HX500 / HX600 / HX610
1- Product Overview
1.1- Introduction
The OnLogic Helix series integrates Intel® 10th generation Comet Lake processors, offering flexible installation, reliable solid-state performance, and unique expandability for various innovations. Helix systems utilize desktop processing within a compact form factor, previously limited to lower-wattage mobile CPUs. With OnLogic's Hardshell™ Fanless Technology, you can benefit from enhanced performance and thermal management of Intel 10th gen processing, alongside triple independent display support, an extended operating temperature range, and a wide input power range.
1.2- Safety
Safety Precautions, Safeguards & Information
Do not open or modify the device. The device's components comply with FCC and CE regulations; any modification may invalidate these certifications.
Install the device securely. Be careful handling the device to prevent injury and do not drop.
Wall or ceiling mounting device requires use of a mounting plate or bracket. The plate or bracket must be of metal construction and have a minimum thickness of 1mm.
Use M3x0.5mm Flat Head screws to attach mounting plate or mounting brackets to threaded holes on bottom or rear of chassis. Screws should be a minimum length of 4mm. Add 1mm of screw length for every mm of additional thickness of plate or bracket beyond 1.5mm.
The ambient operating temperature must be between 0 °C and 50 °C with a non-condensing relative humidity of 10-90%.
The device can be stored at temperatures between -10 °C and 85 °C.
Keep the device away from liquids and flammable materials.
Do not clean the device with liquids; the chassis can be cleaned with a cloth.
Allow at least 2 inches of space around all sides of the device for proper cooling.
If mounted on a vertical surface, orient the device so that heatsink fins allow unobstructed air circulation. Alternative orientations may reduce the operational temperature range.
This device is intended for indoor operation only.
Use a UL Listed external power supply with a rated output of 8-24Vdc.
Install the device only with shielded network cables.
For automotive installation, only use SAE approved cables.
The installer should be experienced in aftermarket installation and familiar with general practices for installing electronic devices in vehicles.
The device should not be installed in the driver’s area of a vehicle.
The device should be mounted according to accepted aftermarket practices and materials for vehicle installation.
Only use UL Listed connectors.
Service and repair of the device, including CMOS battery replacement, must be performed by qualified service personnel. The replacement CMOS battery must be the same type as the original.
Proper disposal of the CMOS battery must comply with local regulations.
WARNING: There is a risk of explosion if the CMOS battery is replaced incorrectly. Disposing of the battery in fire or a hot oven, or mechanically crushing or cutting it, can result in an explosion.
Précautions et guide d’installation
Ne pas ouvrir ou modifier l'appareil. L'appareil utilise des composants conformes aux réglementations FCC et EC. La modification de l'appareil peut annuler ces certifications.
Installez l’appareil en toute sécurité. Soyez prudent lors de la manipulation de l'appareil pour éviter les blessures et ne pas faire tomber.
Le montage au mur ou au plafond nécessite l’utilisation d’une plaque de montage ou d’un support. La plaque ou le support doit être en métal et doit avoir une épaisseur minimale de 1 mm.
Utilisez des vis à tête plate M3x0,5mm pour fixer la plaque de montage ou les supports aux trous filetés situés au bas ou à l'arrière du châssis. Les vis doivent avoir une longueur minimale de 4 mm. Ajoutez 1 mm de longueur de vis pour chaque mm d'épaisseur supplémentaire de plaque ou de support dépassant 1,5 mm.
La plage de températures de fonctionnement doit être de 0 °C à 50 °C avec une humidité relative de 10 à 90% sans condensation. La température de fonctionnement dépend du choix du composant, y compris de l'adaptateur d'alimentation. Voir le tableau 1 ci-dessous pour le déclassement.
La plage de températures de stockage doit être de -10 °C à 85 °C.
Gardez l'appareil à l'écart des liquides et des matières inflammables.
Ne nettoyez pas l'appareil avec des liquides. Le châssis peut être nettoyé avec un chiffon.
