with the National Electrical Code, NFPA 70, and the Canadian Electrical Code, Part I, CSA C22.1.
Allow ample space for terminal block wiring connections such that the wires do not bend and are protected from accidental damage.
Install the device only with shielded network cables.
The installer should be experienced in aftermarket installation and familiar with general practices for installing electronics.
Radio device is not intended for emergency service use.
Service and repair of the device must be done by qualified service personnel. This includes, but is not limited to, replacement of the CMOS battery. Replacement CMOS battery must be of the same type as the original.
Proper disposal of CMOS battery must comply with local governance.
Product must only be connected to a certified router, switch or similar network equipment
Product is intended for indoor use only.
Product cannot be connected to the public network.
This equipment is not suitable for use in locations where children are likely to be present.
WARNING: There is danger of explosion if the CMOS battery is replaced incorrectly. Disposal of battery into fire or a hot oven, or mechanically crushing or cutting of a battery can result in an explosion.
Précautions et guide d’installation
Ne pas ouvrir et modifier l'appareil ! L'appareil est conforme à diverses exigences nationales et internationales en matière de sécurité, de CEM et d'environnement selon diverses normes.
La modification de l'appareil peut annuler les certifications, la garantie et/ou causer des blessures à l'utilisateur.
Des précautions doivent être prises lors de la manipulation de l'appareil pour éviter de se blesser ou d'endommager l'appareil.
Lisez l'intégralité du manuel avant d'utiliser le produit.
Installez l'appareil en toute sécurité selon les instructions du manuel de l'utilisateur.
Pour vous protéger contre une exposition RF excessive, maintenez au moins 20 cm de tout utilisateur et des antennes RF. Utilisez uniquement les antennes double bande fournies avec un gain de 2 dBi/2 dBi.
Le dispositif de montage mural ou au plafond nécessite l'utilisation d'une plaque ou d'un support de montage. La plaque ou le support doit être en métal et avoir une épaisseur minimale de 1 mm.
Utilisez des vis à tête plate M4x0,5 mm pour fixer la plaque de montage ou les supports de montage aux trous filetés au bas ou à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support au-delà de 1,5 mm.
Attention surface chaude! Il est normal que l'appareil chauffe et soit chaud au toucher. Ne touchez pas la zone du dissipateur thermique ou le boîtier pendant le fonctionnement et 30 minutes après l'arrêt pour permettre à l'unité de refroidir.La température ambiante de fonctionnement doit être comprise entre 0 °C et 50 °C avec une humidité relative sans condensation de 10 à 85 %.
L'appareil peut être stocké à des températures comprises entre -10 °C et 85 °C. Remarque : L'unité doit être stabilisée à la température de fonctionnement avant utilisation, minimum 3 heures.
Gardez l'appareil à l'écart des liquides et des matériaux inflammables. Ne pas installer dans un environnement dangereux.
Ne nettoyez pas l'appareil avec des liquides. Le châssis peut être nettoyé uniquement avec un chiffon sec ou un plumeau. Pour éviter de se blesser et/ou d'endommager l'appareil, l'appareil doit être éteint et toutes les alimentations et autres périphériques doivent être déconnectés avant le nettoyage.
Prévoyez un espace suffisant autour de tous les côtés de l'appareil pour un refroidissement correct et pour ne pas dépasser sa limite de température de fonctionnement maximale. Si l'appareil est monté sur une surface verticale, l'orientation recommandée de l'appareil est telle que les ailettes du dissipateur thermique permettent à l'air de monter sans obstruction. Des orientations alternatives peuvent entraîner une plage de températures de fonctionnement réduite.
Cet appareil est destiné à une utilisation en intérieur uniquement.
Attention, risque de choc électrique ! L'unité est alimentée uniquement par une basse tension CC (courant continu) ! Ne connectez pas le courant alternatif (courant alternatif) à l'appareil !Pour alimenter l'appareil, utilisez uniquement des alimentations externes répertoriées UL ITE avec une sortie CC de 12-24 VCC, voir les spécifications pour plus de détails.
Les méthodes de câblage utilisées pour le raccordement de l'équipement à l'alimentation secteur doivent être conformes au Code national de l'électricité, NFPA 70, et au Code canadien de l'électricité, Partie I, CSA C22.1.
Prévoyez suffisamment d'espace pour les connexions de câblage du bornier afin que les fils ne se plient pas et soient protégés contre les dommages accidentels.
Installez l'appareil uniquement avec des câbles réseau blindés.