Laissez au moins 5 cm d'espace autour de tous les côtés de l'appareil pour un refroidissement correct. Si l’appareil est monté sur une surface verticale, l’orientation recommandée est telle que les ailettes du dissipateur de chaleur permettent à l’air de monter sans obstruction. Les orientations alternatives peuvent entraîner une réduction de la plage de température de fonctionnement.
Cet appareil est conçu uniquement pour une utilisation en intérieur.
Utilisez une alimentation externe listée UL avec une sortie nominale de 8-24Vdc.
Installez l’appareil uniquement avec des câbles réseau blindés.
L'entretien et la réparation de l'appareil doivent être effectués par du personnel qualifié. Cela inclut, sans toutefois s'y limiter, le remplacement de la batterie CMOS. La batterie CMOS de remplacement doit être du même type que l’originale.
La mise au rebut des batteries usagées doit être réalisée conformément aux réglementations environnementales.
ATTENTION: Risque d’explosion si la batterie est remplacée par une batterie de type incorrect. Les batteries doivent être recyclées dans la mesure du possible.
1.3- Box Contents & Accessories
4x Rubber Feet
Additional items such as mounting brackets, power supplies, or terminal block connectors, if purchased, will be found in the system box or outer shipping carton. For more details on accessories and features, visit the Helix series page.
Helix 500 Product Page Helix 600 Product Page
1.4- Product Specifications
2- Technical Specifications
2.1- External Features
Front I/O
Note: The HX500 is pictured, the HX600 has the same I/O configuration. The location of the DIO option is different for the HX600.
Rear I/O
Note: The rear I/O of the HX500 is shown below. The HX600 has the same connector orientations and locations on the motherboard. The location of the Terminal block power option is different for the HX600.
2.2- I/O Definitions
Front I/O definition
Power button / Power LED
The front power button can be used to turn the Helix system on and off. It is a momentary contact button with a blue LED backlight that indicates the system's status. A single press while the system is on will initiate a graceful shutdown from the OS. Pressing and holding the button for 4 seconds while the system is running will cause a hard reset. The system can be woken from any state by a single press of the power button. A solid blue light on the LED backlight indicates the system is powered in the S0 state. A flashing blue light indicates the system is in the sleep state. The LED is off in S5 and deep sleep states.
SIM card
A 3FF Subscriber Identity Module (SIM) card slot is located on the front panel of the Helix platform, providing native support for OnLogic Cellular modules. The SIM signals can be connected to either the mPCIe or M.2 B-Key internal expansion slots, with the default BIOS setting being mPCIe. Refer to the BIOS user manual for more information. The SIM slot is a Push-Push type receptacle. To insert or remove the SIM card, use a small implement to push the card into the slot until it clicks. To remove the card, push it with a small implement until it clicks, then pull the free end of the card to remove it.
COM DB9 option
The serial port mode and voltage between Off/5V on Pin 9 on Helix can be selected in the BIOS configuration. The serial ports support RS-232, RS-422, and RS-485 configurations. Refer to the BIOS manual in Appendix C for configuration instructions.
Audio
Audio input and output are provided via a 3.5mm CTIA audio jack on the front panel of the Helix platform. The audio codec used is a Realtek ALC233. Proper drivers must be installed for both the Q470 chipset and Realtek ALC233 codec. These downloads can be found within section 4 of this documentation page.
USB 3.2
There are four USB 3.2 Gen 2 ports on the front panel of the Helix platform, capable of 10Gb/s transfer rates.
Rear I/O definition
4-Pin DIN power connector
Mainboard power is applied to the Helix platform via a locking 4-pin female DIN connector (Mating part: Kycon # KPPX-4P or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications.
The maximum rated current of the connector is 7A per pin. Use a wire gauge rated for the operational current. See below for the on-board connector pinout.
DisplayPort 1, 2, & 3
Helix utilizes Intel’s Integrated processor graphics, powering the onboard DisplayPorts. This supports resolutions up to 4096x2304 @ 60Hz simultaneously on all three outputs. All ports support Multi-Stream Transport (MST).
An optional CEC module can be included to add CEC (Consumer Electronics Control) functionality on DisplayPort 1 & 2. This feature is not supported on the DisplayPort 3 connector.
LAN1 - Intel I219-LM
The Intel I219 LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is an industry-standard RJ45. This port also features Intel’s vPro(R) technology, enabling remote out-of-band management and security features (requires Intel Core i5 or higher). The LAN link state is indicated by the two LEDs enclosed in the port, as described below.
LAN2 - Intel I210-IT
The second LAN Port on Helix supports up to 1Gbps link speeds over standard shielded CAT5e or CAT6 cables. The connector is an industry-standard RJ45. The LAN link state is indicated by the two LEDs enclosed in the port, as described below.
USB 3.2
The dual stack USB 3.2 ports on the rear panel are USB 3.2 Gen 2 ports, capable of 10Gb/s transfer rates. The two USB ports above the RJ45 LAN connectors are USB 3.2 Gen 1 ports, capable of 5 Gb/s.
Terminal block power option
If the terminal block power option is selected, mainboard power is applied to the Helix platform through a 4-pin terminal block connector (Mating part: Dinkle #2ESDAM-04P or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications. The maximum rated current of the connector is 15A per pin. Use a wire gauge rated for the operational current. Cables should be properly terminated with wire ferrules. Do not use the terminal block with tinned wire ends or solid core wire. See below for connector pinout. When using the remote switch connections with the terminal block option, mating power switch cables should be twisted-pair wire with a floating shield to ensure proper immunity to EMI/RFI. It is recommended to keep wires less than 3 meters in length. Switches should be momentary contact type only.
2.3- Expansion Port Pinout
M.2 B-Key
M.2 E-Key
M.2 M-Key
mPCIe
2.4- Motherboard Connectors
The motherboard is the same for HX500 and HX600.
M.2 B-Key
An M.2 B-Key port is present on the Helix motherboard to support B-Key form-factor expansion cards. Supported form-factors include 3042, 2242, 2260, and 2280. The B-Key connector supports PCIe Gen 3 x2, USB 3.2 5Gb/s, USB 2.0, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices. The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slots. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Refer to the BIOS user manual for more information. The M.2 B-Key slot can be used in tandem with the M.2 M-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs; NVMe RAID is not supported by the chipset. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Refer to the BIOS user manual for information on using Rapid Storage Technology. A full pinout table for this expansion slot is provided in The Expansion port pintout.
M.2 E-Key
An M.2 E-Key port is present on the Helix motherboard to support E-Key form-factor wireless expansion cards. Only 2230 form-factor cards are supported. The E-Key connector on the Helix platform supports PCIe Gen 3 x1, USB 2.0, and Intel CNVi devices. A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3).
M.2 M-Key
An M.2 M-Key port is present on the Helix motherboard to support M-Key form-factor expansion cards. Only 2280 form-factor cards are supported. The M-Key connector on the Helix platform includes support for PCIe Gen 3 x4, PCIe Gen 3 x2, SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps) devices. The M.2 M-Key slot can be used in tandem with the M.2 B-Key slot to create firmware-level RAID arrays using Intel Rapid Storage Technology. These arrays can be created with M.2 SATA SSDs; NVMe RAID is not supported by the chipset. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Refer to the BIOS user manual for information on using Rapid Storage Technology. A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3).
mPCIe
An mPCIe port is present on the Helix motherboard to support mini-PCIe form-factor expansion cards. Full-length cards and half-length cards (with adapter) are supported. The mPCIe connector on the Helix platform supports PCIe Gen 3 x1 and USB 2.0 devices. A full pinout table for this expansion slot is provided in A full pinout table for this expansion slot is provided in the Expansion Port Pinout (section 2.3). The 3FF Micro SIM card slot is multiplexed to both the M.2 B-Key and mPCIe expansion slots. The routing can be selected in the BIOS and is set to the mPCIe slot by default. Refer to the BIOS user manual (Appendix C) for more information.