L'installateur doit avoir de l'expérience dans l'installation de pièces de rechange et être familiarisé avec les pratiques générales d'installation de composants électroniques.
L'appareil radio n'est pas destiné aux services d'urgence.
L'entretien et la réparation de l'appareil doivent être effectués par un personnel qualifié. Cela inclut, mais sans s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être du même type que celle d'origine.
L'élimination appropriée de la batterie CMOS doit être conforme à la gouvernance locale.
Le produit doit uniquement être connecté à un routeur, un commutateur ou un équipement réseau similaire certifié
Le produit est destiné à une utilisation en intérieur uniquement.
Le produit ne peut pas être connecté au réseau public.
Cet équipement n'est pas adapté à une utilisation dans des endroits où des enfants sont susceptibles d'être présents.
ATTENTION: Il existe un risque d'explosion si la pile CMOS n'est pas remplacée correctement. L'élimination de la batterie dans le feu ou dans un four chaud, ou l'écrasement ou le découpage mécanique d'une batterie peut entraîner une explosion.
1.3- Box Contents & Accessories
4x Rubber Feet
If you purchased additional items such as mounting brackets, power supplies or terminal block connectors, they will be located in the system box or within the outer shipping carton.
All drivers and product guides can be found on the corresponding product page. For more information on accessories and additional features, visit the HX511 product page at https://www.onlogic.com/hx511/.
1.4- Product Specifications
Model
HX511
System Dimensions
8.86" x 2" x 6.97"
225 x 50.8 x 177 mm
System Weight
4.94 lbs
2.24 kgs
Board Dimensions
8.7" x 6.1"
221 x 156 mm
CPU (on solder side of board)
Socket LGA 1700 - Alder Lake PS
PCH
PS Integrated
Memory
2 x SO-DIMM DDR5 (2 x 32GB max Dual Channel) 64 GB Total
LAN Controller
1x Intel i225-LM -with AMT
1x Intel I225-IT
Expansion
1x M.2 2280/3042/3052 B-Key (PCIe x2, USB 3.2 5Gb/s, SATA III)
1x M.2 2230 E-key (Wi-Fi) (PCIe / USB 2.0)
1x M.2 2280 M-key (PCIe x 4, SATA III)
Back I/O
2x Full size DisplayPort 1.4 2x Gb LAN (2 x Intel)
2x USB 3.2 10 Gb/s
4-pin Terminal Block (12 ~ 24 V input)
Optional dual CAN card
Optional single COM (RS-232/422/485) card
Front I/O
1x Power button with LED indicator
1x 3FF-Sim slot (Mapped to the B-Key)
4x USB 3.2 10Gb/s
Optional 3 COM (RS-232/422/485) add-in card
Optional DIO add-in card
2x Thunderbolt 4 (40 Gb/s) USB Type C
Onboard Headers & Connectors
1x Battery on a cable
1x internal power header (5V, 12V)
Voltage Input
12~24V
Power Input
4-pin Terminal Block (supports remote switch)
BIOS
Insyde
Operating Systems
Windows 10 IOT 2021 LTSC, Ubuntu 22.04 LTS, Yocto, Window 11
Special Features
Watchdog timer
RTC
PTT in BIOS
On-board TPM 2.0
Support for Vision Processing Units
Support for 4G LTE and GPS expansion cards
TPM (Infineon SLB9672)
Thermal Standards (Subject to change through RFI and RFQ steps)
System Operating Temperature: 0-50C
Storage Temperature: -10-85C
Operating Humidity: 0% - 90% (non-condensing)
Extra Chassis Features
6 Antenna holes
Wall Mount
DIN Rail Mount
VESA Mount
Regulatory Certifications
FCC 47 CFR Part 15 Subpart B (Class A)
EN 60950-1 & EN 63268-1
CISPR 32/EN 55032
CISPR 35/EN 55035
Radio Equipment Directive (2014/53/EU)
WEEE Directive (2012/19/EU)
RoHS 3 (2015/863/EU)
IEC 60601-1-2, 4th ed. - EMC Ready
EN 60945, 4th ed.