SO-DIMM1 & SO-DIMM2
The Helix platform has two onboard DDR4 SO-DIMM Slots. Specifications are as follows:
Maximum Capacity: DDR4-2666 64GB with two 32GB SO-DIMM Modules
Channel configuration: 1DIMM Per Channel (DPC) - 2 Channels
No ECC Support
COM1 & COM2
The two on-board COM headers utilize standard 9-pin 2.00mm pitch male pin headers with the pin configuration provided in the table below. These serial ports support RS-232, RS-422 Full-Duplex, and RS-485 half-Duplex configurations. The serial port communication mode can be selected in the BIOS configuration. Additionally, 5V power can be enabled on pin 9 in the same BIOS menu, rated to provide 250mA of current. Refer to the BIOS manual for configuration instructions.
BIOS EEPROM
For BIOS update instructions, refer to the BIOS Manual in section 4 for reflashing instructions.
Power Switch Header
The on-board power switch header can control the power state of the Helix platform in parallel with the front panel power button. Mating power switch cables should be twisted-pair wire with a floating shield to ensure proper immunity to EMI/RFI. The mating connector is a standard 2.54mm female header. It is recommended to keep wires less than 3 meters in length. Switches must be momentary contact type only.
ATX/CMOS Jumper Header
A 2mm pin header and jumpers are used to clear the CMOS settings and select the hardware auto power-on behavior of the Helix platform. ATX mode can be selected by moving the pin jumper to connect pins 3 and 5. In ATX mode, the system power-on is controlled by the system power button or other supported wake events. When the pin jumper connects pins 1 and 3, the system operates in AT mode, powering on when system power is first applied. The default selection is ATX mode. The system CMOS settings can be cleared with the second pin jumper by following these steps:
Disconnect system power.
Place jumper in the “clear” position.
Wait 10 seconds.
Remove jumper from the “clear” position and return to default position.
RTC battery header
The RTC battery on the Helix platform retains BIOS CMOS settings and maintains the system's real-time clock. If the RTC battery is low, CMOS settings will not be retained, and an alert may be received in the operating system. The cabled RTC battery should be replaced with a Maxell CR2032-WK11 (or UL listed equivalent). An equivalent battery must use a Hirose DF13-2S-1.25c connector to mate with the on-board connector.
TPM header
Helix features an onboard TPM (Trusted Platform Module) header. Helix supports OnLogic’s module (OnLogic part TPM01) featuring TPM 2.0. This provides the option for a dedicated secure module to secure Helix through cryptographic keys.
SATA Data 1 & SATA Data 2
The two on-board SATA Data connectors utilize the standard 7-pin SATA Data latching connector with the standard pin configuration. These connectors support SATA Gen I (1.5Gbps), SATA Gen II (3.0Gbps), and SATA Gen III (6.0Gbps). Additionally, they support firmware-level RAID arrays using Intel Rapid Storage Technology. RAID arrays combining M.2 SATA and cabled 2.5” SATA drives can also be created. Characteristics of the SATA ports, such as RAID arrays, can be configured in the BIOS; refer to the BIOS manual for further details.
SATA Power
The on-board SATA Power connector provides 5V and 12V power to multiple SATA devices with the pin configuration shown in the table below. It uses a 4-pin 2.50mm pitch male pin connector with an opening for a small retention tab. The connector is rated to 2A per contact. Any mating connector with the correct form factor, such as TE Connectivity part number 171822-4, can be used to connect a cable to the header. The connector can only be used to power internal devices.
Fan Header
The on-board fan header can power and control any three or four-wire fan (including variable-speed PWM fans) using the standard pin configuration shown in the table below. Three-wire fans will only connect to pins 1-3. This header utilizes a standard 4-pin 2.54mm pitch fan connector with a small retention tab. Any mating connector with the standard form factor, such as Molex part number 0470541000, can be used to connect a fan. Most CPU and case fans utilize this connector and pinout. The 12V pin on this connector can provide up to 1A of current.