IEC/UL/EN 62368-1
Radio Specifications when equipped with Intel AC 9260 Wi-Fi (device for indoor use)
Frequency Bands
2.4 GHz and 5 GHz bands
Operating Frequency
2400 - 2485 MHz
5150 - 5250 MHz, 5250 - 5350 MHz
5470 - 5725 MHz, 5725 - 5878 MHz
Channel spacing / Bandwidth
2.4GHz: 802.11b/g/n; 5 MHz / BT: 1MHz
Bandwidth: 20 MHz / 40 MHz
5 GHz: 802.11a/n/ac: 20, 40, 80, 160 MHz
RF output power
20 dBm (2400-2485 MHz) IEEE 802.11b/g/n & BT
10 dBm (2400-2485 MHz) BLE
23 dBm (5150-5725 MHz) IEEE 802.11a/n/ac
13.98 dBm (5725-5875 MHz) IEEE 802.11a/n/ac
Type of Modulation
2.4 GHz: DSSS/OFDM/FHSS
5 GHz: OFDM
Type of Antenna
Reference antenna is PIFA type (2 dBi/2 dBi gain)
Modes of operation
Duplex (Tx/Rx)
Duty cycle (access protocol)
As In: IEEE 802.11a/b/g/n/ac
Radio Specifications when equipped with Amit MDG100 (EU)
GPS Receiver
Operating frequency range: 1559 - 1610 MHz
GLONASS Receiver
Operating frequency range: 1559 - 1610 MHz
BDS Receiver
Operating frequency range: 1559 - 1610 MHz
Galileao Receiver
Operating frequency range: 1559 - 1610 MHz
QZSS Receiver
Operating frequency range: 1559 - 1610 MHz
GSM 900
Operating frequency range: 880 - 915 MHz, 925 - 960 MHz Maximum output power: 33dBm rated
GSM 1800
Operating frequency range: 1710 - 1785 MHz, 1805 - 1880 MHz Maximum output power: 30dBm rated
WCDMA Band 1
Operating frequency range: 1920 - 1980 MHz, 2110 - 2170 MHz Maximum output power: 24dBm rated
WCDMA Band 8
Operating frequency range: 880 - 915 MHz, 925 - 960 MHz Maximum output power: 24dBm rated
LTE FDD Band 1
Operating frequency range: 1920 - 1980 MHz, 2110 - 2170 MHz Maximum output power: 23dBm rated
LTE FDD Band 3
Operating frequency range: 1710 - 1785 MHz, 1805 - 1880 MHz
Maximum output power: 23dBm rated
LTE FDD Band 7
Operating frequency range: 2500 - 2570 MHz, 2620 - 2690 MHz Maximum output power: 23dBm rated
LTE FDD Band 8
Operating frequency range: 880 - 915 MHz, 925 - 960 MHz
Maximum output power: 23dBm rated
LTE FDD Band 20
Operating frequency range: 832 - 862 MHz, 791 - 821 MHz Maximum output power: 23dBm rated
LTE FDD Band 28A
Operating frequency range: 703 - 733 MHz, 758 - 788 MHz
Maximum output power: 23dBm rated
LTE FDD Band 38
Operating frequency range: 2570 - 2620 MHz Maximum output power: 23dBm rated
LTE FDD Band 40
Operating frequency range: 2300 - 2400 MHz Maximum output power: 23dBm rated
E-GSM
Operating frequency range: 880 - 915 MHz Maximum output power: 33dBm rated
DCS
Operating frequency range: 1710 - 1785 MHz Maximum output power: 30dBm rated
2- Technical Specifications
2.1- External Features
Front I/O
Back I/O
2.2- I/O Definitions
Front I/O Definition
Power button / Power LED
The front power button can be used to turn on and off the Helix system. The power button is a momentary contact button with a blue LED backlight used to display the status of the system. A single press while the system is on will initiate a graceful shutdown operation from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset of the system. The system can be woken by a single press of the power button from any state.
The LED backlight will indicate the system status. A solid blue light indicates that the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.
SIM card
A 3FF Subscriber Identity Module (SIM) card slot is present on the front panel of the Helix platform allowing native support for OnLogic 4G LTE modules. The SIM signals are connected to the M.2 B-Key internal expansion slot.
The SIM slot is a Push-Push type receptacle. To insert the SIM card into the front panel of the Helix platform, please use a small implement to push the card into the slot until it clicks. To remove the card, push with a small implement until the card clicks, then pull on the free end of the card to remove it.
USB 3.2
There are four USB 3.2 Gen 2 ports on the front panel of the Helix platform. These ports are capable of linking at 10Gb/s transfer rates.
Thunderbolt™ 4
There are two Thunderbolt 4 ports on the front panel of the HX511. These ports are capable of linking at up to 40Gb/s transfer rates.
USB Type-C connector (Thunderbolt 4)
Power output up to 5V/3A for the first port and 5V/1.5A for the second port. Power will be allocated on a first-come first-serve basis between the first and second ports.