USB 2.0 Header
The on-board USB 2.0 header provides a pair of USB 2.0 signals. It utilizes a standard 9-pin 2.54mm pitch male pin connector with the pin configuration shown in the table below. The 5V power pins (1 & 2) can provide up to 1A of current.
CEC Expansion Header
HDMI-CEC (Consumer Electronics Control) is a communication protocol that supports the control of displays over an HDMI interface. The Helix platform supports CEC via the optional add-on module ADP107. For a full description of supported features, refer to the ADP107 product manual here:
Power Input Header
Mainboard power can be applied to the Helix platform via the locking 4-pin Molex Micro-Fit connector (Mating part: Molex # 0430250400 or equivalent). The system operates from 8V~24V (HX500) and 19V~24V (HX600 with GPU option). Refer to the Power Management section for input voltage qualifications. The maximum rated current of the connector is 8A per pin. Use a wire gauge rated for the operational current. See below for connector pinout.
CPU socket
The LGA1200 CPU socket on the Helix platform supports all 10th Gen Intel S-series processors up to 35W TDP.
PCIe x16 Slot
The Helix platform features a standard PCI Express x16 slot on the bottom side that supports PCIe Gen 1 (2.5 GT/s), Gen 2 (5 GT/s), and Gen 3 (8 GT/s). Any PCIe x1, x4, x8, or x16 card using PCIe Gen 1 through Gen 3 will function in this slot. In the HX600, a riser card is included to add a PCIe expansion card to the expanded chassis.
2.5- Motherboard Manual
Reference the full BIOS Manual here.
2.6- Processor
Intel® 10th Gen Comet Lake Core 35W Celeron/i3/i5/i7/i9
2.7- Power Management
Average Power Consumption
The power consumption of the H500 and H600 systems was measured for various system configurations, workloads, and power states at both 12V and 24V system input voltages. Tests were performed using Burnintest v9.0 build 1012 to stress system components with and without graphics enabled. These tests were performed with Intel Turbo Boost disabled; enabling Turbo will draw additional power. The build configurations and power consumption are listed in the tables below. (Note: system configurations using discrete GPUs are limited to 19V-24V input. Only 24V is tested for Configuration 3).
*The configurations below are using representative samples of internal devices; the specific components mentioned below may vary from the devices provided by OnLogic.
The power consumption for each system configuration is recorded below:
Config 1 Low Power Consumption
Config 2 Mid Power Consumption
Config 3 High Power Consumption
Protection Circuitry
These specified DC levels are the absolute maximum values for the pins for system function and safety. The protection circuitry allows for brief transient voltages above these levels without the system turning off or being damaged. A transient voltage suppressor on the power input allows momentary excursions above stated limits.
Input voltage qualification
The base HX500 system can operate with an input voltage ranging from 8V - 24V DC; however, different configurations will impact total system draw and may limit input voltage flexibility in the final application. The minimum system voltage will be limited by total system power draw and the 14A current limit of the power connectors on the motherboard. The total system power draw should be divided by the input voltage to remain within the power connector's current limit and checked against supply capability. HX600 systems with GPU configurations should use no less than 19V at the input, with 24V recommended. Please contact OnLogic for assistance calculating the total max power draw of your desired configuration. Most HX500 systems operating at 8V with turbo enabled will exceed the input current limit. Systems with Intel Turbo Boost enabled can draw up to 70W at the CPU with stock settings. Additional internal system peripherals and USB loads may cause system instability due to protection mechanisms. Systems requiring an input voltage under 12V will achieve best stability by disabling CPU turbo, or by limiting peak CPU turbo draw under 50W with a custom BIOS. Please contact OnLogic sales for additional information on custom BIOS configurations.
Wake-Up Events
The Helix platform supports multiple power states. Wake-up events can be configured in the BIOS. This section describes the supported power management functions and provides information on protection circuitry for power adapters.