Up to 40 Gb/s data transfer rate in Thunderbolt Alt Mode
DisplayPort 1.4 compliant in DisplayPort Alt Mode
Supports SuperSpeed USB 10 Gbps; backwards compatible with SuperSpeed USB 5 Gbps and USB 2.0.
Note: Type-C power sink mode is not supported on Helix 511.
DIO option
The Helix 511 platform supports an optional Isolated Digital I/O add-in card (OnLogic HX511-DIO). This option allows for interfacing of the Helix 511 with existing PLC integrations or other digital logic applications. For a complete explanation of features, operating voltages, and safety information, please refer to the DIO expansion manual on the OnLogic support site.
ADP120/ADP102 Isolated DIO Module
3X COM Option
Each port’s serial mode and voltage between Off/5V/12V on Pin “9” is individually selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS manual for configuration instructions.
Power and Reset switch connectors are provided for use with momentary-contact switches making a connection between each signal and ground. Power and disk activity LED connections are provided to directly or indirectly drive indicator LEDs. Both provided signals are 5V sourced through a 330Ω resistor.
Rear I/O Definition
DisplayPort 1 & 2
Helix utilizes Intel® Integrated processor graphics that power the onboard DisplayPorts. This means resolutions up to 4096x2304 @ 60Hz are supported on both outputs simultaneously. All ports support Multi-Stream Transport (MST).
LAN1 - Intel I225-IT
The first LAN Port on Helix 511 supports up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. The LAN link state is shown by the two LEDs enclosed in the port. The description is included below.
LAN2 - Intel I225-LM
The second Intel I225 LAN Port on Helix supports up to 2.5Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is the industry standard RJ45 connector. This port also features Intel’s vPro® technology enabling remote out-of-band management and security features (requires Intel Core™ i5 or higher). The LAN link state is shown by the two LEDs enclosed in the port. The description is included below.
LAN activity light description
USB 3.2
The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2 ports, capable of linking at 10Gb/s transfer rates.
COM DB9 option
The serial port mode and voltage between Off/5V/12V on Pin 9 on Helix can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS manual in Appendix C for configuration instructions.
CAN DB9 option
The CAN port on Helix 511 supports CAN2.0 A/B at baud rates from 100-1000 kbaud. The system CAN port is not internally terminated, and a properly terminated (120 Ohms, typical) cable should be used. CAN messages may be sent and received via a virtual serial port over USB. Windows and Linux drivers are in-box for this interface.
Terminal block power option
Mainboard power is applied to the Helix 511 through a 4-pin terminal block connector (Mating part: Dinkle 2ESDAM-04P, OnLogic CBPW159, or equivalent).
The system is operational from 12V~24V. [see section 2.4 for input voltage qualifications]. The maximum rated current of the connector is 15A per pin. Use a wire gauge that is rated for the operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal block with tinned wire ends or solid core wire. See below for connector pinout.
When using the remote switch connections with the terminal block option, mating power switch cables should be a twisted-pair wire with floating shield to assure proper immunity to EMI/RFI. It is recommended to keep wires at less than 3 meters in length. Switches should be momentary contact type only.
Expansion Port Pinout
M.2 B-Key
M.2 E-Key
M.2 M-Key
mPCIe
2.3- Motherboard Connectors
For pinout details, reference the Expansion Port Pintout located within I/O Definitions.
M.2 B-Key
An M.2 B-Key port is present on the Helix 511 motherboard to allow support for B-Key form-factor expansion cards. Supported cards include 3042, 3052, 2280 form-factors. The B-Key connector supports PCIe Gen 4 x2, USB 3.2 10Gb/s, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.
The 3FF Micro SIM card slot is connected to the M.2 B-Key.
M.2 E-Key
An M.2 E-Key port is present on the Helix 511 motherboard to allow support for E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector supports PCIe Gen 3 x1 and USB 2.0.
M.2 M-Key
An M.2 M-Key port is present on the Helix 511 motherboard to allow support for M-Key form-factor expansion cards. Only 2280 form-factor cards are supported. The M-Key connector includes support for PCIe Gen 3 x4, PCIe Gen 3 x2, PCIe Gen 4 x4, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices.
SO-DIMM1 & SO-DIMM2
The Helix 511 has two onboard DDR5 SO-DIMM slots with the following specifications:
Maximum Capacity: DDR5-4800 64GB with two 32GB SO-DIMM Modules
Channel configuration: 1 DIMM Per Channel (DPC) - 2 Channels
No ECC Support
BIOS EEPROM
If the BIOS needs to be updated, please refer to the BIOS Manual for reflashing instructions.