Auto Power On
The auto power on feature will turn the Helix system back on after a power loss. This can be useful for automatic recovery after a power outage, or applications where the system’s power button is not easily accessible.
Power on the Helix unit and immediately press Del to access the Front Page config menu
Using the arrow keys, navigate down to “Setup Utility” and press enter
From the “Advanced” tab, select “PCH-IO Configuration”
Change “Auto Power-On” to “Enabled”
Press F10 to save and exit
Press Enter to confirm
Auto power on is now enabled
2.8- Add-in Modules
DIO option
The Helix platform supports an optional Isolated Digital I/O add-in card (OnLogic ADP120). This option enables integration of the Helix platform with existing PLC integrations or other digital logic applications. For a complete explanation of features, operating voltages, and safety information, refer to the DIO expansion information here:
ADP120 / ADP102 Isolated DIO Module
2.9- Thermal Results
The thermal performance of the Helix platform was validated by fully loading system components while the test system was exposed to high ambient temperatures in a thermal chamber environment. CPU and GPU clock speeds were measured for the duration of the test. Results were analyzed by comparing the average clock speed over the test duration to the rated base clock speed. A passing result was defined by an average clock speed no less than 10% of the rated base clock. No CPU or GPU throttling was observed during testing of both the HX500 and HX600 at the maximum rated temperature, with some configurations running above the base clock frequency.
HX500 - i9 10900T (10C @1.90GHz) Thermal Testing Graph
The image below shows the thermal test results from an HX500 in a thermal chamber with an I9 10900T (10C @1.90GHz) processor installed over 10 hours at a 100% workload.
HX500 - i9 10900T (10C @1.90GHz) Thermal Testing Results Table
The table below shows the key takeaway values from the above test.
HX600 - GPU Validation Thermal Testing Graph
The image below shows the thermal test results from an HX600 in a thermal chamber over 4 hours. During the last hour of the test, after the system saturates at the required temperature, FurMark is started, running the GPU at 100% workload to find the system's limits.
HX600 - GPU Validation Thermal Testing Results Table
The table below shows the key takeaway values from the above test.
2.10- Block Diagram
System Block Diagram
3- Installation & Mechanical
3.1- Dimensions
Helix 500 Dimensions (HX500)
Helix 600 Dimensions with PCIe Expansion (HX600)
3.2- Mounting
Wall Mount & DIN Rail Mounting
Step 1: Attach wall mounting brackets to the chassis using the supplied screws. Specifications are as follows:
Screw type: M3X0.5 FH 120 Degree Screw
Length: 4 mm
Step 2: Locate the 4 holes that line up accordingly to the bracket as shown below.
Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.
Step 4 (for DIN Bracket): Using the outer 2 holes of the 3-hole set on the wall mount bracket, line up the DIN bracket.
Step 5 (for DIN Bracket): Using the supplied screws and a Phillips head screwdriver, mount the DIN bracket to the bracket.
Step 6 (for DIN Bracket): Mount system onto the DIN rail.
VESA Mounting
Step 1: Attach the VESA mounting plate to the chassis using:
Screw type: M3X0.5 FH 120 Degree Screw
Length: 4 mm
Step 2: Locate the 4 holes that line up accordingly to the bracket as shown.
Step 3: Fasten system to surface. The mounting bracket systems are required to secure 3x the hanging weight of the computer system. The mating substrate must be capable of maintaining the same rating.
3.3- Internal Access
Properly opening OnLogic systems does not void the warranty in most cases, however, some precautions are necessary to avoid damaging the system.
Perform this disassembly in an area free of static discharge and with the system fully unplugged.
Ideally, wear a grounding strap. If that is not available, regularly touch a grounded metal surface to discharge your body of static electricity.
HX500 Disassembly
Begin by removing the 4x Phillips P2 screws circled in red.
Next, use a small tool or your fingernail to pry the bottom place loose. It should come loose with minimal force.