CMOS Clear Button
A board mounted button is used to clear the BIOS settings of the Helix 511.
RTC battery header
The RTC (Real Time Clock) battery on the Helix 511 is used to retain BIOS CMOS settings and maintain the real-time clock for the system. If the RTC battery is low, BIOS settings will not be retained and you may receive an alert in the operating system. The cabled RTC battery should be replaced with a Maxell CR2032-WK11 (or UL listed equivalent). An equivalent battery shall use a Hirose DF13-2S-1.25c connector to mate with the on-board connector.
Aux 12V/5V Header
The Helix 511 has a power header that can support up to 2A of 5V and 12V power. This header is designed for internal expansion cards that require additional power above what is provided by the expansion slots. This header is a 2.5mm Pitch 4-pin JST XH Connector, with the pinout shown below.
CPU socket
The LGA1700 CPU socket on the Helix 511 supports all 12th Gen Intel PS-series processors up to 45W TDP.
2.4- Power Management
Power consumption
The power consumption of the Helix 511 was measured for various system configurations, workloads, and power states at both 12V and 24V system input voltages. Tests were performed using Prime 95, Furmark, and Burnintest v9.0 build 1012 to stress system components. These tests were performed with Intel Turbo Boost Enabled. The build configurations and power consumption are listed in the tables below. The power consumption listed below is the average power draw over a 5 minute window from the test starting. This includes a brief period of PL2 power consumption (previously Intel turbo Boost) where the power consumption is much larger than the listed average. The highest power consumption seen during the period of turbo PL2 is shown at the bottom of each table.
*The configurations below are using representative samples of internal devices, the specific components mentioned below may vary from the devices provided by OnLogic.
System Component
Config 1 Low
Config 3 Medium
Config 4 High
CPU
Intel Core i7-1265UL Processor
Intel Core i5-12600HL Processor
Intel Core i7-12800HL Processor
Memory
1 x 8GB DDR5 SO-DIMM 4800MT/S
Transcend TS1GSA64V8G
2 x 16GB DDR5 SO-DIMM 4800MT/S
Transcent TS2GSA64V8E
2 x 32GB DDR5 SO-DIMM 4800MT/S
Transcend TS4GSA64V8E
LAN
[1 port linked at full speed]
[1 port linked at full speed]
[2 port linked at full speed]
Storage #1 M.2 M-Key
Samsung 980 Pro
1000GB Gen4
NVMe SSD
Samsung 980 Pro
1000GB Gen4
NVMe SSD
Samsung 980 Pro
1000GB Gen4
NVMe SSD
M.2 B-Key
Transcend TS512GMTS952T2
500GB
SATA Gen3 SSD
M.2 E key
Intel 9260NGW
Intel 9260NGW
Intel 9260NGW
Serial port
3xCOM
Expansion Port 1
DIO
DIO
Expansion Port 2
COM
COM
USB
Port 1: N/A
Port 2 : N/A
Port 3 : N/A
Port 4: Mouse & Keyboard
Port 1: N/A
Port 2 : N/A
Port 3 : N/A
Port 4: Wireless
Mouse & Keyboard
Port 1: N/A
Port 2 : N/A
Port 3 : N/A
Port 4: Wireless
Mouse & Keyboard
Thunderbolt
Port 1: N/A
Port 2: N/A
Port 1: N/A
Port 2: N/A
Port 1: TBT 4 dock connected (idle)
Port 2: N/A
Display
One Monitor
One Monitor
One Monitor
OS
WIndows 11 Pro 64 Bit
WIndows 11 Pro 64 Bit
WIndows 11 Pro 64 Bit
OS Power Plan
Balanced
Balanced
Balanced
BIOS Version
1.18
1.18
1.18
The power consumption for each system configuration is recorded below.
Low Config Measurements
Power Consumption
12V Avg [W]
24V Avg [W]
Pseudo G3
0.05
0.135
Deep S5
0.11
0.26
S5
1.6
2
S3
2.7
3.1
OS Idle
6.7
8.7
CPU / System stress
27.3
28
CPU + GPU / System stress
27.8
29.9
Max turbo draw
79.7
85.7
Medium Config Measurements
Power Consumption
12V Avg [W]
24V Avg [W]
Pseudo G3
0.05
0.135
Deep S5
0.11
0.26
S5
1.6
2
S3
3.2
3.6
OS Idle
7.9
10.2
CPU / System stress
65.7
70.7
CPU + GPU / System stress
66.1
67.8
Max turbo draw
123
121
High Config Measurements
Power Consumption
12V Avg [W]
24V Avg [W]
Pseudo G3
0.05
0.135
Deep S5
0.11
0.26
S5
2.4
2.9
S3
4.2
4.5
OS Idle
12.4
12.9
CPU / System stress
70
74
CPU + GPU / System stress
68.6
72
Max turbo draw
139.7
140
Wake-Up Events
The Helix platform supports multiple power states. The wake-up events can be configured in the BIOS. This section describes the supported power management functions and gives information on protection circuitry for power adapters.
Wake-Up Event
From ACPI State
Comments
Power Button
Deep S5, S5, S3
LAN
S5, S3
Must be enabled in BIOS
USB
S3
RTC Wake set by BIOS
Deep S5, S5, S3
Must be enabled in BIOS
RTC Wake set by OS
S3
Protection Circuitry
Parameter
Value
Nominal operating voltage (Rated DC value of input)
12~24V
Undervoltage protection trip DC level (system turns off)
6.5V
Maximum safe DC voltage (system not damaged)
28.4V
These DC levels specified are the absolute max values for the pins for function and safety of the system. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.
2.5- Add-In Modules
CAN Add-in Card
An optional CAN add-in card is available. The add-in card has an NXP i.MX1050-series microcontroller that can communicate with the host processor over USB. The card provides an interactive shell for configuration on a virtual COM port, and two CAN interfaces accessible through two additional virtual COM ports.
Configuring the CAN Card
The add-in card is configured interactively through its shell using a serial terminal emulator program. The shell is accessed differently depending on operating system.
To access the shell on Windows:
Open Device Manager by pressing Win+X M. Open the “Ports (COM & LPT)” menu.
Note the “COM#” numbers on each port listed. The shell is typically the lowest-numbered “USB Serial Device” port. The first and second CAN interfaces typically have higher port numbers.
Download and install PuTTY from the link above.
Open PuTTY. When prompted, enter the COM port number in the “Serial line” text box, then click “Open”.
If the port number was correct, a “uart:~$” prompt should appear. If not, try a different port.
To access the shell on Linux:
Install picocom, e.g. “sudo apt install picocom” on Ubuntu.
Open the shell’s virtual COM port with picocom by running “picocom /dev/serial/by-id/usb-OnLogic_USB-CAN-*-if00”.
Some Linux distributions may not configure udev to produce by-id links. If those links are missing, try /dev/ttyACM0 and similar devices.
Once the shell is open, type “help” for usage information. A description of available shell commands can also be found here.
Using slcand in Linux
On Linux, the slcand utility can configure the add-in card’s interfaces as a regular SocketCAN network interface. Make sure the interface is configured for slcan usage by entering “set can-mode VCAN1 slcan” (and similar for “VCAN2”) in the shell.
On most Linux distributions, slcand is part of a package called can-utils; on Ubuntu, it can be installed with “sudo apt install can-utils”. Once installed, start the utility by running e.g. “slcand -oc -s6 /dev/serial/by-id/usb-OnLogic_USB-CAN-*-if02 slcan0” to create a SocketCAN interface named slcan0 running at 500k (“-s6”) from the first CAN interface’s virtual COM port.
The slcan Message Format
The slcan message format is widely supported. High-quality libraries are available for most programming languages that handle the details of the protocol. It can also be implemented manually if needed.
The slcan protocol is stateful; each interface needs to be configured and opened before it can be used, and must be closed before it can be reconfigured. Make sure the interface is configured for slcan usage by entering “set can-mode VCAN1 slcan” (and similar for “VCAN2”) in the shell.
Each CAN interface has a corresponding virtual COM port. Commands are sent on that port to configure the interface and send frames. Each command consists of an ASCII letter, optionally followed by other ASCII text, ending with a newline (“\n”) character.
The interface baudrate is set with the “S” command. Nine baudrates are supported:
Once the baudrate is set, the interface should be opened by sending the open command (“O\n”). Once open, frames can be sent to the microcontoller in the format documented in a comment in the Linux kernel source code. As frames arrive, the microcontroller will send messages back on the virtual COM port. To stop it, close the interface with the close (“C\n”) command.
Alternate CAN Format
The legacy “std” message format is supported for backwards compatibility with other devices, but is not recommended for new development. The standard slcan format should be used instead due to the availability of high-quality tools and libraries for working with that message format in most programming languages.
Connection Diagram
Optional DIO Card
An optional DIO add-in card is available. The add-in card has an NXP i.MX1050-series microcontroller that can communicate with the host processor over USB. The card provides an interactive shell for configuration on a virtual COM port.