The bottom plate will fall away from the system and is completely disconnected.
Set the plate aside. The disassembly process is complete.
You now have access to the internals.
This picture shows an example configuration.
Ram, WiFi, Primary Storage, Additional Storage
HX600/610 Disassembly
Begin by removing the 5x Phillips P2 screws circled in red.
Next, use a small tool or your fingernail to pry the bottom place loose. It should come loose with minimal force.
The bottom plate will fall away from the system and is completely disconnected.
Set the plate aside. The disassembly process is complete.
You now have access to the internals.
This picture shows an example configuration.
Ram, WiFi, Primary Storage, Additional Storage, PCI-E Expansion
PCI-E Card Installation (HX600)
Begin by removing the two Phillips P1 retaining screws from the card bracket. Set the bracket aside.
Determine the number of slots your PCI-E card takes up.
For a single slot card, punch out the top cover. For a dual slot card, punch out both.
Use pliers to bend the knockout a few times and it will fall off.
Set PCI-E Card in the case and slide it into the slot.
Reinstall the bracket removed in the first step. It will hold the card in place.
If needed, push the card into position before fully tightening the screws.
The card should appear level in the slot. If it is crooked, loosen the retaining screw and reposition it.
The installation is complete.
3.4- CAD & Drawings
4- Software & Firmware
4.1- BIOS
For a detailed overview of the BIOS screens and individual settings, refer to the BIOS Manual:
4.2- Drivers & Downloads
Drivers
Drivers are available in INF formats, which can be installed via a Windows deployment server, or through the Device Manager.
BIOS Updates
Z01-0002A042
Add - Can't flash secure boot keys on BIOS.
Add - "Enroll Key Only" for "Secure Boot" options.
Update the BIOS with the file(s) above. You can follow this How-to guide for installation instructions.
4.3- Features & Configuration
Click here for the RAID Setup Guide.
5- Support & Compliance
5.1- Troubleshooting & FAQ
Clear CMOS
If the system fails to power on or is unresponsive, clearing the CMOS may help. It will also restore the BIOS to factory defaults.
Begin by following the Internal Access Instructions. Make sure the system is disconnected from power, monitor, and all peripheral connections. Once the system is open, see below.
Locate the CMOS jumper indicated by the orange markings
Locate the CMOS CLR jumper
Move the jumper up by 1 pin and leave it there for 30 seconds.
Restore the jumper to the original position.
The CMOS has now been cleared. Reassemble the system and power it on. It may restart several times to reconfigure the CMOS.
If the issue has not been resolved by the reset, contact technical support.
DC Power jack pinout
The diagram below shows the pinout on the port of the computer. Looking the port, the left two pins are positive, the right two pins are negative.
Attaching Wall and DIN Rail Mounts to Helix
Remove the mounting hardware from the accessory box.
Using the included screws, install the brackets to the bottom of the system .
The mounting bracket installation is complete.
User supplied screws can be used to attach the system to the desired surface.
If DIN mounting is desired, install the DIN clips onto the brackets using the included screws.
Tighten very gently as the screws are threading into plastic.
The system is ready for Din mounting
5.2 - Regulatory
The Helix platform complies with the EN 55032:2015 standards for radiated and conducted emissions limits. The unit is compliant with EN 55035:2016 and tailored by EN 60601-1-2 for ESD, radiated immunity, magnetic immunity, electrical fast transient (EFT) AC power line, dips/interrupts and EFT signal line immunity based on performance criteria in Tables 4, 5, 6, 7, 8, and 9.
ESD Immunity Data
ESD immunity tests were performed following EN 55035 in accordance with EN 61000-4-2 and EN 60601-1-2 in accordance with EN 61000-4-2. The unit does not exhibit susceptibility to 4-kV and 6-kV contact/8-kV air and 8kV contact/15kV air discharges applied singly or repetitively and directly or indirectly. The relative humidity during unit testing was measured to be between 30% and 60%. The Helix platform was unaffected during testing.