Supported VIN/Input/Output Voltage: 5-48V
To access the shell on Windows:
Open Device Manager by pressing Win+X M. Open the “Ports (COM & LPT)” menu.
Note the “COM#” numbers on each port listed.
Download and install PuTTY from the link above.
Open PuTTY. When prompted, enter the COM port number in the “Serial line” text box, then click “Open”.
If the port number was correct, a “uart:~$” prompt should appear. If not, try a different port.
To access the shell on Linux:
Install picocom, e.g. “sudo apt install picocom” on Ubuntu.
Open the shell’s virtual COM port with picocom by running “picocom /dev/serial/by-id/usb-OnLogic_DIO-*-if00”.
Some Linux distributions may not configure udev to produce by-id links. If those links are missing, try /dev/ttyACM0 and similar devices.
Once the shell is open, type “help” for usage information. A description of available shell commands can also be found here.
While the microcontroller shell is intended for human interaction, it can be used to programmatically control the MCU. To avoid a number of pitfalls when doing so, observe the following best practices:
On Linux, use the symlinked device nodes inside
/dev/serial/by-idinstead of hardcoding/dev/ttyACMxdevice names./dev/ttyACMxnumbering isunstable;
/dev/serial/by-id/usb-OnLogic_<device>-if00will reliably point to the terminal interface.When writing Linux shell scripts, ensure that the echo flag is disabled on the TTY by running
stty -F /dev/serial/by-id/<device> -echobeforeinteracting with the shell. Most serial libraries (pyserial, serialport-rs, etc.) will automatically disable this flag.
When sending a command, precede it with a ‘\x03’ byte to clear the terminal’s line buffer and ensure that the command is interpreted correctly. Follow the command with a ‘\r’ or ‘\n’ character to execute the command.
Send less than 64 bytes at a time. To send longer commands, explicitly flush the port’s output buffer in between each block of 64 bytes.
Connection Diagrams
2.5- Thermal Results
Test Conditions
● Temperature Range: 0ºC to 50°C
● Step size: 10°C
● i7 Processor loaded @80% PTAT, 1TB SSD, and 64GB DDR5 RAM loaded @ 80% with
BurnInTest 9.2
Test Methodology
Thermal testing of the Helix 511 was completed using a thermal chamber to control ambient environmental temperature across the rated temperature range of the system. Throughout testing, the system and its components were being stressed by various softwares to simulate a rigorous constant workload. Stress testing occurred for two hours in each temperature range. Components were monitored during testing via their internal sensors. Some components were monitored externally via thermocouples.
Test Results
Test Result Summary
The Helix 511 with i7-12800HL processor saturated upwards of its rated base clock speeds on performance and efficiency cores while sustaining significant processor, memory and storage stress loads through an ambient temperature range of 0-50C.
2.6- Block Diagram
3- Installation & Mechanical
3.1- Dimensions
3.2- Mounting
Wall Mount & DIN Rail Mounting
The Helix 511 has optional Wall Mount brackets (SKU : MTW101) and DIN Rail mounting brackets (SKU : MTW101-K) available for purchase.
For Wall Mounting, follow steps below :
Step 1: Align the four screw holes on the bottom of the system with the respective holes on the mounting brackets.
Step 2: Attach wall mounting brackets (MTW101) to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long).
Step 3 : Install system to surface using keyhole slots on wall mount brackets and appropriate hardware for the surface (not provided).
For DIN Rail Mounting, follow the below steps:
Step 1: Follow steps 1-2 from the Wall Mounting section.
Step 2: Align the mounting holes of the din clip bracket to the three mounting holes on the wall mount bracket.
Step 3: Install the din clips to the wall mount brackets using supplied screws and a Phillips head screwdriver (tighten gently as screws are threading into plastic).
Step 6: Mount system onto the DIN rail.
Note: The mounting brackets are required to support 3x the hanging weight of the system (14.82lbs / 6.72 kgs). The mating surface and hardware must be capable of supporting the same load.
VESA Mounting
The Helix 511 has an optional VESA mounting bracket (SKU : VMPL-2022-K) available for purchase. Follow the steps below for mounting.
Step 1: Align the four screw holes on the bottom of the system with the respective holes on the mounting bracket.
Step 2: Attach VESA Mount Plate, to the system using the supplied M3 screws (M3X0.5 Flathead Screw, 4mm Long)
Step 3: Install the system to VESA 75 or VESA 100 mounting pattern using provided VESA Mount screws.
The mounting bracket systems are required to secure 3x the hanging weight of the computer system (14.82lbs / 6.72 kgs). The mating substrate must be capable of maintaining the same rating.
3.3- Internal Access
Properly opening OnLogic systems does not void the warranty in most cases, however, some precautions are necessary to avoid damaging the system.
Perform this disassembly in an area free of static discharge.
Disconnect power, video, and any other connections to the system. It should be fully unplugged.
Ideally, wear a grounding strap. If that is not available, regularly touch a grounded metal surface to discharge your body of static electricity.
Begin by removing the 4x Phillips P2 screws circled in orange. * You will need to remove any mounting hardware from the bottom of the system
Remove the bottom plate. You can use a thin tool such as a flathead screwdriver to help with this.
You now have access to the motherboard.
4- Software & Firmware
4.1- BIOS
BIOS Manual
For complete details on all configurable firmware settings, please reference the BIOS Manual.
BIOS Updates
Reference our Update EFI BIOS guide for installation instructions.
4.2- Drivers & Downloads
Drivers are available in INF formats, which can be installed via a Windows deployment server, or through the Device Manager. Reference our Update System Drivers guide for Installing via Device Manager.
4.3- Features & Configuration
Intel Active Management Technology
Intel AMT is supported on select processor SKUs that meet requirements for vPro support:
i7-12800HL
i5-12600HL
AMT Configuration is managed from outside the BIOS setup menu by pressing DELETE at the system boot screen and selecting “MEBx Configuration”
For detailed configuration options, see the HX511 BIOS manual.
Intel Volume Management Device
Intel VMD may be used to configure software RAID for supported Windows operating systems.
VMD is supported on all processor SKUs. VMD must be enabled from the BIOS setup menu, and then may be configured from the RST setup menu by pressing DELETE at the system boot screen and choosing “Device Management.”
For detailed configuration options, see the HX511 BIOS manual.
5- Support & Compliance
5.1- Troubleshooting & FAQ
FAQs
What is the pinout for the power input?
The system can be powered with a 4-pin terminal block by matching the Negative (-) and Positive (+). From left-to-right, the pinout is: (SW) (SW) ( – ) ( + )
The (SW) pins can be used for remote power switch operation. This can be connected with a momentary button/switch.
Clear CMOS
If the system fails to power on or otherwise function, clearing the CMOS may help restore it to a working state.
Unplug the system from all power and peripherals and perform the disassembly steps above.
Locate the CMOS CLEAR button located near the power button
Depress the button with a flathead screwdriver, fingernail, or similar object for at least 30 seconds
The CMOS is now clear. Reassemble and power the unit back on. It may reboot multiple times before resuming normal operation.
DisplayPort Audio not Functional in Ubuntu 22.04 Desktop
Overview
Category:
Software
SKU(s) Affected:
HX511
Revision(s) Affected:
All
Revision Resolved:
Unresolved
Severity:
Low
Description
Audio output over DisplayPort for HX511 products running Ubuntu 22.04 is currently unsupported due to kernel driver incompatibility.
There is no line-out or headphone jack present on this product. Customers who require audio support on the HX511 may consider an external USB-audio adapter.
Resolution
OnLogic is working with upstream partners to enable. New software will be available when enablement is complete.
5.2- Regulatory
CE
The computer system was evaluated for medical, IT equipment, automotive, and maritime EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the CE mark. Modification of the system may void the certifications. Testing includes: EN 55032, EN 55035, IEC 60601-1, EN 62368-1, EN 60950-1, and IEC 60945. Product safety was evaluated to IEC 62368-1 and IEC 60950-1.
FCC Statement
This device complies with part 15 of the FCC rules as a Class A device. Operation is subject to the following two conditions: (1) this device may not cause harmful interference and (2) this device must accept any interference received, including interference that may cause undesired operation.
ISED
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
CAN ICES-003(A) / NMB-003(A)
UKCA
The computer system was evaluated for medical, IT equipment, automotive, maritime and railway EMC standards as a class A device. The computer complies with the relevant IT equipment directives for the UKCA mark.
VCCI
This is a Class A product based on the standard of the Voluntary Control Council for Interference (VCCI). If this equipment is used in a domestic environment, radio interference may occur, in which case the user may be required to take corrective actions.
Download Documents
5.3- Security Advisory
For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories
5.4- Appendices
Revision Table
Revision History
Date
First release of HX11 manual
06/06/2023
Updated Errata and feature list
06/12/2023
Minor update to vPro list
02/09/2024
Updated LAN numbering
03/25/2025
Last updated