Radiated Immunity Data
Radiated immunity tests were performed following EN 55035 in accordance with EN 61000-4-3 and EN 60601-1-2 in accordance with EN 61000-4-3. The system does not exhibit susceptibility to 10 V/m radiated electric fields, amplitude modulated at 1000 Hz, 80%, from 80 MHz to 6 GHz. Frequencies listed are samples and spots. The Helix platform was unaffected during testing. The system does not exhibit susceptibility to radiated electric fields, in accordance with EN 61000-4-3 Table 9. The Helix platform was unaffected during testing.
Magnetic Immunity Data
Magnetic immunity tests were performed following EN 60601-1-2 in accordance with EN 61000-4-8. The system does not exhibit susceptibility to radiated magnetic fields of 30 A/m at 50/60Hz. The Helix platform was unaffected during testing.
Electrical Fast Transient Immunity Data
Electrical fast transient immunity tests were performed following EN 55035 in accordance with EN 61000-4-4 and EN 60601-1-2 in accordance with EN 61000-4-4. The system does not exhibit susceptibility to 1-kV/2-kV electrical fast transients, delivered in 5-kHz bursts to power lines. “A” result = No effect on EUT. The system does not exhibit susceptibility to 0.5-kV/1-kV electrical fast transients, delivered in 5-kHz bursts to signal lines. The Helix platform was unaffected during testing.
Dips/Interrupts Immunity Data
Dips/interrupts immunity tests were performed following EN 55035 and EN 60601-1-2 in accordance with EN 61000-4-11. The system does not exhibit susceptibility. The Helix platform was unaffected during testing.
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5.3- Security Advisory
For the latest security advisories concerning OnLogic products, including vulnerability disclosures and necessary updates, please refer to our official Security Advisories page. It is recommended to regularly check this resource for critical security information. Access Security Advisories: https://www.onlogic.com/security/advisories/
5.4- Appendices
Appendix A: Errata
JP-1: Failure to Boot Without RTC Battery
Overview
SKU(s) Affected
HX500, HX600, HX610
Revision(s) Affected
F01-00003R(1-4)
Revision Resolved
F01-x0003R(5-current)
Severity
Medium
Description
The EXM501 does not initiate the power-up sequence if an RTC battery is not installed or the battery voltage is low (dead). Battery discharge primarily occurs in systems that are not connected to power. Expected battery lifetime in completely unpowered systems exceeds 3 years. Time spent in service while connected to external power does not count against the battery's expected lifetime, thus extending the time-to-failure. Customers with common use cases where power is applied at all (or nearly all) times should not expect to encounter this issue during the system's lifetime.
Workaround
None. If the system fails to boot, a user may confirm that battery voltage exceeds 2.7V and replace if needed.
Resolution
Power sequence timings were adjusted in revision F01-x0003R(5-current) to enable startup without a battery.
JP-2: Digital and Chassis Ground Not Isolated
Overview
SKU(s) Affected
HX500, HX600, HX610
Revision(s) Affected
B01-00003R(5-7)
Revision Resolved
B01-00003R8
Severity
Low
Description
Beginning in PCB rev B01-00003R5, the SIM slot connects the digital and chassis ground planes, removing isolation between the two. Under normal operating conditions, the motherboard's function should not be affected. Customers who rely on chassis ground isolation are recommended to isolate the chassis from earth ground externally.
Resolution
Steps to mitigate the issue were taken in PCB B01-00003R8 by eliminating the short. The changes are present in F01-x0003R11.
Revision History
First release of HX500/HX600 manual
7/10/2020
Included page numbers
7/22/2020
Appendix A: Errata added
8/27/2020
Added Section 4.3 Input voltage qualifications
10/20/2020
Updated mounting dimensions for HX500
Corrected block diagram to 3FF SIM slot
01/21/2021
Revision 3.0 - Extrovert 4G LTE changed to > OnLogic Cellular
02/09/2023
Last updated